Abstract: A door lock system for a vehicle includes a latch mechanism, a link mechanism and a housing. The latch mechanism is adapted to a vehicle door and latches the vehicle door to a vehicle body. The link mechanism includes an electric driving source and a plurality of lever members for selectively locking and unlocking the latch mechanism. The housing accommodates the latch mechanism and the link mechanism.

Abstract: A door lock system for a vehicle includes a) a latch mechanism which is adapted to a vehicle door and which holds the vehicle door to a vehicle body, b) an open link which is engagable and disengagable with the latch mechanism, c) a swing lever which is connected to the open link, d) an electric driving source having a gear member, and e) a rotary gear member which is arranged between the swing lever and the electric driving source so as to be meshed with the gear member of the electric driving source. The rotary gear member is directly and engagably connected to the swing lever.

Abstract: In the present semiconductor device, a chip with an LSI circuit is secured to a board 3 (with the chip flipped) so as to be level. The LSI circuit on the chip is specified to operate normally only when the chip is level. Further, the back of the chip is processed so as to give stress to the chip. The chip has a reduced thickness of 50 &mgr;m or less (alternatively 30 &mgr;m to 50 &mgr;m). Therefore, when the chip is detached from the board, it deforms and is no longer level due to the stress, which prohibits the LSI circuit from operating normally. This way, the present semiconductor device ensures that no analysis can be conducted on the LSI circuit once the chip is detached.

Abstract: A door lock system for a vehicle includes a latch mechanism, an open link, an inside lever and a cancel lever. The latch mechanism is adapted to a vehicle door and latches the vehicle door to a vehicle body. The open link is engagable and disengagable with the latch mechanism. The inside lever is adapted to an inside handle of the vehicle door and is engagable with the open link. The cancel lever is connected to the open link and is arranged between the inside lever and the open link so as to be engagable with the inside lever when the open link is disengaged from the latch mechanism.

Abstract: A semiconductor device includes, on a protective film laminated on a circuit principal part, (i) a light blocking film provided so as to cover the circuit principal part, (ii) an aluminum oxide film provided so as to completely cover the light blocking film, and (iii) a light-blocking upper wiring provided on the aluminum oxide film. An attempt to exfoliate the light blocking film or the light blocking upper wiring causes the resistance-detection-use upper wiring to break or thin, thereby resulting in an increase in the resistance of the resistance-detection-use wiring. The increase in the resistance is detected by the resistance detecting circuit part, and malfunction or inoperativeness of the circuit principal part is caused in response of detection. By so doing, the circuit principal part can be protected from analysis.

Abstract: A latex compound for dip molding, which can be used for production of a high-quality dip-molded product that is excellent in oil resistance and mechanical strength, has uniform film thickness and soft feeling to the skin and is free of pinholes, as is required for gloves etc. especially in the medical fields, and assumes no stickiness on the surface of the molded product after molding. This object is attained by a latex compound for dip molding which comprises a copolymer latex (L) obtained by emulsion polymerization of a monomer mixture and 0.05 to 5.0 parts by weight of a bubble breaker (A) consisting of a C8-22 fatty acid or a salt thereof, and if necessary, 0.1 to 5.0 parts by weight of a di C5-12 alkyl sulfosuccinate salt (B) and/or 0.5 to 10.0 parts by weight of a C13-20 alkyl benzene sulfonate (C) per 100 parts by weight of the monomer mixture.

Abstract: A semiconductor device in accordance with the present invention includes a semiconductor element chip pressed and secured on a distortion die-pad so that the semiconductor element chip, sealed inside a package, is held in a predetermined distorted state. The predetermined distorted state is preferably downward or upward warping. The semiconductor element chip operates normally in the distorted state, and does not operate normally when the semiconductor element chip is separated from the semiconductor device, and thereby released from the distortion and laid alone. This ensures that the semiconductor element chip is protected from circuit analysis.

Abstract: A door lock system for a vehicle includes a latch mechanism, a link mechanism and a housing. The latch mechanism is adapted to a vehicle door and latches the vehicle door to a vehicle body. The link mechanism includes an electric driving source and a plurality of lever members for selectively locking and unlocking the latch mechanism. The housing accommodates the latch mechanism and the link mechanism.

Abstract: A door lock system for a vehicle includes a) a latch mechanism which is adapted to a vehicle door and which holds the vehicle door to a vehicle body, b) an open link which is engagable and disengagable with the latch mechanism, c) a swing lever which is connected to the open link, d) an electric driving source having a gear member, and e) a rotary gear member which is arranged between the swing lever and the electric driving source so as to be meshed with the gear member of the electric driving source. The rotary gear member is directly and engagably connected to the swing lever.

Abstract: A door lock system for a vehicle includes a latch mechanism, an open link, an inside lever and a cancel lever. The latch mechanism is adapted to a vehicle door and latches the vehicle door to a vehicle body. The open link is engagable and disengagable with the latch mechanism. The inside lever is adapted to an inside handle of the vehicle door and is engagable with the open link. The cancel lever is connected to the open link and is arranged between the inside lever and the open link so as to be engagable with the inside lever when the open link is disengaged from the latch mechanism.

