Abstract: Thumbnails are used, facilitating any operation on an object that changes from time to time as in a moving picture, thereby to prevent failure in capturing important objects.

Abstract: The present invention extracts picked up image data picked up by a specialized apparatus and converts the extracted picked up image data into a data format capable of being handled in a general apparatus.

Abstract: Thumbnails are used, facilitating any operation on an object that changes from time to time as in a moving picture, thereby to prevent failure in capturing important objects.

Abstract: To effectively and reliably acquire detailed images of plural moving subjects in the case where a fixed camera or a pan/tilt camera for searching the moving subject and another pan/tilt camera for taking an image of the details of the moving subject by zooming the moving subjects are used to detect the moving subjects.

Abstract: The motion of a moving subject is captured at a short time interval up to a wide area by tracking and photographing the moving subject. A wide angle area is photographed by a first camera, an area narrower than the wide angle area is photographed by a second camera, the presence or absence of the motion in an image is detected by a motion detecting section by comparing the first image with the second image in terms of the difference of luminance levels. The correlation of the positions of the first image and the second image is recorded by a memory, and the photographing direction of the second camera is controlled by a controller by using the correlation information when the presence of the motion is detected by the motion detecting section.

Abstract: A semiconductor apparatus connected between a signal input line and a grounding line is formed on a semiconductor substrate with a protection circuit connected between the signal input line and the grounding line, in parallel with the semiconductor apparatus. The protection circuit is formed, for example, of bipolar transistors, diodes, or MOS transistors.

Abstract: In a semiconductor device such as a CCD solid-state imager having terminals connected with protection transistors, a strength against a static electricity applied between a terminal and a ground (GND) and a strength against a static electricity applied between a terminal and a substrate and a strength against a static electricity between terminals can be improved.

Abstract: A semiconductor apparatus connected between a signal input line and a grounding line is formed on a semiconductor substrate with a protection circuit connected between the signal input line and the grounding line, in parallel with the semiconductor apparatus. The protection circuit is formed, for example, of bipolar transistors, diodes, or MOS transistors. The protection circuit is designed to prevent an excess signal supplied on the signal line from damaging the semiconductor apparatus, such as by breaking down a dielectric layer formed at a gate of a MOS transistor. The protection circuit may further be connected to a potential line that is connected to an external source of voltage.

Abstract: A protective circuit protects a plurality of protected portions having different withstand voltages and operation voltages of an active portion of a CCD solid state imaging device or the like by protective elements (e.g., transistors). The respective protected portions can be protected in an optimum fashion in response to the withstand voltages and operation voltages thereof. The breakdown voltages of the respective protective transistors are made different in response to the withstand voltages and operation voltages of the protected portions.

Abstract: A semiconductor apparatus connected between a signal input line and a grounding line is formed on a semiconductor substrate with a protection circuit connected between the signal input line and the grounding line, in parallel with the semiconductor apparatus. The protection circuit is formed, for example, of bipolar transistors, diodes, or MOS transistors.