Patents by Inventor Hiroshi Higashitani
Hiroshi Higashitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8421557Abstract: A solid electrolytic capacitor is formed by stacking flat solid electrolytic capacitor elements. Negative electrode sections of a part of the solid electrolytic capacitor elements and negative electrode sections of the remaining part of the solid electrolytic capacitor elements are led out so as to be faced to each other, and are connected to the first and second negative electrode lead frames which are independent to each other, respectively. Two of negative electrode sections are insulated from each other in the solid electrolytic capacitor.Type: GrantFiled: November 12, 2008Date of Patent: April 16, 2013Assignee: Panasonic CorporationInventors: Junichi Kurita, Hiroshi Higashitani, Tsuyoshi Yoshino
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Patent number: 7839151Abstract: A capacitor inspection device includes a substrate made of an insulating material, a first conductor unit and a second conductor unit arranged on the substrate, a signal input unit and a signal output unit attached to the substrate, a network analyzer and a pressurizing unit. The network analyzer has an input port connected to the signal input unit and an output port connected to the signal output unit. The first and second conductor units make contact with an anode and a cathode of a capacitor, respectively. The pressurizing unit presses the anode of capacitor onto the first conductor unit and the cathode onto the second conductor unit.Type: GrantFiled: April 18, 2006Date of Patent: November 23, 2010Assignee: Panasonic CorporationInventors: Junichi Kurita, Hiroshi Higashitani, Kazuo Kawahito, Tsuyoshi Yoshino
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Patent number: 7800462Abstract: A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns.Type: GrantFiled: March 16, 2009Date of Patent: September 21, 2010Assignee: Panasonic CorporationInventors: Junichi Kurita, Kenji Kuranuki, Youichi Aoshima, Hiroshi Higashitani, Tsuyoshi Yoshino
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Publication number: 20100214038Abstract: A solid electrolytic capacitor is formed by stacking flat solid electrolytic capacitor elements. Negative electrode sections of a part of the solid electrolytic capacitor elements and negative electrode sections of the remaining part of the solid electrolytic capacitor elements are led out so as to be faced to each other, and are connected to the first and second negative electrode lead frames which are independent to each other, respectively. Two of negative electrode sections are insulated from each other in the solid electrolytic capacitor.Type: ApplicationFiled: November 12, 2008Publication date: August 26, 2010Inventors: Junichi Kurita, Hiroshi Higashitani, Tsuyoshi Yoshino
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Patent number: 7612987Abstract: A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.Type: GrantFiled: February 10, 2009Date of Patent: November 3, 2009Assignee: Panasonic CorporationInventors: Junichi Kurita, Kenji Kuranuki, Youichi Aoshima, Hiroshi Higashitani, Tsuyoshi Yoshino
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Publication number: 20090174502Abstract: A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns.Type: ApplicationFiled: March 16, 2009Publication date: July 9, 2009Inventors: Junichi KURITA, Kenji KURANUKI, Youichi AOSHIMA, Hiroshi HIGASHITANI, Tsuyoshi YOSHINO
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Publication number: 20090154067Abstract: A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.Type: ApplicationFiled: February 10, 2009Publication date: June 18, 2009Inventors: Junichi Kurita, Kenji Kuranuki, Youichi Aoshima, Hiroshi Higashitani, Tsuyoshi Yoshino
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Patent number: 7423418Abstract: A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.Type: GrantFiled: January 9, 2007Date of Patent: September 9, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Higashitani, Takeo Yasuho, Masaki Hayama
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Publication number: 20080169825Abstract: A capacitor inspection device includes a substrate made of an insulating material, a first conductor unit and a second conductor unit arranged on the substrate, a signal input unit and a signal output unit attached to the substrate, a network analyzer and a pressurizing unit. The network analyzer has an input port connected to the signal input unit and an output port connected to the signal output unit. The first and second conductor units make contact with an anode and a cathode of a capacitor, respectively. The pressurizing unit presses the anode of capacitor onto the first conductor unit and the cathode onto the second conductor unit.Type: ApplicationFiled: April 18, 2006Publication date: July 17, 2008Inventors: Junichi Kurita, Hiroshi Higashitani, Kazuo Kawahito, Tsuyoshi Yoshino
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Publication number: 20070182000Abstract: A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.Type: ApplicationFiled: January 9, 2007Publication date: August 9, 2007Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Higashitani, Takeo Yasuho, Masaaki Hayama
