Patents by Inventor Hiroshi Hamachi

Hiroshi Hamachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof
    Patent number: 9281096
    Abstract: A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: March 8, 2016
    Assignee: DEXERIALS CORPORATION
    Inventors: Shinichi Hayashi, Hiroshi Hamachi
  • ANISOTROPIC CONDUCTIVE MATERIAL AND PROCESS FOR PRODUCTION THEREOF, AND MOUNTING BODY AND PROCESS FOR PRODUCTION THEREOF
    Publication number: 20130140085
    Abstract: A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min.
    Type: Application
    Filed: June 21, 2011
    Publication date: June 6, 2013
    Applicant: DEXERIALS CORPORATION
    Inventors: Shinichi Hayashi, Hiroshi Hamachi
  • Conductive particle, anisotropic conductive film, joined structure, and joining method
    Patent number: 8395052
    Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 12, 2013
    Assignee: Dexerials Corporation
    Inventors: Tomoyuki Ishimatsu, Hiroki Ozeki, Hiroshi Hamachi
  • CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND JOINING METHOD
    Publication number: 20110088935
    Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.
    Type: Application
    Filed: December 22, 2010
    Publication date: April 21, 2011
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Tomoyuki ISHIMATSU, Hiroki Ozeki, Hiroshi Hamachi