Patents by Inventor Hiroshi HOZOUJI

Hiroshi HOZOUJI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 9177833
    Abstract: Conventional surface roughening plating technology cannot always improve the adhesion between a leadframe and a plating film and it depends on the material used for surface roughening plating. Conventional surface roughening technology by etching can only be used for leadframes made of limited materials. Improved adhesion cannot therefore be achieved between a metal member such as leadframe and a sealing resin. A manufacturing method of a semiconductor device according to one embodiment is to carry out resin sealing using a metal member such as leadframe which has been subjected to alloying treatment of a base material and Zn plated on the surface thereof.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: November 3, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Takuya Nakajo, Masaki Tamura, Yasushi Takahashi, Keiichi Okawa, Ryoichi Kajiwara, Sigehisa Motowaki, Hiroshi Hozouji
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20130228907
    Abstract: Conventional surface roughening plating technology cannot always improve the adhesion between a leadframe and a plating film and it depends on the material used for surface roughening plating. Conventional surface roughening technology by etching can only be used for leadframes made of limited materials. Improved adhesion cannot therefore be achieved between a metal member such as leadframe and a sealing resin. A manufacturing method of a semiconductor device according to one embodiment is to carry out resin sealing using a metal member such as leadframe which has been subjected to alloying treatment of a base material and Zn plated on the surface thereof.
    Type: Application
    Filed: February 15, 2013
    Publication date: September 5, 2013
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Takuya NAKAJO, Masaki TAMURA, Yasushi TAKAHASHI, Keiichi OKAWA, Ryoichi KAJIWARA, Sigehisa MOTOWAKI, Hiroshi HOZOUJI