Patents by Inventor Hiroshi Fujii

Hiroshi Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150352477
    Abstract: A mist separator for separating liquid mist from a gas containing the liquid mist includes a rotor fixed to a hollow rotary shaft and includes main rotating vanes; and a stator axially juxtaposed to the rotor. The stator includes main fixed vanes located downstream of the main rotating vanes on a flow path for the gas; and a cover that covers outer peripheries of the main fixed vanes and the main rotating vanes. The main fixed vanes are formed so as to cause the gas to flow radially inward from the outer peripheries thereof while a flow rate of the gas is decreased, and the cover is provided with a cover discharge port to discharge a recovery liquid which is a collection of the liquid mist to the outside of the cover.
    Type: Application
    Filed: August 20, 2015
    Publication date: December 10, 2015
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Hiroshi FUJII, Hirohito SHIMIZU, Ryo YASUDA, Yuji YAMAZAKI, Hidenori ARISAWA, Masahide KAZARI, Kazuo TANAKA
  • Publication number: 20150294870
    Abstract: In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads.
    Type: Application
    Filed: June 23, 2015
    Publication date: October 15, 2015
    Inventors: Atsushi FUJISAWA, Hiroshi FUJII
  • Publication number: 20150245021
    Abstract: Setting a reference pixel signal from a decoded pixel signal in intra-prediction in which a prediction signal is generated in the same frame, acquiring prediction mode identification information that identifies an intra-prediction mode, generating a prediction signal based on the reference pixel signal and the prediction mode identification information, making a determination regarding correction of the prediction signal using a reference pixel having a shorter distance from a pixel that is a prediction target in the intra-prediction mode identified by the prediction mode identification information, and correcting the generated prediction signal according to a result of the determination are included in order to provide an image encoding method and an image decoding method capable of improving subjective image quality and coding efficiency using a closer decoded pixel in an intra-prediction process.
    Type: Application
    Filed: September 26, 2013
    Publication date: August 27, 2015
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Shohei Matsuo, Masaaki Matsumura, Hiroshi Fujii, Seishi Takamura, Atsushi Shimizu
  • Patent number: 9099484
    Abstract: A method of manufacturing a semiconductor device, includes providing a lead frame including a frame portion, including a through hole penetrating the lead frame, a device forming portion surrounded by the frame portion in plan view, including a die pad, and a semiconductor chip mounted on the die pad; after the providing step, sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and after the sealing step, removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: August 4, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroshi Fujii, Shigeki Tanaka, Kazuaki Yoshida
  • Patent number: 9087850
    Abstract: In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: July 21, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Atsushi Fujisawa, Hiroshi Fujii
  • Publication number: 20150179480
    Abstract: A method of manufacturing a semiconductor device, includes providing a lead frame including a frame portion, including a through hole penetrating the lead frame, a device forming portion surrounded by the frame portion in plan view, including a die pad, and a semiconductor chip mounted on the die pad; after the providing step, sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and after the sealing step, removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole.
    Type: Application
    Filed: February 27, 2015
    Publication date: June 25, 2015
    Inventors: Hiroshi Fujii, Shigeki Tanaka, Kazuaki Yoshida
  • Patent number: 8999761
    Abstract: To stably remove a resin body formed in a supply route of a resin in a sealing step. A leadframe has, in a sub-runner portion thereof, a sub-through-hole. The sub-through-hole has, along a first direction along which the sub-runner portion extends, a first portion located on the side of a main-runner portion and a second portion located on the side of a gate portion relative to the first portion. In a plan view, an opening width of the sub-through-hole in the first direction is greater than that of the sub-through-hole in a second direction perpendicular to the first direction. In a plan view, an opening width of the sub-through-hole in the second direction gradually decreases from the first portion to an end portion of the second portion on the side of the gate portion.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: April 7, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroshi Fujii, Shigeki Tanaka, Kazuaki Yoshida
  • Patent number: 8950453
    Abstract: A pneumatic tire is provided with a large number of holes that are arranged in the tire's circumferential direction. These holes are provided in land portions that are provided in both shoulder sections of a tread. The land portions can have different pitch lengths. Each of the holes has formed there inside a projection having an upper end with a flat surface or a convex surface. The distance between the outer wall of the projection at the upper end thereof and the inner wall of the hole is set in the range from 1 to 5 mm. The upper end of the projection is located at a position below the opening of the hole.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: February 10, 2015
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Atsushi Tanno, Hiroshi Fujii
  • Publication number: 20140376154
    Abstract: A metallized film capacitor includes first and second metal electrodes, a dielectric film disposed between the first and second metal electrodes, and first and second external electrodes which are connected to the first and second metal electrodes, respectively. At least one of the first metal electrode and the second metal electrode comprises magnesium. The magnesium is distributed unevenly in the at least one of the first metal electrode and the second metal electrode.
    Type: Application
    Filed: September 11, 2014
    Publication date: December 25, 2014
    Inventors: Hiroki TAKEOKA, Hiroshi KUBOTA, Yukikazu OHCHI, Hiroshi FUJII, Yukihiro SHIMASAKI
  • Publication number: 20140349447
    Abstract: To stably remove a resin body formed in a supply route of a resin in a sealing step. A leadframe has, in a sub-runner portion thereof, a sub-through-hole. The sub-through-hole has, along a first direction along which the sub-runner portion extends, a first portion located on the side of a main-runner portion and a second portion located on the side of a gate portion relative to the first portion. In a plan view, an opening width of the sub-through-hole in the first direction is greater than that of the sub-through-hole in a second direction perpendicular to the first direction. In a plan view, an opening width of the sub-through-hole in the second direction gradually decreases from the first portion to an end portion of the second portion on the side of the gate portion.
