Patents by Inventor Hiroshi Hayashizaki

Hiroshi Hayashizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6696346
    Abstract: It is an object of the present invention to provide a semiconductor device capable of decreasing electric resistance of a lower electrode provided therein, as well as capable of accurately responding to external signals having high frequencies inputted therein. The lower electrode 7 consists of three layers such as a silicon lower electrode layer 7a made of poly-crystalline silicon, a tungsten-silicide layer 7b made of tungsten silicide as a chemical compound of tungsten and silicon, and a protection layer 7c made of poly-crystalline silicon. By constructing the semiconductor device as described above, oxidation of the tungsten-silicide layer 7b may be prevented by the protection layer 7c made of poly-crystalline silicon even when oxidation layers of an ONO (silicon oxidation) layer 11 is formed by thermal oxidation. Consequently, electric resistance of the lower electrode 7 can be decreased.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: February 24, 2004
    Assignee: Rohm Co., Ltd.
    Inventor: Hiroshi Hayashizaki
  • Patent number: 6642621
    Abstract: It is an object of the present invention to provide a semiconductor device capable of decreasing electric resistance of a lower electrode provided therein, as well as capable of accurately responding to external signals having high frequencies inputted therein. The lower electrode 7 consists of three layers such as a silicon lower electrode layer 7a made of poly-crystalline silicon, a tungsten-silicide layer 7b made of tungsten silicide as a chemical compound of tungsten and silicon, and a protection layer 7c made of poly-crystalline silicon. By constructing the semiconductor device as described above, oxidation of the tungsten-silicide layer 7b may be prevented by the protection layer 7c made of poly-crystalline silicon even when oxidation layers of an ONO (silicon oxidation) layer 11 is formed by thermal oxidation. Consequently, electric resistance of the lower electrode 7 can be decreased.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: November 4, 2003
    Assignee: Rohm Co., Ltd.
    Inventor: Hiroshi Hayashizaki
  • Publication number: 20020081812
    Abstract: It is an object of the present invention to provide a semiconductor device capable of decreasing electric resistance of a lower electrode provided therein, as well as capable of accurately responding to external signals having high frequencies inputted therein. The lower electrode 7 consists of three layers such as a silicon lower electrode layer 7a made of poly-crystalline silicon, a tungsten-silicide layer 7b made of tungsten silicide as a chemical compound of tungsten and silicon, and a protection layer 7c made of poly-crystalline silicon. By constructing the semiconductor device as described above, oxidation of the tungsten-silicide layer 7b may be prevented by the protection layer 7c made of poly-crystalline silicon even when oxidation layers of an ONO (silicon oxidation) layer 11 is formed by thermal oxidation. Consequently, electric resistance of the lower electrode 7 can be decreased.
    Type: Application
    Filed: August 24, 2001
    Publication date: June 27, 2002
    Inventor: Hiroshi Hayashizaki
  • Publication number: 20020047204
    Abstract: It is an object of the present invention to provide a semiconductor device capable of decreasing electric resistance of a lower electrode provided therein, as well as capable of accurately responding to external signals having high frequencies inputted therein. The lower electrode 7 consists of three layers such as a silicon lower electrode layer 7a made of poly-crystalline silicon, a tungsten-silicide layer 7b made of tungsten silicide as a chemical compound of tungsten and silicon, and a protection layer 7c made of poly-crystalline silicon. By constructing the semiconductor device as described above, oxidation of the tungsten- silicide layer 7b may be prevented by the protection layer 7c made of poly-crystalline silicon even when oxidation layers of an ONO (silicon oxidation) layer 11 is formed by thermal oxidation. Consequently, electric resistance of the lower electrode 7 can be decreased.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 25, 2002
    Inventor: Hiroshi Hayashizaki