Patents by Inventor Hiroshi Hatase

Hiroshi Hatase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6723679
    Abstract: A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: April 20, 2004
    Assignees: Osaka Municipal Government, Matsushita Electric Industrial Co., Ltd., C. Uyemura & Co., Ltd.
    Inventors: Masanobu Izaki, Hiroshi Hatase, Yoshikazu Saijo
  • Publication number: 20020187895
    Abstract: A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
    Type: Application
    Filed: April 12, 2002
    Publication date: December 12, 2002
    Applicant: OSAKA MUNICIPAL GOVERNMENT, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Masanobu Izaki, Hiroshi Hatase, Yoshikazu Saijo
  • Patent number: 6406750
    Abstract: A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: June 18, 2002
    Assignees: Osaka Municipal Government, Matsushita Electric Industrial Co., Ltd., C. Uyemura & Co., Ltd.
    Inventors: Masanobu Izaki, Hiroshi Hatase, Yoshikazu Saijo
  • Patent number: 5057650
    Abstract: A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches, positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches, positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on, and attached to, the connection terminals. The protective cover is then attached to the body.
    Type: Grant
    Filed: August 2, 1990
    Date of Patent: October 15, 1991
    Assignees: Sumitomo Electric Industries, Ltd., Matsushita Electric Industrial Co., Ltd., Sankyo Kasei Co., Ltd.
    Inventors: Kenichi Urushibata, Kiyoto Sugawara, Tatsuo Matsuda, Haruo Saen, Keiichi Kojima, Syusaku Kawasaki, Hiroshi Hatase, Katsuya Saito, Tetsuo Yumoto, Norio Yoshizawa, Tooru Kanno
  • Patent number: 4885188
    Abstract: This invention is designed to form thin films of metal sulfides usable in various types of electronic devices with a simple process comprising forming a layer of an organometallic compound having at least one metal-sulfur or metal-oxygen bond in the molecule on a substrate by printing or other means and then thermally decomposing the formed organometallic compound layer in an inert gas which may or may not be mixed with hydrogen sulfide.
    Type: Grant
    Filed: August 29, 1986
    Date of Patent: December 5, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yo Hasegawa, Kazuyuki Okano, Akira Nakanishi, Hiroshi Hatase