Patents by Inventor Hiroshi Ikami

Hiroshi Ikami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5322205
    Abstract: A joining method of an aluminum member to a dissimilar metal member excluding copper by brazing or soldering through the use of a brazing filler metal or a solder for aluminum member; in which a plating composed of a metal voluntarily selected from copper, aluminum, zinc, lead, silicon, cadmium, tin and an alloy having major component of two or more kinds of them, is previously applied on a surface of joined portion of the dissimilar metal member, the plated joined portion of the dissimilar metal member is dipped in a molten brazing filler metal or a molten solder and ultrasonic vibration is given to the joined portion to stick the brazing filler metal or the solder to the joined portion, and a brazing or a soldering is carried out thereafter.
    Type: Grant
    Filed: April 23, 1993
    Date of Patent: June 21, 1994
    Assignee: Nippon Aluminum Co., Ltd.
    Inventors: Shuichiro Kato, Masao Kinoshita, Hiroshi Ikami