Patents by Inventor Hiroshi Fukui

Hiroshi Fukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250033849
    Abstract: A metal container for an organotin compound in which the metal container has a diamond-like carbon layer on an inner surface. The diamond-like carbon layer is a fluorine-containing diamond-like carbon layer or at least two diamond-like carbon layers having hydrogen atom contents different from each other, and the diamond-like carbon layer has a thickness of 50 to 15,000 nm.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 30, 2025
    Inventor: Hiroshi FUKUI
  • Patent number: 12208870
    Abstract: An underwater vehicle system includes: a first underwater vehicle configured to perform work in water while moving in a predetermined proceeding direction; and a second underwater vehicle configured to replace the first underwater vehicle and perform work in water. When the second underwater vehicle replaces the first underwater vehicle, the second underwater vehicle approaches the first underwater vehicle based on a signal transmitted from the first underwater vehicle.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: January 28, 2025
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Minehiko Mukaida, Hiroshi Sakaue, Noriyuki Okaya, Koichi Fukui, Yuki Kaga, Fumitaka Tachinami
  • Patent number: 12159907
    Abstract: Provided is a ?-Ga2O3 based semiconductor film which is a semiconductor film in a circular shape having a crystal having a corundum-type crystal structure composed of ?-Ga2O3 or an ?-Ga2O3 solid solution as a main phase. The maximum value ?max and the minimum value ?min for off-angles at the center point X and four outer circumferential points A, B, C, and D of a surface of the semiconductor film satisfy the relationship of ?max-?min?0.30°. The off-angle is defined as an inclination angle ? of a crystal axis oriented in the substantially normal direction of the semiconductor film with respect to the film surface normal of the semiconductor film.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: December 3, 2024
    Assignee: NGK INSULATORS, LTD.
    Inventors: Hiroshi Fukui, Morimichi Watanabe, Jun Yoshikawa
  • Patent number: 12122935
    Abstract: Provided is a curable organopolysiloxane composition for forming a film capable of uniform and thin film formation, and a method of manufacturing an organopolysiloxane cured film using the same. The curable organopolysiloxane composition for forming a film, comprises: a curing reactive organopolysiloxane, a curing agent, and one or more type of organic solvent selected from (D1) organic polar solvents, (D2) low molecular weight siloxane solvents, and (D3) halogen solvents, or a mixed solvent thereof. The viscosity of the entire composition measured at a shear rate of 0.1 (s?1) at 25° C. is 100,000 mPa·s or less, the viscosity of the entire composition measured at a shear rate of 10.0 (s?1) is within a range of 5 to 10,000 mPa·s, and a thixotropic ratio thereof is 25.0 or less.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: October 22, 2024
    Assignees: Dow Toray Co., Ltd., Dow Silicones Corporation
    Inventors: Hiroshi Fukui, Takeaki Tsuda, Hua Ren
  • Patent number: 12122880
    Abstract: A curable organopolysiloxane composition is provided. The composition has relatively low viscosity before curing, can be easily processed into a film shape, and has excellent mechanical strength (e.g., tensile strength, tear strength, elongation, and the like) when, e.g., used as a dielectric layer in a transducer. Other applications are also provided. The composition comprises: (A1, A2) a combination of chain organopolysiloxanes having an alkenyl group only on an end of a molecular chain, and a degree of polymerization within a range of 50 to 550 and a range of 600 to 1000; (B) hydrophobically treated reinforcing silica; (C) a siloxane resin containing an alkenyl group; (D) an organohydrogenpolysiloxane; and (E) a catalyst. The mass ratio of components (A1)/(A2) is within a range of 0.45 to 1.30, and the sum of component (B) and component (C) is within a range of 10 to 25 mass % of the entire composition.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: October 22, 2024
    Assignee: Dow Toray Co., Ltd.