Abstract: In the present semiconductor device, a chip with an LSI circuit is secured to a board 3 (with the chip flipped) so as to be level. The LSI circuit on the chip is specified to operate normally only when the chip is level. Further, the back of the chip is processed so as to give stress to the chip. The chip has a reduced thickness of 50 &mgr;m or less (alternatively 30 &mgr;m to 50 &mgr;m). Therefore, when the chip is detached from the board, it deforms and is no longer level due to the stress, which prohibits the LSI circuit from operating normally. This way, the present semiconductor device ensures that no analysis can be conducted on the LSI circuit once the chip is detached.

Abstract: A semiconductor chip has a nonvolatile memory formed on the upper surface side of a semiconductor substrate. The chip includes at least one recess portion formed in the lower surface of the semiconductor substrate. The recess portion is located in a region corresponding to the nonvolatile memory. A method of manufacturing the semiconductor chip is also disclosed.

Abstract: A positive resist composition comprising a poly(p-hydroxystyrene) as matrix resin which is synthesized by an anionic polymerization method and has a weight average molecular weight of from 8,000 to 20,000, bis(p-t-butoxycarbonylmethyl)thymolphthalein as dissolution inhibitor, bis(p-t-butylphenyl)iodonium triflate as acid generator; a compound which contains one amino group and one carboxyl group to function as acid deactivator and propylene glycol monomethyl ether acetate as organic solvent.

Abstract: A resist material comprises a polysiloxane obtained by hydrolysis and condensation with dehydration of one or more alkoxysilanes having an oxirane ring, or of a mixture of the alkoxysilane(s) having an oxirane ring and one or more alkoxysilanes having no oxirane ring, and an acid generator. The resist material may contain one or more of a spectral sensitizer, an organic polymer having a hydroxyl group or an epoxy compound. Resist patterns are formed by coating an organic polymer on a substrate and then the resist material on the film of the organic polymer to form a two layer resist having a bottom layer of the organic polymer and top layer of the resist material, prebaking, imagewise exposing high radiation, postbaking, and developing the resist with alkaline solutions to remove an unexposed portion of the top layer, and dry etching the bottom layer using the relic of the resist material as a mask. the temperature of the post baking is preferably lower than that of the prebaking.

Abstract: (S)-1phenyl-1,3-propanediol or a derivative thereof having high optical purity can be produced simply in high yield, by contacting 1-phenylpropan-3-ol-1-one with a culture of microorganisms, microorganism cells isolated from the culture, or a product obtained by processing the microorganism cells.

Abstract: A resist composition comprising a compound having an active hydrogen and an alkali-soluble siloxane polymer containing in the molecules thereof at least one unit selected from a unit represented by formula (I) and a unit represented by formula (II) ##STR1## wherein the X's are the same or different and each represents one member selected from the group consisting of hydrogen, ##STR2## (where R represents hydrogen, a hydrocarbon group, or a substituted hydrocarbon group); and a carboxyl group;R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, and R.sub.6 are the same or different and each represents one member selected from the group consisting of hydrogen, a hydroxyl group, a substituted or unsubstituted aliphatic hydrocarbon group, and a substituted or unsubstituted aromatic hydrocarbon group, provided that at least one of R.sub.1 to R.sub.6 is a hydroxyl group; andl, m, n, and p each is 0 or a positive integer, provided that l and m are not 0 at the same time.

Abstract: A positive resists material for high energy-sensitive positive resists which can be developed in aqueous alkali solution, said material comprising (A) a polyhydroxystyrene resin wherein some hydroxyl groups are substituted by t-butoxycarbonyloxy groups, (B) a solution blocking agent, and (C) an onium salt, and being characterized in that said solution blocking agent contains at least one t-butoxycarbonyloxy group per molecule, said onium salt is bis(p-t-butylphenyl) iodinium trifluormethylsulfonate represented by the following formula (1): ##STR1## and the weight proportions of (A), (B), (C) are given by the relations: 0.07.ltoreq.B-.ltoreq.0.40, 0.005.ltoreq.C.ltoreq.0.15, 0.55.ltoreq.A, A+B+C=1. As the resist has low absorption at the exposure wavelength of a KrF exima laser, a fine pattern having vertical walls is easily formed.

Abstract: Friction facings comprising a non-woven fibrous lamina reinforced with stitching, and impregnated with a curable binder have improved resistance to delamination.

Abstract: A friction member is a clutch facing, a brake pad, or a brake lining which comprises a phenolic fiber, a plated organic fiber, and/or mixed fiber thereof, which may or may not comprise the other fibers such as nonorganic fibers, as based material of the aforementioned friction member, wherein various difficulties of asbestos are improved.

Abstract: A clutch assembly has a clutch cover secured to a flywheel, a diaphragm spring positioned outside the clutch cover, and an annular pressure plate positioned inside the clutch cover. The diaphragm spring is pivotally mounted on the clutch cover by rivets disposed in several openings formed in the diaphragm spring. The pressure plate is connected with the clutch cover by a suitable number of flexible drive straps which are disposed between the clutch cover and the pressure plate and extend chordally across the pressure plate. One end of each drive strap is secured to the pressure plate by a rivet. The other end of each drive strap is secured to the clutch cover by a rivet which is positioned radially inwardly of the inner periphery of the pressure plate and is aligned with an opening formed in the diaphragm spring.