Patents by Inventor Hiroshi Dougauchi
Hiroshi Dougauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8580482Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which includes at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000.Type: GrantFiled: December 28, 2011Date of Patent: November 12, 2013Assignee: JSR CorporationInventors: Takashi Chiba, Toru Kimura, Tomohiro Utaka, Hiroki Nakagawa, Hirokazu Sakakibara, Hiroshi Dougauchi
-
Patent number: 8435718Abstract: An upper layer-forming composition includes a resin, and a solvent. The resin is dissolvable in a developer for a photoresist film which is to be covered by the upper layer-forming composition to form a pattern by exposure to radiation. The solvent dissolves the resin in the solvent. The solvent includes a compound shown by a formula (1). Each of R1 and R2 independently represents a hydrocarbon group having 1 to 8 carbon atoms or a halogenated hydrocarbon group.Type: GrantFiled: October 13, 2011Date of Patent: May 7, 2013Assignee: JSR CorporationInventors: Atsushi Nakamura, Hiroki Nakagawa, Hiromitsu Nakashima, Takayuki Tsuji, Hiroshi Dougauchi, Daita Kouno, Yukio Nishimura
-
Publication number: 20120101205Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which includes at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000.Type: ApplicationFiled: December 28, 2011Publication date: April 26, 2012Applicant: JSR CorporationInventors: Takashi CHIBA, Toru KIMURA, Tomohiro UTAKA, Hiroki NAKAGAWA, Hirokazu SAKAKIBARA, Hiroshi DOUGAUCHI
-
Publication number: 20120028198Abstract: An upper layer-forming composition includes a resin, and a solvent. The resin is dissolvable in a developer for a photoresist film which is to be covered by the upper layer-forming composition to form a pattern by exposure to radiation. The solvent dissolves the resin in the solvent. The solvent includes a compound shown by a formula (1). Each of R1 and R2 independently represents a hydrocarbon group having 1 to 8 carbon atoms or a halogenated hydrocarbon group.Type: ApplicationFiled: October 13, 2011Publication date: February 2, 2012Applicant: JSR CorporationInventors: Atsushi NAKAMURA, Hiroki Nakagawa, Hiromitsu Nakashima, Takayuki Tsuji, Hiroshi Dougauchi, Daita Kouno, Yukio Nishimura
-
Patent number: 8076053Abstract: An upper layer-forming composition formed on a photoresist while causing almost no intermixing with the photoresist film and a photoresist patterning method are provided. The upper layer-forming composition is stably maintained without being eluted in a medium such as water during liquid immersion lithography and is easily dissolved in an alkaline developer. The upper layer-forming composition covers a photoresist film for forming a pattern by exposure to radiation. The composition comprises a resin dissolvable in a developer for the photoresist film and a solvent in which the resin is dissolved. The solvent has a viscosity of less than 5.2×10?3 Pa·s at 20° C. In addition, the solvent does not cause intermixing of the photoresist film and the upper layer-forming composition. The solvent contains an ether or a hydrocarbon.Type: GrantFiled: October 25, 2006Date of Patent: December 13, 2011Assignee: JSR CorporationInventors: Atsushi Nakamura, Hiroki Nakagawa, Hiromitsu Nakashima, Takayuki Tsuji, Hiroshi Dougauchi, Daita Kouno, Yukio Nishimura
-
Publication number: 20100266953Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which has a recurring unit (I) having a carboxyl group, a recurring unit (II) having a sulfo group and a recurring unit obtained by copolymerizing fluoroalkyl(meth)acrylates having 1 to 20 carbon atoms in a fluoroalkyl group thereof other than a recurring unit having a side chain that includes an alcoholic hydroxyl group having a fluoroalkyl group at least in an ?-position thereof, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000.Type: ApplicationFiled: July 7, 2010Publication date: October 21, 2010Applicant: JSR CorporationInventors: Takashi Chiba, Toru Kimura, Tomohiro Utaka, Hiroki Nakagawa, Hirokazu Sakakibara, Hiroshi Dougauchi
-
Patent number: 7781142Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which comprises at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000, wherein at least one of R1 and R2 is a fluoroalkyl group having 1 to 4 carbon atoms and R3 in the formula (2) represents a fluoroalkyl group having 1 to 20 carbon atoms.Type: GrantFiled: September 28, 2005Date of Patent: August 24, 2010Assignee: JSR CorporationInventors: Takashi Chiba, Toru Kimura, Tomohiro Utaka, Hiroki Nakagawa, Hirokazu Sakakibara, Hiroshi Dougauchi
-
Publication number: 20100003615Abstract: An upper layer-forming composition formed on a photoresist while causing almost no intermixing with the photoresist film and a photoresist patterning method are provided. The upper layer-forming composition is stably maintained without being eluted in a medium such as water during liquid immersion lithography and is easily dissolved in an alkaline developer. The upper layer-forming composition covers a photoresist film for forming a pattern by exposure to radiation. The composition comprises a resin dissolvable in a developer for the photoresist film and a solvent in which the resin is dissolved. The solvent has a viscosity of less than 5.2×10?3 Pa·s at 20° C. In addition, the solvent does not cause intermixing of the photoresist film and the upper layer-forming composition. The solvent contains an ether or a hydrocarbon.Type: ApplicationFiled: October 25, 2006Publication date: January 7, 2010Applicant: JSR CORPORATIONInventors: Atsushi Nakamura, Hiroki Makagawa, Hiromitsu Nakashima, Takayuki Tsuji, Hiroshi Dougauchi, Daita Kouno, Yukio Nishimura
-
Publication number: 20080038661Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which comprises at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000, wherein at least one of R1 and R2 is a fluoroalkyl group having 1 to 4 carbon atoms and R3 in the formula (2) represents a fluoroalkyl group having 1 to 20 carbon atoms.Type: ApplicationFiled: September 28, 2005Publication date: February 14, 2008Inventors: Takashi Chiba, Toru Kimura, Tomohiro Utaka, Hiroki Nakagawa, Hirokazu Sakakibara, Hiroshi Dougauchi