    Inventors: Hiroshi Fukui, Kyoko Toyama
  • Publication number: 20240336639
    Abstract: A bonding structure used for forming a sealed space (for example, a container) for containing or transferring an organotin compound, wherein the bonding structure is a structure in which a first member is connected with a second member via a gasket or an O-ring, and the gasket or the O-ring is formed with a fluororesin derived from monomers of at least tetrafluoroethylene and perfluoromethyl vinyl ether.
    Type: Application
    Filed: January 3, 2024
    Publication date: October 10, 2024
    Applicants: Mitsubishi Chemical Corporation, GELEST, Inc.
    Inventors: Hiroshi FUKUI, Hisatoshi UEHARA
  • Publication number: 20240320957
    Abstract: An information processing apparatus according to one example embodiment includes: at least one memory configured to store instructions; and at least one processor configured to execute the instructions to: extract, from a feature map, a first feature map pertaining to a first feature, a second feature map pertaining to a second feature, and a third feature map pertaining to a third feature; determine a correspondence relationship indicating a plurality of second components associated to each first component by shifting a grid pattern indicating a plurality of the second components associated to one first component on the second feature map, based on a position of each first component, and reflect a correlation between the first feature and the second feature being calculated from the correspondence relationship, in the third feature map.
    Type: Application
    Filed: January 13, 2022
    Publication date: September 26, 2024
    Applicant: NEC Corporation
    Inventor: Hiroshi Fukui
  • Publication number: 20240301144
    Abstract: An object of this disclosure is to provide a laminate body where an organopolysiloxane cured material film which is a dielectric layer is laminated onto an electrode layer or base material layer, in which the adhesion of the interface of the cured material film is improved and the problems of peeling and defects caused by lack of adhesive strength and insufficient tracking do not readily occur, as well as a use thereof and a manufacturing method. A curable organopolysiloxane composition for a transducer, containing at least: (A) a polysiloxane having a C?C type curable reactive group; (B1) a side chain SiH type organohydrogenpolysiloxane; (B2) a terminated SiH type organohydrogenpolysiloxane; (C) a hydrosilylation reaction catalyst; (D) a reinforcing filler; and (E) an adhesion imparting agent. A value of: px1={HB1/HB2}/{(HB1+HB2)/Vi} is within a range of 0.1 to 6.0.
    Type: Application
    Filed: July 5, 2022
    Publication date: September 12, 2024
    Inventor: Hiroshi FUKUI
  • Publication number: 20240280176
    Abstract: A bonding structure used for forming a sealed space (for example, a container) for containing or transferring an organotin compound, wherein the bonding structure is a structure in which a first metal member (for example, a lid of the container) is connected to a second metal member (for example, a container body of the container) via a metal gasket or a metal O-ring, and the metal gasket or the metal O-ring has a surface having a Vickers hardness set to be not less than lower than a Vickers hardness of a surface of a portion of the metal member, the portion being contacted with the metal gasket or the metal O-ring.
    Type: Application
    Filed: January 11, 2024
    Publication date: August 22, 2024
    Applicants: Mitsubishi Chemical Corporation, GELEST, Inc.
    Inventors: Hisatoshi UEHARA, Hiroshi FUKUI
  • Publication number: 20240270764
    Abstract: A method for purifying a tin compound, including: making an inert gas pass through in, or on a surface of, a liquid containing a tin compound represented by a chemical formula RSnX3, where R represents a hydrocarbon group having 1 to 30 carbon atoms optionally substituted with a halogen atom, and X represents a hydrolysable substituent, to perform stripping, before or after a distillation step of the tin compound.
    Type: Application
    Filed: December 7, 2023
    Publication date: August 15, 2024
    Applicants: Mitsubishi Chemical Corporation, GELEST, Inc.
