Abstract: Methods for manufacturing a solar cell that includes a first substrate, a first electrode layer, a first electron transport layer, a first photoelectric conversion layer, a first hole transport layer, a second electrode layer, a third electrode layer, a second electron transport layer, a second photoelectric conversion layer, a second hole transport layer, a fourth electrode layer, and a second substrate that are disposed in the order stated. The first photoelectric conversion layer includes a first perovskite compound, and the second photoelectric conversion layer includes a second perovskite compound. The first perovskite compound has a bandgap greater than a bandgap of the second perovskite compound.

Abstract: A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

Abstract: A photoelectric conversion module according to the present disclosure includes: a substrate; a photoelectric conversion element; and a first sealing member, wherein the photoelectric conversion element is sealed by the substrate and the first sealing member, the first sealing member includes a first sealing portion formed of a first sealing material, and the first sealing material includes at least one selected from the group consisting of polyvinyl alcohol, an ethylene-vinyl alcohol copolymer, and a butylenediol-vinyl alcohol copolymer. The photoelectric conversion element may include, for example, a first electrode, a photoelectric conversion layer, and a second electrode in this order.

Abstract: A transfer material is stably transferred to a transfer object. A transfer method for transferring to the object the transfer material applied to a film portion fixed to a frame portion includes peeling a film portion from the object. In the peeling, while a first side of the frame portion is elevated, a roller portion is moved in a direction from the first side toward a second side so that the position of a boundary line between a peeled region where the film portion is peeled off from the object and an unpeeled region where the film portion is not peeled off from the object coincides with the position of a rotation shaft in the roller portion pressing the film portion while rotating.

Abstract: An adhesive transfer method for transferring an adhesive formed on a surface of a film onto an object, includes a pressurizing step of pressurizing the film from the back surface side thereof by a pressurizing member against the object; and a moving step of moving the pressurizing member from a first end toward a second end of the object in a given moving direction. In the moving step, the film is held, with a downstream part on the farther downstream side than a pressurized part that is pressurized by the pressurizing member in the moving direction being separated from the object, and with an upstream part on the farther upstream side than the pressurized part being separated from the object, and a part of the adhesive formed at the downstream part is released at the upstream part, so that a part of the adhesive is transferred onto the object.

Abstract: A semiconductor material of the present disclosure is represented by formula (I) below, in which R1, R2, and R3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, R4 represents an aryl group, an amino group, a hydroxy group, or an alkoxy group, and n represents an integer greater than or equal to 2; and a photoelectric conversion element of the present disclosure includes a first electrode, a photoelectric conversion layer, a hole transport layer, and a second electrode in this order, in which the hole transport layer includes the semiconductor material of the present disclosure:

Abstract: An electronic device of the present disclosure comprises a first electrode, a photoelectric conversion layer, a hole transport layer, and a second electrode that are disposed in the order stated. In the electronic device of the present disclosure, the second electrode comprises a conductive material and a first p-type dopant. The electronic device of the present disclosure may further comprise, for example, an electron transport layer. The electron transport layer is disposed, for example, between the first electrode and the photoelectric conversion layer.

Abstract: A composition of the present disclosure comprises a conductive material, a p-type dopant, and a solvent. The solvent comprises at least one compound selected from the group consisting of alcohols, aliphatic hydrocarbons, siloxanes, esters, and ethers. A method of the present disclosure for manufacturing an electronic device comprises forming a second electrode with the composition of the present disclosure and stacking a first electrode, a photoelectric conversion layer, a hole transport layer, and the second electrode in the order stated.

Abstract: A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

Abstract: A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

Abstract: A solar cell includes a first substrate, a first electrode layer, a first electron transport layer, a first photoelectric conversion layer, a first hole transport layer, a second electrode layer, a third electrode layer, a second electron transport layer, a second photoelectric conversion layer, a second hole transport layer, a fourth electrode layer, and a second substrate that are disposed in the order stated. The first photoelectric conversion layer includes a first perovskite compound, and the second photoelectric conversion layer includes a second perovskite compound. The first perovskite compound has a bandgap greater than a bandgap of the second perovskite compound.

