Abstract: A semiconductor device has pads that are arranged in such a manner as to easily accept manual needles to carry out a test. This technique is applicable to carry out a test with use of a boundary scan test circuit in synchronization with a cycle time defined by a normal operation clock signal. The semiconductor device has a first pad connected to a first one of registers that form a serial scan chain, to supply test data to the registers, a second pad connected to a last one of the registers, and a third pad to supply a test clock signal to the registers. The registers are arranged in a central part of the semiconductor device, and the first to third pads are arranged at the periphery of the semiconductor device.

Abstract: A semiconductor device provided with a compact Boundary-Scan test circuit is shown. The Boundary-Scan test circuit comprises a Boundary-Scan test register which is composed of bit elements serially connected to each other in the form of a scan path and each of which is connected respectively to one of pads of the semiconductor device, wherein part of the bit elements of said Boundary-Scan test register functions also as an ID-Code register while an initial bit element of said Boundary-Scan test register functions also as a bypass register for bypassing the subsequent bit elements of said Boundary-Scan test register.

Abstract: A semiconductor device formed by using a standard cell system is a semiconductor device using a multi-layered wiring system. At this time, inter-cell wirings for electrically connecting different standard cells are formed of only a conductive layer which is disposed above a conductive layer constituting intra-cell wirings of the standard cells. Connection between the inter-cell wirings is made above an occupied area of the standard cells on the semiconductor substrate so as to eliminate a channel region.