Patents by Inventor Hiroshi Hataya

Hiroshi Hataya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090165960
    Abstract: A tape binding device includes a table. The table includes a tape passage groove allowing to pass a tape having a greater width than a width of a material to be bound. A loop forming mechanism for forming a loop of the tape includes a first belt conveying mechanism disposed below the table. The first belt conveying mechanism includes a plurality of conveying belts provided with spaces to be spaced apart in a direction perpendicular to a conveyance direction of the tape. The tape is sucked to the conveying belts and conveyed by sucking air through the spaces. Placing portions of plurality of placing members driven to an upper position by a driving mechanism place the material to be bound thereon located above the conveying belts of the first belt conveying mechanism. At least one of the placing portions is arranged to advance above the conveying belts through a space between the corresponding conveying belts.
    Type: Application
    Filed: June 19, 2008
    Publication date: July 2, 2009
    Applicant: TAIYO SEIKI CO., LTD.
    Inventor: Hiroshi Hataya
  • Publication number: 20090169338
    Abstract: A tape binding device includes a loop forming mechanism for forming a loop for winding a material to be bound at an end of a tape. The loop forming mechanism includes a plurality of belt conveying mechanisms arranged in a polygonal shape in a conveyance direction for absorbing the tape by air suction and conveying the tape. Each of the belt conveying mechanisms includes a plurality of endless conveying belts extending parallel to the conveyance direction and arranged in a direction perpendicular to the conveyance direction with a space for air suction provided therebetween.
    Type: Application
    Filed: June 18, 2008
    Publication date: July 2, 2009
    Applicant: TAIYO SEIKI CO., LTD.
    Inventor: Hiroshi Hataya
  • Publication number: 20090165659
    Abstract: A tape binding device includes a loop forming mechanism for forming a loop for winding a material to be bound at an end of a tape. A supplying mechanism supplies a tape from a tape roll to the loop forming mechanism. The supplying mechanism includes a conveying roller and a conveying belt. The conveying belt includes a region in a curved shape along a predetermined region on a peripheral surface of the conveying roller. The tape is conveyed while being sandwiched between the conveying roller and the conveying belt.
    Type: Application
    Filed: June 18, 2008
    Publication date: July 2, 2009
    Applicant: TAIYO SEIKI CO., LTD.
    Inventor: Hiroshi Hataya
  • Patent number: 6902367
    Abstract: A binding machine with a tape enlarges a loop formed at an end of a tape to a predetermined size by the travel of the tape. The loop enlarged to the predetermined size is contracted, to bind a material to be bound in the loop. The binding machine comprises nick formation means for forming a nick for inducing fracture at a side edge of the tape having the loop enlarged to the predetermined size.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: June 7, 2005
    Inventor: Hiroshi Hataya
  • Patent number: 6899505
    Abstract: A binding machine with a tape comprises a table for putting a material to be bound, a tape passage groove formed on the table, and a guiding member in an arch shape provided above the tape passage groove. A loop formed by a tape of a predetermined size is formed along the guiding member. There is provided a tape receiving member which can be displaced to first and second positions. At least a part of the tape receiving member at the first position advances into the loop, to prevent the top of the loop from hanging.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: May 31, 2005
    Inventor: Hiroshi Hataya
  • Publication number: 20030007847
    Abstract: A binding machine with a tape enlarges a loop formed at an end of a tape to a predetermined size by the travel of the tape. The loop enlarged to the predetermined size is contracted, to bind a material to be bound in the loop. The binding machine comprises nick formation means for forming a nick for inducing fracture at a side edge of the tape having the loop enlarged to the predetermined size.
    Type: Application
    Filed: June 24, 2002
    Publication date: January 9, 2003
    Inventor: Hiroshi Hataya
  • Publication number: 20030007848
    Abstract: A binding machine with a tape comprises a table for putting a material to be bound, a tape passage groove formed on the table, and a guiding member in an arch shape provided above the tape passage groove. A loop formed by a tape of a predetermined size is formed along the guiding member. There is provided a tape receiving member which can be displaced to first and second positions. At least a part of the tape receiving member at the first position advances into the loop, to prevent the top of the loop from hanging.
    Type: Application
    Filed: June 24, 2002
    Publication date: January 9, 2003
    Inventor: Hiroshi Hataya
  • Patent number: 6233910
    Abstract: After a tape is caused to travel in a direction parallel to a front surface of a machine frame to expand a loop, the loop is tightened, to bind a material to be bound. A door which is opened or closed by rotating around an axis of rotation is provided on a side surface of the machine frame. A tape roll is contained in a containing space formed between a reverse surface of the door and a plate opposite thereto, and is held in a holding member. When a binding machine is used upon opening the door, a center line of the tape roll is perpendicular to the direction in which the tape travels, thereby making smooth travel of the tape possible. When the binding machine is not used, the door is closed by rotating around the axis of rotation, to enter a state where it is along the side surface of the machine frame.
    Type: Grant
    Filed: July 19, 1999
    Date of Patent: May 22, 2001
    Inventor: Hiroshi Hataya