Abstract: In an RFID tag including an IC chip for storing information, a thermoplastic resin surrounding the IC chip, and a circuit for transmitting or receiving radio signals bearing the information, the circuit is further fixedly adhered on the thermoplastic resin in a fashion being exposed out of the surface of the thermoplastic resin. Accordingly, a manufacturing process may be used for covering the IC chip mounted and bonded on the plate-likebody with the thermoplastic resin to thereafter form the circuit. It is thus possible to manufacture a thin RFID tag in a simplified manufacturing process.

Abstract: With a multi-layer printed circuit bare board has 2n circuit layers, where n is a natural number exceeding a unity, electrical connections are established between the (2i−1)-th layer and the 2i-th layer, where i=1, 2 . . . , n, by holes which are created through insulation material layers in between and filled with copper plating. Electrical connections are also accomplished between the 4i-th layer and the (4i−3)-th layer by holes created through insulation material layers in between and filled with copper plating. Higher dimensional accuracy and fewer process steps are achieved.