Patents by Inventor Hiroshi Kamiga
Hiroshi Kamiga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10833209Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.Type: GrantFiled: September 5, 2017Date of Patent: November 10, 2020Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Kenichi Harigae, Hiroshi Kamiga, Noriaki Nogami
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Patent number: 10807161Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.Type: GrantFiled: March 11, 2019Date of Patent: October 20, 2020Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Naoki Tahara, Noriaki Nogami, Hiroshi Kamiga
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Patent number: 10580910Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same.Type: GrantFiled: January 26, 2017Date of Patent: March 3, 2020Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Hiroshi Kamiga, Noriaki Nogami, Aiko Hirata
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Patent number: 10460851Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.Type: GrantFiled: March 15, 2017Date of Patent: October 29, 2019Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
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Publication number: 20190247920Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.Type: ApplicationFiled: March 11, 2019Publication date: August 15, 2019Inventors: Naoki TAHARA, Noriaki NOGAMI, Hiroshi KAMIGA
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Patent number: 10381124Abstract: To provide a silver powder including alkenylsuccinic anhydride and/or alkenylsuccinic acid on a surface of the silver powder.Type: GrantFiled: August 22, 2016Date of Patent: August 13, 2019Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Naoki Tahara, Hiroshi Kamiga
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Publication number: 20190189810Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.Type: ApplicationFiled: September 5, 2017Publication date: June 20, 2019Inventors: Kenichi Harigae, Hiroshi Kamiga, Noriaki Nogami
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Patent number: 10272490Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.Type: GrantFiled: September 25, 2015Date of Patent: April 30, 2019Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Naoki Tahara, Noriaki Nogami, Hiroshi Kamiga
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Patent number: 10252331Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.Type: GrantFiled: July 27, 2015Date of Patent: April 9, 2019Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Taro Nakanoya, Hiroshi Kamiga
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Publication number: 20190080815Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.Type: ApplicationFiled: March 15, 2017Publication date: March 14, 2019Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
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Publication number: 20190027620Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same.Type: ApplicationFiled: January 26, 2017Publication date: January 24, 2019Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Hiroshi Kamiga, Noriaki Nogami, Aiko Hirata
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Patent number: 10170213Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.Type: GrantFiled: January 2, 2018Date of Patent: January 1, 2019Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
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Publication number: 20180272425Abstract: A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a silver supporting solution of a potassium silver cyanide solution (or a potassium silver cyanide solution containing at least one selected from the group consisting of potassium pyrophosphate, boric acid, tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid) to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of silver to be supported on the surface of the copper powder coated with the silver containing layer.Type: ApplicationFiled: January 6, 2016Publication date: September 27, 2018Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Noriaki Nogami, Hiroshi Kamiga
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Publication number: 20180240566Abstract: To provide a silver powder including alkenylsuccinic anhydride and/or alkenylsuccinic acid on a surface of the silver powder.Type: ApplicationFiled: August 22, 2016Publication date: August 23, 2018Inventors: Naoki Tahara, Hiroshi Kamiga
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Patent number: 9993871Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 ?m or more but 6.0 ?m or less, and a ratio of [(D90?D10)/D50] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.Type: GrantFiled: July 27, 2015Date of Patent: June 12, 2018Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Taro Nakanoya, Hiroshi Kamiga
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Publication number: 20180158564Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.Type: ApplicationFiled: January 2, 2018Publication date: June 7, 2018Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
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Patent number: 9984788Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.Type: GrantFiled: July 24, 2015Date of Patent: May 29, 2018Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
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Publication number: 20170259333Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.Type: ApplicationFiled: July 27, 2015Publication date: September 14, 2017Inventors: Taro Nakanoya, Hiroshi Kamiga
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Publication number: 20170259334Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 ?m or more but 6.0 ?m or less, and a ratio of [(D90?D10)/D5o] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.Type: ApplicationFiled: July 27, 2015Publication date: September 14, 2017Applicant: DOWA Electronics Materials Co., Ltd.Inventors: Taro Nakanoya, Hiroshi Kamiga
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Publication number: 20170232510Abstract: There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.Type: ApplicationFiled: August 21, 2015Publication date: August 17, 2017Applicant: Dowa Electronics Materials Co., Ltd.Inventors: Noriaki Nogami, Hiroshi Kamiga