    Inventor: Hiroshi FUKUI
  • Patent number: 12037481
    Abstract: Provided is a curable organopolysiloxane composition for forming a film, which has low viscosity before curing, has excellent mechanical strength and dielectric breakdown strength after curing, and can provide a uniform and thin organopolysiloxane cured film. The curable organopolysiloxane composition comprises: a curing reactive organopolysiloxane, a curing agent, (D1) reinforcing fine particles having a BET specific surface area exceeding 100 m2/g, which have been surface treated with an organic silicon compound, and (D2) reinforcing fine particles having a BET specific surface area within a range of 10 to 100 m2/g, which have been surface treated with an organic silicon compound. The mass ratio of components (D1) and (D2) is within a range of 50:50 to 99:1, and the sum of components (D1) and (D2) is within a range of 10 to 40 mass %. A method of manufacturing an organopolysiloxane cured film using the curable organopolysiloxane composition is also provided.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: July 16, 2024
    Assignee: DOW TORAY CO., LTD.
    Inventors: Hiroshi Fukui, Kyoko Toyama, Norihisa Kishimoto, Hiroshi Ueki
  • Patent number: 11981814
    Abstract: A silicone elastomer cured product having radical reactivity obtained by curing a composition is disclosed. The composition comprises (A) a chain organopolysiloxane having a curing reactive group, and optionally (B) an organohydrogen polysiloxane, (C1) a curing agent, and (D) an organopolysiloxane resin. The surface of the cured product has radical reactivity with, for example, an adhesive, and is easily removable along with, for example, adhesive tape after use as a protective material. In general, the cured product has excellent heat resistance and flexibility and exhibits good adhesion and conformity to a substrate so as not to separate from a substrate even when the cured product is cut together with the substrate while remaining easily removable from the substrate when desired. A protective material for an electronic component made of the cured product is also disclosed.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: May 14, 2024
    Assignee: DOW TORAY CO., LTD.
    Inventors: Hiroshi Fukui, Kyoko Toyama, Masayasu Akasaka
  • Patent number: 11942520
    Abstract: Provided is a semiconductor film having a corundum-type crystal structure composed of ?-Ga2O3 or an ?-Ga2O3 solid solution and the crystal defect density on at least one surface of the semiconductor film is 1.0×106/cm2 or less.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: March 26, 2024
    Assignee: NGK INSULATORS, LTD.
    Inventors: Morimichi Watanabe, Hiroshi Fukui
  • Publication number: 20240072127
    Abstract: An excellent method of manufacturing a patterned substrate which is capable of easily patterning an insulation layer to provide a patterned substrate even when a difficult-to-etch material is used for the insulation layer, a patterned substrate obtained thereby, and a patterned substrate intermediate thereof are provided. The method of manufacturing a patterned substrate with the insulation layer and an electrode layer stacked in this order on a substrate comprising: forming an organic resist material layer; irradiating the organic resist material layer with radiation or an electromagnetic wave of a wavelength of 10 to 780 nm and developing the organic resist material layer to form a first patterning layer; and removing the first patterning layer.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Applicant: Mitsubishi Chemical Corporation
    Inventor: Hiroshi FUKUI
  • Patent number: 11858250
    Abstract: This disclosure provides an electronic device member that is superior in ease of handling, without any loss of flatness or performance (e.g. flexibility and dielectric properties) despite being a dielectric sheet having a dielectric polymer cured material that is physically fragile. Disclosed herein is a layered body including (L1) a single layer or multiple layers of a high dielectric sheet that includes a polymer cured material having a dielectric functional group, and at least one (L2) pressure-sensitive adhesive layer, and in general further having (L3) an electrode layer and/or (L4) a non-silicone thermoplastic resin layer, and uses thereof.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: January 2, 2024
    Assignee: DOW TORAY CO., LTD.