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Patent number: 7161371Abstract: A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.Type: GrantFiled: February 19, 2003Date of Patent: January 9, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Higashitani, Takeo Yasuho, Masaaki Hayama
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Patent number: 7129680Abstract: DC/DC converter includes a voltage converting circuit connected between the input terminal and output terminal, a fast transient response circuit, a step-up and step-down operation determining circuit, a voltage comparator, and a switch control circuit.Type: GrantFiled: November 20, 2003Date of Patent: October 31, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Higashitani, Takeo Yasuho
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Patent number: 6985364Abstract: A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.Type: GrantFiled: October 4, 2002Date of Patent: January 10, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Higashitani, Masaaki Hayama, Yuji Mido
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Publication number: 20050017740Abstract: A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.Type: ApplicationFiled: February 19, 2003Publication date: January 27, 2005Inventors: Hiroshi Higashitani, Takeo Yasuho, Masaaki Hayama
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Patent number: 6828670Abstract: A module component includes a wiring circuit pattern formed on an insulated resin layer, and a connecting conductor, which is formed within the insulated resin layers, for electrically connecting at least two of the wiring circuit patterns each other. The module component further includes an active component and a passive component, which are formed on at least one of the wiring circuit patterns and electrically connected thereto, and a coil formed within a laminated member. The coil is formed of a coil pattern made of a conductive material, and formed on the insulated resin layer. Magnetic materials, which are formed on the insulated resin layers, sandwich the coil pattern.Type: GrantFiled: June 9, 2003Date of Patent: December 7, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaaki Hayama, Hiroshi Higashitani
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Publication number: 20040141341Abstract: A DC/DC converter presented herein is capable of operating in both step-up and step-down process of output voltage, lowering the output voltage at high speed at the time of output voltage drop, or raising the output voltage at high speed at the time of output voltage rise, and decreasing generation of power loss at the time of transient response. This DC/DC converter can extend the call time of handy phone. The DC/DC converter comprises a voltage converting circuit connected between the input terminal and output terminal, a fast transient response circuit, a step-up and step-down operation determining circuit, a voltage comparator, and a switch control circuit.Type: ApplicationFiled: November 20, 2003Publication date: July 22, 2004Inventors: Hiroshi Higashitani, Takeo Yasuho
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Publication number: 20040070950Abstract: A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.Type: ApplicationFiled: July 30, 2003Publication date: April 15, 2004Inventors: Hiroshi Higashitani, Masaaki Hayama, Yuji Mido
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Publication number: 20040021218Abstract: A module component includes a wiring circuit pattern formed on an insulated resin layer, and a connecting conductor, which is formed within the insulated resin layers, for electrically connecting at least two of the wiring circuit patterns each other. The module component further includes an active component and a passive component, which are formed on at least one of the wiring circuit patterns and electrically connected thereto, and a coil formed within a laminated member. The coil is formed of a coil pattern made of a conductive material, and formed on the insulated resin layer. Magnetic materials, which are formed on the insulated resin layers, sandwich the coil pattern.Type: ApplicationFiled: June 9, 2003Publication date: February 5, 2004Inventors: Masaaki Hayama, Hiroshi Higashitani
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Patent number: 5535244Abstract: A digital modulating/demodulating apparatus includes a demodulator for demodulating a modulated signal into a demodulated positional signal in response to a receipt of the modulated signal, a decoder for decoding the demodulated positional signal into a digital signal of N bits. A previous signal point on the constellation plane is defined by a previous demodulated positional signal and a current signal point on the constellation plane is defined by a current demodulated positional signal. The decoder outputs a digital signal of N bits, based on en amplitude and a phase of the previous signal point and the amplitude and the phase of the current signal point.Type: GrantFiled: June 2, 1994Date of Patent: July 9, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Etsuto Nakatsu, Hiroshi Higashitani, Haruo Ohta