Patents by Inventor Hiroshi Hara

Hiroshi Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12085791
    Abstract: An optical waveguide element includes: an optical waveguide having a ridge part and a slab part having a thickness less than the ridge part. The optical waveguide includes: a first waveguide having a first ridge with and a first slab film thickness; a second waveguide having a second ridge width and a second slab film thickness; a first intermediate waveguide connected to the first waveguide and having a third ridge width and the first slab film thickness; and a second intermediate waveguide connected to the second waveguide and having a fourth ridge width and the second slab film thickness. The first waveguide, the first intermediate waveguide, the second intermediate waveguide, and the second waveguide are arranged in this order; the second slab film thickness is larger than the first slab film thickness; and the third ridge width is larger than the fourth ridge width.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: September 10, 2024
    Assignee: TDK CORPORATION
    Inventors: Shinji Iwatsuka, Hiroki Hara, Anthony Reymund Melad Binarao, Cheng Bu Heng, Hiroshi Take, Kenji Nagase
  • Patent number: 12073885
    Abstract: A controller controls a memory including first and second strings. The first and second strings configure first and second string groups, respectively. In each string group, a set of memory cell transistors each from each string configures a unit. The controller is configured to: sequentially write, in the first string group, data in first units to which serially-coupled memory cell transistors respectively belong; sequentially write, in the second string group, data in first units to which serially-coupled memory cell transistors respectively belong; and sequentially write, in the first string group, data in second units to which serially-coupled memory cell transistors respectively belong.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: August 27, 2024
    Assignee: Kioxia Corporation
    Inventors: Hiroshi Sukegawa, Ikuo Magaki, Tokumasa Hara, Shirou Fujita
  • Publication number: 20240272573
    Abstract: An image forming apparatus includes a stack portion having recording materials, an image forming unit, a basis weight detection unit, an operating sound detection unit, and a mode selection unit. The basis weight detection unit detects a recording material basis weight based on an ultrasonic wave. The operating sound detection unit detect an abnormality of a generated operating sound. The mode selection unit selects, for each recording material fed to the image forming unit, between transmitting to the basis weight detection unit a first instruction for detecting the recording material basis weight and transmitting to the operating sound detection unit a second instruction for detecting the operating sound abnormality. In determining an interval at which each second instruction is transmitted, the mode selection unit determines the interval so that the interval and a cycle, in which properties of recording materials on the stack portion are repeated, do not continuously coincide.
    Type: Application
    Filed: April 22, 2024
    Publication date: August 15, 2024
    Inventors: Hiroshi Hagiwara, Naoto Tsuchihashi, Yohei Suzuki, Seiji Hara, Yoshitaka Zaitsu, Masafumi Monde, Hiromitsu Kumada
  • Publication number: 20240138766
    Abstract: Provided is an electrode catheter whose movable shape has a high reproducibility even when the load changes, and has a high degree of freedom in corresponding to the shape of a measurement site.
    Type: Application
    Filed: January 18, 2022
    Publication date: May 2, 2024
    Applicant: INTER NOVA INC.
    Inventor: Hiroshi Hara
  • Publication number: 20240079103
    Abstract: An information processing device (40) according to one embodiment of the present disclosure includes: an analysis unit (41) being a first data generation unit that generates objective score data, which indicates objective scores in time series, based on a plurality of pieces of objective data regarding a patient; a processing unit (42) being a second data generation unit that generates subjective score data, which indicates subjective scores in time series, based on a plurality of pieces of subjective data obtained from the patient; and a generation unit (44) being an image generation unit that generates a score image indicating the objective score data and the subjective score data.
    Type: Application
    Filed: December 23, 2021
    Publication date: March 7, 2024
    Inventors: RITSUKO KANO, EIJIRO MORI, SHINSUKE NOGUCHI, KAZUMI HIRANO, TAKAFUMI YANAGIMOTO, KOJI SATO, HIROSHI HARA
  • Publication number: 20240069354
    Abstract: An optical module according to one embodiment includes: a beam splitter having a first surface, a second surface facing the first surface, a third surface intersecting with the first surface, a fourth surface facing the third surface, and an inner surface formed within a region defined by the first surface, the second surface, the third surface, and the fourth surface; and a light receiving unit arranged at a position facing the third surface of the beam splitter. The beam splitter splits first incident light incident from the first surface into first split light transmitted through the inner surface and emitted from the second surface and second split light reflected on the inner surface and emitted from the third surface. The optical module includes a light absorbing/reflecting unit provided on the fourth surface.