    Type: Application
    Filed: May 20, 2014
    Publication date: November 27, 2014
    Applicant: Renesas Electronics Corporation
    Inventors: Hiroshi Fujii, Shigeki Tanaka, Kazuaki Yoshida
  • Publication number: 20140332719
    Abstract: The present invention relates to a method for producing useful metabolites such as shikimic acid from filamentous fungus. The useful metabolites can be produced by a production method involving a step of inhibiting the growth of the filamentous fungus, specifically by applying a stimulus of light having a center wavelength shorter than 570 nm to the filamentous fungus, to increase the content of the useful metabolite in a hypha of the filamentous fungus.
    Type: Application
    Filed: August 6, 2012
    Publication date: November 13, 2014
    Applicant: Shinshu University
    Inventors: Masanobu Kojima, Hiroshi Fujii
  • Patent number: 8861177
    Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: October 14, 2014
    Assignee: Panasonic Corporation
    Inventors: Hiroki Takeoka, Hiroshi Kubota, Yukikazu Ohchi, Hiroshi Fujii, Yukihiro Shimasaki
  • Patent number: 8788735
    Abstract: An interrupt control unit provides controls on an interrupt from an accelerator to a CPU based on a packet transmitted to or received from a controlled object. The interrupt control unit includes: a storage part for storing therein an interrupt control timing table in which a condition of switching a mode of the interrupt control is described; and an interrupt control mode switching part for switching the mode of the interrupt control to the CPU between a permission mode and a mask mode, based on the interrupt control timing table in the storage part.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: July 22, 2014
    Assignee: Hitachi Industrial Equipment Systems Co., Ltd.
    Inventors: Tatsuya Maruyama, Tsutomu Yamada, Norihisa Yanagihara, Shinji Yonemoto, Takashi Iwaki, Hiroshi Fujii
  • Patent number: 8697601
    Abstract: A rewritable recording material can be provided which contains at least one kind of phenolic compounds represented by formula (I) and which is capable of stably repeating coloring and discoloring for a long period of time as well as exerting superior storage properties such as heat resistance and moisture and heat resistance of the colored image and light resistance of the background. Also provided are a composition for forming a rewritable color-forming layer which is capable of forming a color-forming layer of the recording material, and a composition of a color-developing agent for a rewritable recording material.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: April 15, 2014
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Satoshi Kodama, Hiroshi Fujii, Tadashi Kawakami
  • Publication number: 20140036405
    Abstract: A metalized film capacitor includes metalized films, each of which is formed of an insulating film made of dielectric, and a vapor deposited metal electrode formed on an upper surface of the insulating film. An end of the vapor deposited metal electrode extends together with an end of the insulating film, and both the ends are connected to an electrode terminal. The vapor deposited metal electrode of the metalized film includes a center region and a low resistance section that is made of Al—Zn—Mg alloy. The low resistance section is disposed at an end of the electrode and is thicker than the center region. This metalized film capacitor has high humidity resistance.
    Type: Application
    Filed: May 29, 2012
    Publication date: February 6, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Hiroki Takeoka, Yukikazu Ohchi, Ryo Majima, Yukihiro Shimasaki, Hiroshi Fujii, Ryosuke Kamiura, Hiroshi Kubota, Yasuhiro Hiraki
  • Publication number: 20140009865
    Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.
    Type: Application
    Filed: September 10, 2013
    Publication date: January 9, 2014
    Applicant: Panasonic Corporation
    Inventors: Hiroki TAKEOKA, Hiroshi KUBOTA, Yukikazu OHCHI, Hiroshi FUJII, Yukihiro SHIMASAKI
  • Patent number: 8559161
    Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: October 15, 2013
    Assignee: Panasonic Corporation
    Inventors: Hiroki Takeoka, Hiroshi Kubota, Yukikazu Ohchi, Hiroshi Fujii, Yukihiro Shimasaki
  • Publication number: 20130263991
    Abstract: A pneumatic tire is provided including a plurality of protrusions and a plurality of recesses of at least one tire side portion. A region including the recesses is provided in the outermost side in a tire radial direction. The protrusions are formed as convexities having a longitudinal shape in a predetermined direction. A region including the protrusions is provided inward in the tire radial direction of the region including the recesses.
    Type: Application
    Filed: September 28, 2012
    Publication date: October 10, 2013
    Applicant: The Yokohama Rubber Co., LTD.
    Inventors: Hiroshi Fujii, Masatoshi Kuwajima, Masataka Koishi
  • Patent number: 8546299
    Abstract: Provided is a recording material with a superior heat resistance and having a low content of a dihydroxydiphenylsulfone derivative, and a color-developing composition for producing the recording material. With the use of this color-developing composition, a recording material with a superior heat resistance at the background part can be provided and the content of a dihydroxydiphenylsulfone derivative, such as 4,4?-dihydroxydiphenylsulfone, in the color-developing composition can be reduced to 2% by mass or less, or further to 1% by mass or less.
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: October 1, 2013
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Hiroshi Fujii, Tadashi Kawakami, Satoshi Kodama, Kazumi Jyujyo
  • Publication number: 20130244873
    Abstract: A rewritable recording material can be provided which contains at least one kind of phenolic compounds represented by formula (I) and which is capable of stably repeating coloring and discoloring for a long period of time as well as exerting superior storage properties such as heat resistance and moisture and heat resistance of the colored image and light resistance of the background. Also provided are a composition for forming a rewritable color-forming layer which is capable of forming a color-forming layer of the recording material, and a composition of a color-developing agent for a rewritable recording material.
    Type: Application
    Filed: May 10, 2013
    Publication date: September 19, 2013
    Applicant: Nippon Soda Co., Ltd.
    Inventors: Satoshi Kodama, Hiroshi Fujii, Tadashi Kawakami