Patents by Inventor Hiroshi Hishiki

Hiroshi Hishiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4894271
    Abstract: Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.
    Type: Grant
    Filed: May 6, 1988
    Date of Patent: January 16, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kiyoshi Hani, Mutsuko Hayama, Yoshio Nishimoto, Hiroshi Hishiki, Minoru Kimura, Tatsushi Nakai