    Type: Application
    Filed: August 16, 2023
    Publication date: February 29, 2024
    Inventors: Munetaka KUROKAWA, Hiroshi HARA
  • Publication number: 20240069293
    Abstract: An optical module according to one embodiment includes a package having an opening surrounded by side walls, and a lid mounted on the package to seal the opening. The lid has a plate-like shape and includes a welded portion fixed by welding to an upper surface of the side wall of the package having the opening formed thereon, an easily deformable portion formed at a position separated from the welded portion and deformed along with the welding, and a central portion having a flat shape.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 29, 2024
    Inventors: Munetaka KUROKAWA, Hiroshi HARA, Masato FURUKAWA
  • Publication number: 20240053196
    Abstract: An optical receiver according to one embodiment includes a transimpedance amplifier including a first pad, a second pad provided on an insulating layer, connected to a cathode wiring layer through a first via, arranged at a position interposing the first pad, and connected to a first cathode pad of a light-receiving element, and a third pad connected to the second cathode pad of the light-receiving element. The light-receiving element is connected to an anode pad mounted on the transimpedance amplifier and connected through an anode electrode and an anode wiring pattern provided on a surface facing the transimpedance amplifier and a first cathode pad and a second cathode pad connected through a cathode electrode and a cathode wiring pattern and arranged at positions interposing the anode pad.
    Type: Application
    Filed: January 14, 2022
    Publication date: February 15, 2024
    Inventors: Hiroshi HARA, Kosuke OKAWA
  • Patent number: 11901946
    Abstract: An optical transmitter according to one embodiment includes a housing with an emission end, a light emitting element mounted on a first mounting portion of the housing, and a light receiving element mounted on a second mounting portion of the housing to monitor output light from the light emitting element. The second mounting portion is provided with a carrier, a first resin located on an emission end side of a lower side of the carrier, and a second resin located on a light emitting element side of the lower side of the carrier. A coefficient of thermal expansion of the first resin is smaller than a coefficient of thermal expansion of the second resin.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: February 13, 2024
    Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Device Innovations, Inc.
    Inventors: Satoshi Yoshimura, Hiroshi Hara, Eiji Tsumura, Masanobu Kawamura
  • Publication number: 20240000670
    Abstract: Provided are a zirconia dental mill blank and a manufacturing method therefor, said mill bank having a to-be-cut part composed of a composite material, which includes fine particles of an inorganic oxide (excluding zirconium oxide, an inorganic oxide functioning as a stabilizer, and aluminum oxide) and a matrix composed of a temporarily sintered body of a crystalline zirconium oxide powder containing a stabilizer and an aluminum oxide additive, wherein the temporarily sintered body is a microporous temporarily sintered body having a relative density of 45-65% and having pores opened outward, and the fine particles of the inorganic oxide are held in the pores of the microporous temporarily sintered body. Moreover, provided are a method for manufacturing a dental zirconia ceramic prosthesis, and a method for manufacturing an article composed of a zirconia composite ceramic.
    Type: Application
    Filed: October 22, 2021
    Publication date: January 4, 2024
    Applicant: TOKUYAMA DENTAL CORPORATION
    Inventors: Hiroshi Hara, Akari Hashimoto, Kei Nakashima
  • Patent number: 11799267
    Abstract: An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: October 24, 2023
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kosuke Okawa, Naoki Itabashi, Tomoya Saeki, Hiroshi Hara
  • Patent number: 11784720
    Abstract: An optical module of the present disclosure includes an optical element, a first optical component that is optically coupled to the optical element, a second optical component that is optically coupled to the first optical component, a receptacle to which an optical fiber that transmits the incident light to the second optical component is connected, a terminal unit that electrically outputs an output signal of the optical element to the outside, and a package that accommodates the optical element, the first optical component, and the second optical component and is provided with the receptacle on a first surface and the terminal unit on a second surface facing the first surface, wherein the wiring extends from the first surface side to the second surface side and electrically connects the second optical component and the terminal unit.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: October 10, 2023
    Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Device Innovations, Inc.
    Inventors: Kazuaki Mii, Kyohei Maekawa, Hiroshi Hara, Toru Hirayama, Ryouta Teranishi
  • Publication number: 20230221505
    Abstract: An optical device according to one embodiment includes: a light-emitting element; first and second lenses optically coupled with the light-emitting element; an optical component provided between the light-emitting element and the second lens, optically coupling each of the light-emitting element and the second lens, and multiplexing input lights; and a base having a lower plate having a plurality of convex mounting surfaces with each of the light-emitting element, the first lens, the second lens, and the optical component being mounted thereon and a side wall with a receptacle being connected thereto.
    Type: Application
    Filed: June 11, 2021
    Publication date: July 13, 2023
    Applicants: Sumitomo Electric Device Innovations, Inc., Sumitomo Electric Industries, Ltd.
