Abstract: Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5.

Abstract: Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5.

Abstract: The present invention provides a process for preparing a solvent-soluble polyimide copolymer synthesized from a 6,6-imide segment having an imide oligomer with PMDA at both ends produced by adding 4 molar equivalents of pyromellitic dianhydride (PMDA) and 2 molar equivalents of diaminotoluene (DAT) to an imide oligomer produced by heating 1 molar equivalent of biphenyltetracarboxylic dianhydride (BPDA) and 2 molar equivalents of diaminodiphenyl ether (DADE) at 160-200° C. in the presence of a catalyst in an organic polar solvent.

Abstract: A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.

Abstract: The present invention provides a process for preparing a solvent-soluble polyimide copolymer synthesized from a 6,6-imide segment having an imide oligomer with PMDA at both ends produced by adding 4 molar equivalents of pyromellitic dianhydride (PMDA) and 2 molar equivalents of diaminotoluene (DAT) to an imide oligomer produced by heating 1 molar equivalent of biphenyltetracarboxylic dianhydride (BPDA) and 2 molar equivalents of diaminodiphenyl ether (DADE) at 160-200° C. in the presence of a catalyst in an organic polar solvent.

Abstract: Disclosed is a composition of a negative-type photosensitive polyimide which is solvent soluble, which is excellent in adhesiveness, heat resistance, mechanical properties and in flexibility, which shows characteristics of alkali-soluble highly sensitive negative-type photoresist upon irradiation with light, The composition according to the present invention comprises a photo radical initiator and a solvent-soluble polyimide which shows negative-type photosensitivity in the presence of the photo radical initiator.

Abstract: The invention relates to a reaction development patterning process wherein a photo resist layer masked by a desired pattern is irradiated using ultraviolet light and this layer is subsequently washed using a solvent solution containing alkali characterized by said photo resist layer comprising a condensation type polymer containing in the main chain carbonyl groups (C?O) bonded to hetero atoms and a photo acid generating agent and said alkali being an amine. This reaction development patterning process is characterized by being able to use as a photo resist target resins containing bonds having low reactivity toward nucleophilic reagents, for example, condensation type polymers containing any one of bonds such as carbonate, ester, urethane and amide.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.

Abstract: Polyimides consisting of PMDA and an aromatic diamine are normally solvent-insoluble. According to the present invention, they are solubilized in solvents to prepare four-component or higher block copolymers containing BTDA. PMDA is reacted with a certain type of aromatic diamine in a molar ratio of 1:2-1.5 to produce a solvent-soluble oligomer. This is combined with an acid dianhydride and an aromatic diamine to produce a four-component or higher solvent-soluble block copolymer. The molar ratio of the aromatic diamine added with PMDA is 1:2-1.5. A number of solvent-soluble block copolymers containing PMDA can be prepared. Four-component or higher polyimide block copolymers containing PMDA, BTDA, and DAT are prepared by sequential reactions in the presence of a binary catalyst. This made it possible to prepare various polyimides from many inexpensively available materials.

Abstract: The invention provides a block copolymerization polyimide composition comprising a block copolymerization polyimide obtained by heating a tetracarboxylic dianhydride and a diamine in at least one solvent selected from a ketone, an ether and an ester and in the presence of a catalyst generated from a lactone and a base, a positive type block copolymerization polyimide composition or ink containing a photooxygenation agent, and processes of producing them. The block copolymerization polyimide composition of the invention is never whitened even in the air.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: A polyimide-based polycondensate which may be used as an insulation film by coating a copper foil with the polycondensate and by heating the coated copper foil, which insulation film does not warp the foil, as well as a production process thereof, is disclosed. The polycondensate according to the invention is a solvent-soluble polycondensate containing a benzoxazole component having a carboxylic group and an imide component having a phenolic hydroxyl group, which is obtained by dehydration-condensing one or more tetracarboxylic dianhydrides with one or more aromatic diamines having an amino group and a phenolic hydroxyl group, the amino group and the phenolic hydroxyl group being located at ortho positions with respect to each other, by heating the one or more tetracarboxylic dianhydrides and the one or more aromatic diamines at 150° C. to 220° C. in the presence of an acid catalyst.

Abstract: The invention relates to a reaction development patterning process wherein a photo resist layer masked by a desired pattern is irradiated using ultraviolet light and this layer is subsequently washed using a solvent solution containing alkali characterized by said photo resist layer comprising a condensation type polymer containing in the main chain carbonyl groups (C═O) bonded to hetero atoms and a photo acid generating agent and said alkali being an amine. This reaction development patterning process is characterized by being able to use as a photo resist target resins containing bonds having low reactivity toward nucleophilic reagents, for example, condensation type polymers containing any one of bonds such as carbonate, ester, urethane and amide.

Abstract: This invention relates to a photosensitive polyimide material having positive-type or negative-type photosensitivity, which may be developed with a high resolution with an irradiation energy having short wavelength such as ultraviolet light or electron beam. The positive-type photosensitive polyimide composition comprising a solvent-soluble polyimide which shows positive-type photosensitivity in the presence of a photoacid generator, which is obtained by polycondensation of at least one aliphatic tetracarboxylic dianhydride and/or alicyclic tetracarboxylic dianhydride and at least one aliphatic diamine and/or alicyclic diamine and/or diaminosiloxane; and the photoacid generator. Since the polyimide has negative-type photosensitivity when irradiated with electron beam in the absence of a photoacid generator, a method for forming negative-type polyimide pattern using the polyimide is also provided.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble organic insulating material. The superconducting integrated circuit is produced by a method Eat includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: Disclosed is a composition of a negative-type photosensitive polyimide which is solvent soluble, which is excellent in adhesiveness, heat resistance, mechanical properties and in flexibility, which shows characteristics of alkali-soluble highly sensitive negative-type photoresist upon irradiation with light. The composition according to the present invention comprises a photo radical initiator and a solvent-soluble polyimide which shows negative-type photosensitivity in the presence of the photo radical initiator.

Abstract: A composition for electro-depositing polyimide membranes which can be patterned by photolithography, which are excellent in heat resistance, insulation performance and in chemical resistance. The composition for electrodeposition of polyimides according to the present invention comprises a composition for electrodeposition of polyimides comprising a photoacid generator, a positive-type photosensitive polyimide having oxycarbonyl groups in side chains, a polar solvent which dissolves said polyimide, water, a dispersing agent, and an alkaline neutralizer.

Abstract: A photosensitive polyimide composition which is soluble in an organic solvent, which is excellent in adhesiveness, heat resistance, mechanical properties and flexibility, which shows the property of highly sensitive positive-type photoresist that is soluble in alkali upon irradiation with light is disclosed. The polyimide composition of the present invention contains a photoacid generator and a solvent-soluble polyimide which shows positive-type photosensitivity in the presence of said photoacid generator.