Patents by Inventor Hiroshi Hayai

Hiroshi Hayai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5854325
    Abstract: The present invention provides a photosensitive adhesive composition for additive plating, comprising the following components (a), (b), (c), (d), (e) and (f) as essential components; and an excellent multilayer printed circuit board obtained by using the adhesive composition:(a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500,(b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate,(c) an epoxy acrylate or epoxy methacrylate compound,(d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers,(e) a photopolymerization initiator, and(f) an acid-soluble filler.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: December 29, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Hiroshi Hayai, Takayuki Baba
  • Patent number: 5837355
    Abstract: A process for producing a multilayer printed circuit board, comprising the steps of: impregnating a thermosetting resin in a base material to form a prepreg, applying a thermosetting epoxy resin undercoating agent comprising dicyandiamide and a micro-capsulated imidazole compound to at least one side of an interlayer circuit board on at least one side of which circuit has been formed, heating the applied undercoating agent to dry or semi-cure the undercoating agent, and laying the prepreg on at least one side of the dried or semi-cured undercoating agent-applied interlayer circuit board and subjecting them to laminating press.
    Type: Grant
    Filed: November 7, 1996
    Date of Patent: November 17, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Hiroshi Hayai
  • Patent number: 5726219
    Abstract: The present invention provides a rein composition comprising the following components (a), (b), (c), (d) and (e) as essential components; and an excellent multilayer printed circuit board obtained by using the resin composition:(a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500,(b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate,(c) an epoxy acrylate or epoxy methacrylate compound,(d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers, and(e) a photopolymerization initiator.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: March 10, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Hiroshi Hayai, Takayuki Baba