    Inventors: Hiroshi Fukui, Takeaki Tsuda
  • Publication number: 20230399470
    Abstract: A curable fluorosilicone composition is provided. The curable fluorosilicone composition comprises: (A) an organopolysiloxane having at least two alkenyl groups and at least one fluoroalkyl group having 3 to 12 carbon atoms in a molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms and at least one fluoroalkyl group having 3 to 12 carbon atoms in a molecule; (C) a platinum group metal-based catalyst for hydrosilylation reaction; and (D) a silylated acetylene inhibitor. The platinum group metals in component (C) relative to the composition are 0.1 to 100 ppm, and the molar ratio of the aliphatic unsaturated bonds in component (D) relative to the platinum group metals in component (C) is 100 to 2,000. The curable fluorosilicone composition has favorable curability and a sufficiently long pot life at room temperature.
    Type: Application
    Filed: October 29, 2021
    Publication date: December 14, 2023
    Inventor: Hiroshi FUKUI
  • Publication number: 20230394784
    Abstract: An information processing apparatus includes: an extraction unit that extracts a feature quantity from image data; an acquisition unit that obtains a partial feature quantity by cutting out a particular position from the feature quantity; an arithmetic unit that performs a predetermined arithmetic process by using the partial feature quantity; and a restoration unit that restores a result of the predetermined arithmetic process to a size of the feature quantity.
    Type: Application
    Filed: November 13, 2020
    Publication date: December 7, 2023
    Applicant: NEC Corporation
    Inventor: Hiroshi Fukui
  • Publication number: 20230392013
    Abstract: A curable fluorosilicone composition is provided. The curable fluorosilicone composition comprises: (A) an organopolysiloxane having at least two alkenyl groups and at least one fluoroalkyl group in a molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms and at least one fluoroalkyl group in a molecule; (C) a platinum group metal-based catalyst for hydrosilylation reaction; and (D) a hydrosilylation reaction inhibitor having an aliphatic unsaturated bond. Component (C) is an encapsulation type catalyst having an acrylic resin as a wall material. The platinum group metals in component (C) relative to the composition are 0.1 to 100 ppm. The molar ratio of the aliphatic unsaturated bonds in component (D) relative to the platinum group metals in component (C) is 1 to 100. The curable fluorosilicone composition has favorable curability and a sufficiently pot life at room temperature.
    Type: Application
    Filed: October 29, 2021
    Publication date: December 7, 2023
    Inventors: Hiroshi FUKUI, Kyoko TOYAMA
  • Publication number: 20230295432
    Abstract: A laminate body is provided, in which two or more organopolysiloxane cured films are obtained by curing curable organopolysiloxane compositions having different compositions because, e.g., the functions required for a dielectric layer and electrode layer are different. In general, problems such as peeling and defects due to insufficient adhesive strength and trackability do not easily occur at an interface between the cured films forming the laminate body. Applications and methods are also provided. The laminate body comprises a structure with two or more laminated organopolysiloxane cured films with different compositions. At least a portion of functional groups involved in the curing reaction are the same. The laminated cured films have structures chemically bonded at an interface thereof.
    Type: Application
    Filed: June 21, 2021
    Publication date: September 21, 2023
    Inventors: Hiroshi FUKUI, Kyoko TOYAMA, Masayasu AKASAKA, Takeaki TSUDA
  • Patent number: 11725081
    Abstract: An organopolysiloxane cured film which can be made thin, has an extremely low number of defects on a surface and inside of the film, and exhibits high dielectric breakdown strength with regard to a load voltage is provided. Also provided are applications thereof and a method of manufacturing. The organopolysiloxane cured film has an average thickness within a range of 1 to 200 ?m. In general, the number of surface defects is 0 to 1, and the number of internal defects is 0 to 20, when measuring the number of surface defects using optical means in an arbitrary position on the organopolysiloxane cured film with a unit area of 15 mm×15 mm. The organopolysiloxane cured film may be obtained by a rolling step in a clean room or the like, or may be obtained by curing between separators provided with a release layer.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: August 15, 2023
    Assignee: DOW TORAY CO., LTD.
    Inventors: Hiroshi Fukui, Yoichi Kaminaga, Takeaki Tsuda