Abstract: A liquid ejection apparatus includes at least one ink tank which is ink-refillable from outside, a liquid ejection head that ejects an ink supplied from the ink tank, and a housing that contains the ink tank and the liquid ejection head inside. The at least one ink tank is fixed to a housing wall of at least one surface out of surfaces forming the housing. Moreover, one surface out of surfaces forming the ink tank, which is attached to the housing wall, is either a surface having the largest area of the ink tank or a surface opposed to the surface having the largest area.

Abstract: A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

Abstract: A liquid ejection apparatus includes at least one ink tank which is ink-refillable from outside, a liquid ejection head that ejects an ink supplied from the ink tank, and a housing that contains the ink tank and the liquid ejection head inside. The at least one ink tank is fixed to a housing wall of at least one surface out of surfaces forming the housing. Moreover, one surface out of surfaces forming the ink tank, which is attached to the housing wall, is either a surface having the largest area of the ink tank or a surface opposed to the surface having the largest area.

Abstract: A method of manufacturing an inkjet head substrate is provided. The inkjet head substrate includes an ink supply port having a through portion and a non-through portion, and the non-through portion is disposed at a position closer than the through portion to the energy generating element. The method includes disposing a mask having an opening that has a relatively large opening-width portion and a relatively small opening-width portion. The method also includes forming the through portion in the substrate at a position corresponding to the relatively large opening-width portion and the non-through portion in the substrate at a position corresponding to the relatively small opening-width portion by performing reactive ion etching on the substrate through the opening of the mask in one operation.

Abstract: A solar cell module includes a substrate, an element section disposed on the substrate and including a unit cell, a sealer, and a first material. The element section and the first material are housed in a space sealed with the sealer. The unit cell includes a pair of electrodes having conductivity and includes a light-absorbing layer located between the pair of electrodes and converting light into electric charge. The light-absorbing layer includes a perovskite compound represented by a compositional formula AMX3, where A represents a monovalent cation, M represents a divalent cation, and X represents a monovalent anion. The first material is an amine derivative represented by a compositional formula (Q1Q2Q3-N—H)Y, where Q1, Q2, and Q3 each independently represent a functional group including at least one element selected from the group consisting of carbon, hydrogen, nitrogen, and oxygen; and Y represents a halogen.

Abstract: A liquid discharge head includes a substrate that is provided with a supply passage having an opening; an energy generating element that is disposed on a surface of the substrate; an electric wiring layer; an insulation layer; and a discharge port member that forms a discharge port. The insulation layer has an end portion adjacent to the opening of the supply passage and set back from an edge of the opening of the supply passage toward a side where the energy generating element is disposed. The electric wiring layer includes a plurality of electric wiring layers layered on each other.

Abstract: Provided is a liquid ejection head substrate, in which a plurality of units are arranged. Each of the units includes: a pressure generating element formed on a first surface of a support substrate; and a pair of independent liquid chambers, which are formed on both sides of the pressure generating element so as to be opposed to each other, and are opened to the first surface of the support substrate. The liquid ejection head substrate includes, in the support substrate: a first common liquid chamber communicating to a plurality of independent liquid chambers on one side of the pair of independent liquid chambers; a second common liquid chamber communicating to a plurality of independent liquid chambers on another side of the pair of independent liquid chambers; and a partition wall separating the first common liquid chamber and the second common liquid chamber from each other.

Abstract: A method of manufacturing an inkjet head substrate is provided. The inkjet head substrate includes an ink supply port having a through portion and a non-through portion, and the non-through portion is disposed at a position closer than the through portion to the energy generating element. The method includes disposing a mask having an opening that has a relatively large opening-width portion and a relatively small opening-width portion. The method also includes forming the through portion in the substrate at a position corresponding to the relatively large opening-width portion and the non-through portion in the substrate at a position corresponding to the relatively small opening-width portion by performing reactive ion etching on the substrate through the opening of the mask in one operation.

Abstract: A solar cell module includes a substrate, and first and second cells connected in series. The first and second cells each include a first electrode, a first semiconductor layer, a second semiconductor layer and a second electrode stacked in this order on the substrate. The first semiconductor layer contains an oxide of a first metal and includes first and second portions. A groove separates the second semiconductor layers of the first and second cells. The groove and the first portion entirely overlap each other in a plan view. The first portion contains a second metal different from the first metal. A ratio of a number of atoms of the second metal to a number of atoms of all metals in the first portion is grater than a ratio of a number of atoms of the second metal to a number of atoms of all metals in the second portion.