Patents by Inventor Hiroshi Kamezaki

Hiroshi Kamezaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing a multi-layer wiring board
    Patent number: 5593526
    Abstract: A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the matrix. The glass ceramic layers are caused to contain hollow or porous silica glass spheres dispersed in the glass ceramic material. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing alumina as a constituent element. Such a structure prevents crystallization of the silica spheres and avoids the resultant rapid increase in the the thermal expansion coefficient of the glass ceramic layers. The structure provided by the process of the invention also precudes the formation of pores in the surfaces of the glass ceramic layers.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: January 14, 1997
    Assignee: Fujitsu Limited
    Inventors: Kishio Yokouchi, Hiroshi Kamezaki, Masato Wakamura, Nobuo Kamehara, Koichi Niwa
  • Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant
    Patent number: 5534331
    Abstract: A method in which a multi-layered ceramic circuit board made of a hybrid laminate consisting of green sheets containing hollow silica and green sheets containing no hollow silica is manufactured without failures occurring during the firing of the laminate. By incorporating quartz glass into a first ceramic material containing hollow silica to replace part of the hollow silica with quartz glass, the compositions of the first ceramic material and a second ceramic material containing no hollow silica are controlled so that the difference between the percentages of shrinkage on firing of the green sheets formed of the first and second ceramic materials is within 1%.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: July 9, 1996
    Assignee: Fujitsu Limited
    Inventors: Shigenori Aoki, Hiroshi Kamezaki, Masaharu Hida, Kishio Yokouchi
  • Process for manufacturing multi-layer glass ceramic substrate
    Patent number: 5458709
    Abstract: A process for manufacturing a multi-layer glass ceramic substrate which includes the steps of forming green sheets containing ceramic powders and glass powders as main ingredients, laminating the green sheets, and firing the laminated green sheets to form a multi-layer glass ceramic substrate, wherein at least one green sheet containing porous glass powders as a part of the glass powders, is provided to control the shrinkage of the green sheets and prevent cracks or delamination.
    Type: Grant
    Filed: April 13, 1992
    Date of Patent: October 17, 1995
    Assignee: Fujitsu Limited
    Inventors: Hiroshi Kamezaki, Masato Wakamura, Kishio Yokouchi, Nobuo Kamehara
  • Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant
    Patent number: 5324370
    Abstract: A method in which a multi-layered ceramic circuit board made of a hybrid laminate consisting of green sheets containing hollow silica and green sheets containing no hollow silica is manufactured without failures occurring during the firing of the laminate. By incorporating quartz glass into a first ceramic material containing hollow silica to replace part of the hollow silica with quartz glass, the compositions of the first ceramic material and a second ceramic material containing no hollow silica are controlled so that the difference between the percentages of shrinkage on firing of the green sheets formed of the first and second ceramic materials is within 1%.
    Type: Grant
    Filed: February 24, 1993
    Date of Patent: June 28, 1994
    Assignee: Fujitsu Limited
    Inventors: Shigenori Aoki, Hiroshi Kamezaki, Masaharu Hida, Kishio Yokouchi
  • Multi-layer wiring board
    Patent number: 5275889
    Abstract: A laminated multi-layer wiring board comprising alternate layers of a glass ceramic material and conductor pattern. The glass ceramic layers are made of a glass ceramic comprising glass and dispersed ceramic particles. The glass ceramic layers further contain hollow or porous silica glass spheres dispersed in the glass ceramic. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing aluminum as a constituent element. Such a structure prevents crystallization of the silica spheres and the resultant rapid increase in the thermal expansion coefficient of the glass ceramic layer. The structure also procludes the formation of pores in the surfaces of the spheres.
    Type: Grant
    Filed: September 20, 1991
    Date of Patent: January 4, 1994
    Assignee: Fujitsu Limited
    Inventors: Kishio Yokouchi, Hiroshi Kamezaki, Masato Wakamura, Nobuo Kamehara, Koichi Niwa
  • Method for preparing green sheets
    Patent number: 5196384
    Abstract: Methods for preparing a green sheet and a glass ceramic substrate are herein disclosed.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: March 23, 1993
    Assignee: Fujitsu Limited
    Inventors: Hiroshi Kamezaki, Masato Wakamura, Kishio Yokouchi, Yoshihiko Imanaka, Nobuo Kamehara