Abstract: An injection molding machine using a plurality of metal molds 2 and a plurality of stations S1 to S10, for executing molding by moving the metal molds in rotation and in one direction includes on one of the sides of the metal molds a plurality of heat pipes 5 which are fitted into the molds and one of the ends of which protrudes from the metal mold, and a heat transfer plate 6 so disposed as to cover a projection portion 5a of the heat pipe protruding from the metal mold. Temperature adjustment plates 4 connected to a temperature adjustment machine 4 are disposed on the other station side and while the metal mold is halted at the station, the temperature adjustment plates clamp the heat transfer plate and adjust the temperature of said metal mold.

Abstract: An injection molding machine using a plurality of metal molds 2 and a plurality of stations S1 to S10, for executing molding by moving the metal molds in rotation and in one direction includes on one of the sides of the metal molds a plurality of heat pipes 5 which are fitted into the molds and one of the ends of which protrudes from the metal mold, and a heat transfer plate 6 so disposed as to cover a projection portion 5a of the heat pipe protruding from the metal mold. Temperature adjustment plates 4 connected to a temperature adjustment machine 4 are disposed on the other station side and while the metal mold is halted at the station, the temperature adjustment plates clamp the heat transfer plate and adjust the temperature of said metal mold.

Abstract: A semiconductor device includes a sealed vessel accommodating a semiconductor body and a heating element. When the semiconductor body is not energized, the heating unit is heated.