Patents by Inventor Hiroshi FUKUKAWA

Hiroshi FUKUKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor-bonding resin composition, semiconductor-bonding sheet, and semiconductor device using semiconductor-bonding sheet
    Patent number: 10767085
    Abstract: There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: September 8, 2020
    Assignee: KYOCERA CORPORATION
    Inventors: Masakazu Fujiwara, Hiroshi Fukukawa
  • SEMICONDUCTOR-BONDING RESIN COMPOSITION, SEMICONDUCTOR-BONDING SHEET, AND SEMICONDUCTOR DEVICE USING SEMICONDUCTOR-BONDING SHEET
    Publication number: 20190264071
    Abstract: There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.
    Type: Application
    Filed: May 8, 2019
    Publication date: August 29, 2019
    Applicant: KYOCERA Corporation
    Inventors: Masakazu FUJIWARA, Hiroshi FUKUKAWA