Patents by Inventor Hiroshi DAI

Hiroshi DAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11081748
    Abstract: Packaging material for a power storage device, comprising at least a substrate layer, an adhesive layer, a metal foil layer and a sealant layer wherein the sealant layer contains an inorganic filler and an occupying ratio of the inorganic filler relative to the total thickness of the sealant layer is 5 to 50%, and also to a packaging material for a power storage device, comprising a substrate layer, a barrier layer and also to a packaging material for power storage device, which comprises a substrate layer, a barrier layer and a sealant layer arranged in this order wherein the barrier layer is made of a metal foil and has a corrosion inhibition treatment layer at least at a side of the sealant layer, and the sealant layer is formed directly on the corrosion inhibition layer, has a thickness of 5 to 30 ?m, and contains a high melting point material.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: August 3, 2021
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Hiroshi Dai, Junya Imamoto, Yu Ogihara, Masayoshi Suzuta
  • Patent number: 10217975
    Abstract: A packaging material for a power storage device, the packaging material including, in order from a first surface of a metal foil, a first corrosion protection layer and a coating layer, and, in order from a second surface of the metal foil, a second corrosion protection layer, an adhesive layer, and a sealant layer. In the packaging material, the coating layer contains at least one selected from a group consisting of fluorine resins and amorphous polyester resins.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: February 26, 2019
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Hiroshi Dai, Yuki Muroi
  • Publication number: 20180102514
    Abstract: Packaging material for a power storage device, comprising at least a substrate layer, an adhesive layer, a metal foil layer and a sealant layer wherein the sealant layer contains an inorganic filler and an occupying ratio of the inorganic filler relative to the total thickness of the sealant layer is 5 to 50%, and also to a packaging material for a power storage device, comprising a substrate layer, a barrier layer and also to a packaging material for power storage device, which comprises a substrate layer, a barrier layer and a sealant layer arranged in this order wherein the barrier layer is made of a metal foil and has a corrosion inhibition treatment layer at least at a side of the sealant layer, and the sealant layer is formed directly on the corrosion inhibition layer, has a thickness of 5 to 30 ?m, and contains a high melting point material.
    Type: Application
    Filed: December 7, 2017
    Publication date: April 12, 2018
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Hiroshi Dai, Junya Imamoto, Yu Ogihara, Masayoshi Suzuta
  • Publication number: 20170047561
    Abstract: A packaging material for a power storage device, the packaging material including, in order from a first surface of a metal foil, a first corrosion protection layer and a coating layer, and, in order from a second surface of the metal foil, a second corrosion protection layer, an adhesive layer, and a sealant layer. In the packaging material, the coating layer contains at least one selected from a group consisting of fluorine resins and amorphous polyester resins.
    Type: Application
    Filed: October 27, 2016
    Publication date: February 16, 2017
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Hiroshi DAI, Yuki MUROI