Patents by Inventor Hiroshi Hidaka

Hiroshi Hidaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060290245
    Abstract: An electronic apparatus that can be ejectably mounted in a rack mount apparatus that includes a first housing and a mechanism adapted to project from the first housing includes a second housing that is fixed onto the mechanism, and mounted in the first housing so that the second housing can be drawn from the first housing; and a provisional fixture member that is attached to the second housing and engageable with the mechanism.
    Type: Application
    Filed: September 8, 2005
    Publication date: December 28, 2006
    Inventor: Hiroshi Hidaka
  • Patent number: 7145764
    Abstract: A console unit includes a substrate extending along a virtual plane. A support extends rearward from the front end. The substrate is received on the support. A console is connected to the front end of the support for relative rotation around a rotation axis intersecting the virtual plane. The console is allowed to occupy a larger space even if the substrate is reduced in size. The visibility of the console cannot be degraded irrespective of a reduced size of the substrate. Other components may be positioned adjacent the console unit. Replacement of the component is often required without detaching the console. The console is allowed to retreat from the path of movement of the component based on the rotational movement. Interference can reliably be prevented between the console unit and the other component during replacement of the other component.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: December 5, 2006
    Assignee: Fujitsu Limited
    Inventor: Hiroshi Hidaka
  • Publication number: 20060039106
    Abstract: An ejector includes a block attached rotatably to a unit, the block including first and second compression members, each of which compresses an electronic apparatus so as to release an electric connection between the unit and the electronic apparatus, and an arm rotatable with the block and attached to the unit so that the arm displaces relative to the block, the arm including third and fourth compression members, each of which compresses an electronic apparatus so as to electrically connect the unit and the electronic apparatus to each other, wherein the block and the arm compress the electronic apparatus via different compression members as a displacement state and a rotational direction of the arm change.
    Type: Application
    Filed: November 30, 2004
    Publication date: February 23, 2006
    Applicant: Fujitsu Limited
    Inventor: Hiroshi Hidaka
  • Publication number: 20060028804
    Abstract: An ejector that attaches a unit to and ejects the unit from an electronic apparatus includes a lever that is fixed foldably and unfoldably onto the housing of the unit, a force being applicable to the lever to attach the unit to and eject the unit from the electronic apparatus, and an arm that is elastically deformable and moves between a lock position at which the am is engaged with the lever folded onto the housing of the unit and locks the lever at a folding position, and an unlock position at which the arm unlocks the lever and allows the lever to unfold from the housing of the unit.
    Type: Application
    Filed: November 30, 2004
    Publication date: February 9, 2006
    Applicant: Fujitsu Limited
    Inventor: Hiroshi Hidaka
  • Publication number: 20060028805
    Abstract: An ejector that attaches a unit to and ejects the unit from an electronic apparatus, the unit including a unit body and a case that covers the unit body includes a lever that is attached foldably and unfoldably to the case, a force being applicable to the lever to attach the unit to and eject the unit from the electronic apparatus, and an engagement member that is movable along a surface of the case between a lock position at which the engagement member is engaged with is engaged with the lever folded onto the case and locks the lever at a folding position, and an unlock position at which the engagement member unlocks the lever and allows the lever to unfold from the case.
    Type: Application
    Filed: August 1, 2005
    Publication date: February 9, 2006
    Applicant: FUJITSU LIMITED
    Inventor: Hiroshi Hidaka
  • Publication number: 20050257232
    Abstract: The invention relates to an enclosure structure of electronic equipment such as a rack-mount disk array apparatus, and its object is to increase the number of apparatus units to be mounted and facilitate replacement thereof. The enclosure structure of electronic equipment of the invention having an enclosure mounted in a rack in a withdrawable manner, is arranged such that it comprises a plurality of wiring panel portions that partition the inner space of the enclosure in the fore-and-aft direction, the plurality of wiring panel portion being disposed spanning over the inner surface portions of the enclosure; and a movable frame portion that rotationally moves apparatus units connected to the wiring panel portions together with the wiring panel portions, the movable frame portion providing a support to the apparatus units in such a manner as to be attachable to and detachable from the wiring panel portions.
