Patents by Inventor Hiroshi Harayama

Hiroshi Harayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9738014
    Abstract: The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: August 22, 2017
    Assignee: APIC YAMADA CORPORATION
    Inventors: Tetsuya Maeyama, Hidemichi Kobayashi, Shusaku Tagami, Yoshikazu Muramatsu, Takayuki Yamazaki, Keiji Koyama, Hideaki Nakazawa, Hiroshi Harayama, Kenji Nishizawa, Makoto Kawaguchi, Masahiko Fujisawa, Hidetoshi Oya
  • Publication number: 20120135096
    Abstract: The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.
    Type: Application
    Filed: November 23, 2011
    Publication date: May 31, 2012
    Inventors: Tetsuya MAEYAMA, Hidemichi KOBAYASHI, Shusaku TAGAMI, Yoshikazu MURAMATSU, Takayuki YAMAZAKI, Keiji KOYAMA, Hideaki NAKAZAWA, Hiroshi HARAYAMA, Kenji NISHIZAWA, Makoto KAWAGUCHI, Masahiko FUJISAWA, Hidetoshi OYA
  • Patent number: 4721643
    Abstract: A laminated structure comprising a laminated foamed sheet material composed of two cured foamed sheets each comprising a propylene-type polymer and an ethylene-type polymer and being laminated to each other through a substantially non-foamed or lowly foamed heat-fused layer, and non-foamed surface skin layers composed of a propylene-type polymer and laminated respectively to both surfaces of said laminated foamed sheet material, the ratio of the thickness Ts of each of said surface skin layer to the solid thickness Tf of each of the cured foamed sheets, Ts/Tf, being from 1 to 50, the thickness T1 of the heat-fused layer being 0.1 to 0.5 mm, and the thickness T1 being 1 to 25% of the thickness of each of the cured foamed sheets.
    Type: Grant
    Filed: January 28, 1987
    Date of Patent: January 26, 1988
    Assignees: Sekisui Kagaku Kogyo Kabushiki Kaisha, Toyota Jidosha Kabushiki Kaisha
    Inventors: Hiroshi Harayama, Hideo Nishimura, Satoshi Ohmura, Yutaka Yoshino, Rikizou Tanaka, Fumimasa Kuno
  • Patent number: 4320214
    Abstract: Zinc oxide is used during manufacture of silane-modified ethylene-type resin so that the resulting material changes little with the passage of time.
    Type: Grant
    Filed: December 14, 1978
    Date of Patent: March 16, 1982
    Assignee: Sekisui Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Harayama, Ken Shinkai, Hiroshi Takahashi, Masahiro Mizusako