    Inventors: Kazushige OKI, Kazunobu KOBAYASHI, Hiroshi HARA, Eiji TSUMURA, Masanobu KAWAMURA, Satoshi YOSHIMURA, Kuniyuki ISHII, Fumihiro NAKAJIMA, Hideaki KITAJIMA, Hideaki KAMISUGI
  • Publication number: 20230077958
    Abstract: An optical transmission module includes a metal base including a signal terminal which extends along a first direction, a dielectric block including a dielectric substance, the dielectric block having a semiconductor plane, an optical plane, and a thermal plane, the semiconductor plane and the optical plane being parallel to the first direction, the thermal plane crossing the first direction, and the semiconductor plane being provided between the optical plane and the thermal plane in the first direction, an optical semiconductor element mounted on the semiconductor plane, the optical semiconductor element being electrically connected with the signal terminal, a temperature regulating element provided between the dielectric block and the metal base in the first direction, the temperature regulating element being contacted with the thermal plane, and a lens mounted on the optical plane.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 16, 2023
    Inventors: Kosuke OKAWA, Hiroshi HARA, Naoki ITABASHI
  • Publication number: 20230036701
    Abstract: An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 2, 2023
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Kosuke OKAWA, Naoki ITABASHI, Tomoya SAEKI, Hiroshi HARA
  • Publication number: 20220416901
    Abstract: An optical transmitter according to one embodiment includes a housing with an emission end, a light emitting element mounted on a first mounting portion of the housing, and a light receiving element mounted on a second mounting portion of the housing to monitor output light from the light emitting element. The second mounting portion is provided with a carrier, a first resin located on an emission end side of a lower side of the carrier, and a second resin located on a light emitting element side of the lower side of the carrier. A coefficient of thermal expansion of the first resin is smaller than a coefficient of thermal expansion of the second resin.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 29, 2022
    Applicants: Sumitomo Electric Industries, Ltd., Sumitomo Electric Device Innovations, Inc.
    Inventors: Satoshi YOSHIMURA, Hiroshi HARA, Eiji TSUMURA, Masanobu KAWAMURA
  • Publication number: 20220271843
    Abstract: An optical module of the present disclosure includes an optical element, a first optical component that is optically coupled to the optical element, a second optical component that is optically coupled to the first optical component, a receptacle to which an optical fiber that transmits the incident light to the second optical component is connected, a terminal unit that electrically outputs an output signal of the optical element to the outside, and a package that accommodates the optical element, the first optical component, and the second optical component and is provided with the receptacle on a first surface and the terminal unit on a second surface facing the first surface, wherein the wiring extends from the first surface side to the second surface side and electrically connects the second optical component and the terminal unit.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 25, 2022
    Applicants: Sumitomo Electric Industries, Ltd., Sumitomo Electric Device Innovations, Inc.
    Inventors: Kazuaki MII, Kyohei MAEKAWA, Hiroshi HARA, Toru HIRAYAMA, Ryouta TERANISHI
  • Patent number: 11362736
    Abstract: An optical transmitter module includes a semiconductor laser device, optical modulator, temperature adjusting device which includes a substrate, a first installation part and a second installation part, a package having a bottom surface opposite to a back surface of the substrate, the package housing the semiconductor laser device, the optical modulator, and the temperature adjusting device; and a middle block disposed between a first temperature controlling element a the second temperature controlling element, the middle block having a back surface directly or indirectly fastened to a principal surface of the substrate.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: June 14, 2022
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Munetaka Kurokawa, Hiroshi Hara
  • Patent number: 11327256
    Abstract: A package for optical receiver module includes a conductive housing and a feedthrough. The conductive housing includes a first sidewall having an optical port for receiving an optical signal along an optical axis, a second sidewall separated from the first sidewall along the optical axis, and an interior space for housing a photodetector. The feedthrough includes first to third layers extending from the second sidewall to an opposite direction of the first sidewall, and the third layer is provided between the first and second layers. The feedthrough includes first to fourth wirings, a grounding wiring, and a plurality of first conductive cells. The first and second wirings face the interior space. The third wirings, the fourth wiring, the grounding wiring are formed in the first layer or the second layer. The plurality of first conductive cells are arranged in the third layer, and are electrically connected to the grounding wiring.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: May 10, 2022
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hiroyasu Oomori, Hiroshi Hara
  • Publication number: 20220085568
    Abstract: A light semiconductor device according to an embodiment includes: a carrier having a first pattern for transmitting a signal and a second pattern having a reference potential constituting a coplanar line together with the first pattern on a front surface; a modulator having a first electrode provided on a back surface and connected to the second pattern of the carrier and a second electrode provided on a front surface and connected to the first pattern of the carrier; and a first connection portion having one end connected to the second pattern of the carrier and the other end connected to the first electrode of the modulator. The front surface of the modulator and a front surface of the carrier face each other.
    Type: Application
    Filed: September 15, 2021
    Publication date: March 17, 2022
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Naoki ITABASHI, Hiroshi Hara