    Type: Application
    Filed: September 23, 2004
    Publication date: November 17, 2005
    Inventor: Hiroshi Hidaka
  • Patent number: 6952341
    Abstract: A disk array apparatus includes an enclosure having an opening at its front face, at least one module configured to be mounted in the enclosure and at least one securing mechanism configured to secure the at least one module to the enclosure. The module includes a frame member and a lever member that is movable between a first position received by the frame member in which it serves as a cover of the opening and a second position in which it serves as a grip part for pulling the module out of the enclosure.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: October 4, 2005
    Assignee: Fujitsu Limited
    Inventors: Hiroshi Hidaka, Takashi Yamamoto, Masayuki Korikawa, Katsuhisa Katano
  • Publication number: 20050007729
    Abstract: A console unit includes a substrate extending along a virtual plane. A support extends rearward from the front end. The substrate is received on the support. A console is connected to the front end of the support for relative rotation around a rotation axis intersecting the virtual plane. The console is allowed to occupy a larger space even if the substrate is reduced in size. The visibility of the console cannot be degraded irrespective of a reduced size of the substrate. Other components may be positioned adjacent the console unit. Replacement of the component is often required without detaching the console. The console is allowed to retreat from the path of movement of the component based on the rotational movement. Interference can reliably be prevented between the console unit and the other component during replacement of the other component.
    Type: Application
    Filed: February 19, 2004
    Publication date: January 13, 2005
    Applicant: FUJITSU LIMITED
    Inventor: Hiroshi Hidaka
  • Publication number: 20040012921
    Abstract: A disk array apparatus includes an enclosure having an opening at its front face, at least one module configured to be mounted in the enclosure and at least one securing mechanism configured to secure the at least one module to the enclosure. The module includes a frame member and a lever member that is movable between a first position received by the frame member in which it serves as a cover of the opening and a second position in which it serves as a grip part for pulling the module out of the enclosure.
    Type: Application
    Filed: December 4, 2002
    Publication date: January 22, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Hiroshi Hidaka, Takashi Yamamoto, Masayuki Korikawa, Katsuhisa Katano
  • Patent number: 6645792
    Abstract: The lead frame of the present invention is a lead frame used in resin encapsulation of a semiconductor chip using an encapsulation mold that includes a die cavity to be filled with an encapsulation resin, the lead frame including: a first region exposed to the die cavity; a second region that is surrounding the first region and to be clamped by the encapsulation mold; a third region exposed to an ambient air with the die cavity being filled with the encapsulation resin; and at least one groove formed on a surface of the lead frame that is opposite to another surface of the lead frame on which the first region is present, the at least one groove extending from an area corresponding to the first region across another area corresponding to the second region so as to reach the third region.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: November 11, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akira Oga, Hisaho Inao, Hiroshi Hidaka
  • Publication number: 20030003628
    Abstract: The lead frame of the present invention is a lead frame used in resin encapsulation of a semiconductor chip using an encapsulation mold that includes a die cavity to be filled with an encapsulation resin, the lead frame including: a first region exposed to the die cavity; a second region that is surrounding the first region and to be clamped by the encapsulation mold; a third region exposed to an ambient air with the die cavity being filled with the encapsulation resin; and at least one groove formed on a surface of the lead frame that is opposite to another surface of the lead frame on which the first region is present, the at least one groove extending from an area corresponding to the first region across another area corresponding to the second region so as to reach the third region.
    Type: Application
    Filed: December 11, 2001
    Publication date: January 2, 2003
    Inventors: Akira Oga, Hisaho Inao, Hiroshi Hidaka
  • Patent number: 6497914
    Abstract: There is provided a low oil cream composition which does not require a large amount of any particular emulsifying agent but has good physical properties after the whipping as well as good flavor and melting property in the mouth, even a low oily ingredient content such as not greater than 40%, and also provides is an oil-and-fat feedstock for production of the cream composition. The oil-and-fat feedstock for production of the cream composition is obtained by formulating not less than 30% of SUS-type triglycerides and 5 to 60% of a lauric-type oil-and-fat ingredient. A low-oil cream composition can be produced by the feedstock alone or, by further adding a cream containing milk fat to the cream. Then, it is possible to provide a low-oil cream composition having flavor and body comparable with fresh cream and to provide a process for production thereof.
    Type: Grant
    Filed: February 3, 1994
    Date of Patent: December 24, 2002
    Assignee: Fuji Oil Co., Ltd.
    Inventors: Hiroshi Hidaka, Masaaki Miyabe, Naomi Iwai, Yoshitaka Ebihara, Tugio Izumi
  • Patent number: 6463195
    Abstract: In a method of manufacturing a polarization-maintaining optical fiber coupler by heating lengthwise portions of two polarization-maintaining optical fibers extending side by side, and elongating the heated portions to thereby form a fused-elongated section, elongation is terminated when the cyclic changes in a coupling ratio of two polarized waves according to an elongation length at a wavelength in use are both within first two cycles, so that the coupling ratio of one of the polarized waves is equal to or less than 10% and the coupling ratio of the other one of the polarized waves is equal to or greater than 90%. This method can provide a polarization-maintaining optical fiber coupler whose coupling ratio has a large dependency on polarization with a short elongation length.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: October 8, 2002
    Assignee: Fujikura Ltd.
    Inventors: Hideki Sasaki, Ryozo Yamauchi, Hiroshi Hidaka, Kenji Nishide, Shigefumi Yamasaki, Ryokichi Matsumoto, Yoji Suzuki
  • Patent number: 6228417
    Abstract: The objects of the present invention are to provide a whippable oil in water type emulsion, which possesses good heat resistance, excellent melting properties in mouth, freshness and cold feeling, and to provide a fat composition suitable for preparing the emulsion. A fat composition, comprising 25-60% of glycerides, of which constituent fatty acid residue has not more than 38 total carbon atoms, 25-50% of glycerides, of which constituent fatty acid residue has 42-46 total carbon atoms, and 5-25% of glycerides, of which constituent fatty acid residue has not less than 48 total carbon atoms was prepared by mixing laurin fats or hydrogenated products thereof which contain fatty acid residues with 16-24 carbon atoms or esters thereof, or a fat being rich in glycerides with fatty acid residues containing 16-24 carbon atoms, transesterifying them by a known method in the presence of a lipase having 1,3-specificity, and, if necessary, extremely hydrogenating them.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: May 8, 2001
    Assignee: Fuji Oil Co., Ltd.
    Inventors: Hiroshi Hidaka, Kuniaki Inayoshi, Tugio Nishimoto, Sayoko Yabuuchi
  • Patent number: 6081978
    Abstract: A resin-encapsulated semiconductor device producing apparatus includes resin encapsulating part for encapsulating, into a unitary structure, a semiconductor-chip holding zone of a lead frame or a substrate which holds a semiconductor chip, this encapsulation being made with an encapsulating resin material. The resin encapsulating part has first and second holding members for holding the lead frame or the substrate such that the first and second holding members are opposite to each other through the lead frame or the substrate. At least one of the first and second holding members has a housing concave formed opposite to the holding zone, the housing concave being capable of housing the encapsulating resin material. A resin thickness regulating member for regulating the thickness of the encapsulating resin material is removably disposed on the bottom of the housing concave.
    Type: Grant
    Filed: December 2, 1999
    Date of Patent: July 4, 2000
    Assignee: Matsushita Electronics Corporation
    Inventors: Masaki Utsumi, Takahiro Matsuo, Hiroshi Hidaka
  • Patent number: 5996375
    Abstract: A method of producing an optical waveguide grating by exposure to light. An optical waveguide having a core composed of a material wherein the refractive index changes due to exposure to UV light is formed into an optical waveguide grating by applying a grating portion formation step wherein a grating portion is formed by irradiation with UV light at a predetermined spacing, and an overall exposure step after formation of the grating portion wherein the entire grating portion is irradiated with UV light. As a result, the effective refractive index of the grating portion is changed so as to allow the central wavelength to be adjusted without changing the rejection. Consequently, the grating properties can be precisely and easily controlled.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: December 7, 1999
    Inventors: Michihiro Nakai, Kensuke Shima, Hiroshi Hidaka, Satoshi Okude, Masaaki Sudoh, Tetsuya Sakai, Akira Wada, Ryozo Yamauchi
  • Patent number: 5949934
    Abstract: An optical waveguide grating with radiative mode-coupling properties, with exceptional stability and reliability as an optical component, wherein the central wavelength of the rejection band has a low temperature dependence, due to the use of silica glass doped with germanium and boron for the core. The rejection bandwidth can be narrowed without increasing the grating length by forming the radiative mode-coupled optical waveguide grating in an optical waveguide wherein the mean relative refractive index difference of the core is greater than that of optical communication waveguides.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: September 7, 1999
    Assignee: Fujikura, Ltd.
    Inventors: Kensuke Shima, Michihiro Nakai, Hiroshi Hidaka, Kuniharu Himeno, Satoshi Okude, Akira Wada, Masaaki Sudoh, Tetsuya Sakai, Takuya Ienaka, Ryozo Yamauchi
  • Patent number: 5930437
    Abstract: Core comprises a main stem which is formed on a substrate, linearly extending in the beam propagating direction and short branches with a certain length which extend perpendicularly to the beam propagating direction toward both sides along the plane of the substrate and are arranged at regular intervals in the beam propagating direction. Thus, the branches are arranged in a ladder geometry when it is viewed from the top, forming a rectangular waveform arrangement. The core constitutes a grating structure in which the width of the core is made to vary periodically with the branches in the beam propagating direction.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: July 27, 1999
    Assignee: Fujikura Ltd.
    Inventors: Michihiro Nakai, Kensuke Shima, Hiroshi Hidaka, Satoshi Okude, Masaaki Sudoh, Tetsuya Sakai, Akira Wada, Ryozo Yamauchi
  • Patent number: 5531339
    Abstract: The present invention relates to a bottle made of synthetic resin, for containing various liquids, that can be easily fractured for easier handling during disposal or recycling. The bottle comprises a plurality of fracturing walls, each formed in a longitudinal band shape extending substantially in a direction of a central axis of the bottle, and main walls each disposed between the fracturing walls. The fracturing walls are made of a first material and a second material, the first material being a synthetic resin that is the same as a synthetic resin forming the main walls and/or has good compatibility with the synthetic resin of the main walls, the second material being a synthetic resin that has poor compatibility with the synthetic resin of the main walls. The bonding strength between the fracturing walls and the main walls is controlled so as to make the bottle easily fractured. If necessary, an inner covering member can be assembled within the bottle.
    Type: Grant
    Filed: November 15, 1994
    Date of Patent: July 2, 1996
    Assignee: Yoshino Kogyosho Co., Ltd.
    Inventors: Nobuo Yamanaka, Takashi Fujie, Hiroshi Hidaka, Yoshio Akiyama
  • Patent number: 5503855
    Abstract: There is disclosed a freezing-resistant oil-and-fat feedstock which is obtained by selective rearrangement with middle-chain saturated fatty acid residues at the 1st and 3rd positions of triglycerides and has a melting point of -18.degree. C. or lower as measured by differential scanning calorimetry (DSC). The oil-and-fat feedstock is composed of mixed fatty acid triglycerides (U.sub.2 M and UM.sub.2) at an mount of 10% by weight or more, based on the total weight of the feedstock, the fatty acid triglycerides consisting of unsaturated fatty acid residues (U) and middle-chain saturated fatty acid residues (M) and the ratio of U.sub.2 M to UM.sub.2 being 1/3 or higher. Also disclosed are methods for producing the freezing-resistant oil-and-fat feedstock and various kinds of frozen food utilizing the freezing-resistant oil-and-fat feedstock.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: April 2, 1996
    Assignee: Fuji Oil Company, Limited
    Inventors: Hiroshi Hidaka, Tsugio Nishimoto, Tsugio Izumi