Patents by Inventor Hiroshi Kamiyama

Hiroshi Kamiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925639
    Abstract: Provided is a pharmaceutical composition for treating a tumor, which is used in combination therapy of lenvatinib and (6S,9aS)—N-benzyl-8-({6-[3-(4-ethylpiperazin-1-yl)azetidin-1-yl]pyridin-2-yl}methyl)-6-(2-fluoro-4-hydroxybenzyl)-4,7-dioxo-2-(prop-2-en-1-yl)hexahydro-2H-pyrazino[2,1-c][1,2,4]triazine-1(6H)-carboxamide.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: March 12, 2024
    Assignee: Eisai R&D Management Co., Ltd.
    Inventors: Yoichi Ozawa, Yusaku Hori, Kazuhiko Yamada, Hiroshi Kamiyama, Masahiro Matsuki
  • Patent number: 11104776
    Abstract: A liquid resin composition may include a base resin (A) in an amount of 100 parts by weight, a chemical foaming agent (B) in an amount of 2 parts by weight or more and 100 parts by weight or less, and water (C) in an amount of 1 part by weight or more and 30 parts by weight or less. The base resin may be a polymer that includes a hydrolyzable group bonded to a silicon atom, at least one reactive silicon group that is capable of being crosslinked by forming a siloxane bond, and a main chain that is constituted by an oxyalkylene-based monomer unit. The chemical foaming agent (B) may include a bicarbonate (B-1) and an acidic compound (B-2) having an acid dissociation constant pKa of 3.0 or less.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: August 31, 2021
    Assignee: KANEKA CORPORATION
    Inventor: Hiroshi Kamiyama
  • Publication number: 20210261746
    Abstract: Provided is a resin composition for a foam that may include a base resin having a reactive silicon group (A), a chemical foaming agent (B), and a silanol condensation catalyst (D), wherein the chemical foaming agent (B) comprises a dicarbonate diester (B-1). Further provided is a method for producing a foam, that may include: a mixing step of mixing a liquid, which may include a base resin having a reactive silicon group (A) and a dicarbonate diester (B-1), with a silanol condensation catalyst (D) to obtain a mixed liquid, wherein in the mixed liquid, a rate of foaming effected by decomposition of the dicarbonate diester (B-1), and a rate of a curing reaction of the mixed liquid effected by a reaction between the reactive silicon groups may each be adjusted, such that a foam having an expansion ratio of 2-fold or more and 60-fold or less is obtained.
    Type: Application
    Filed: March 27, 2019
    Publication date: August 26, 2021
    Applicant: KANEKA CORPORATION
    Inventor: Hiroshi Kamiyama
  • Publication number: 20190388420
    Abstract: Provided is a pharmaceutical composition for treating a tumor, which is used in combination therapy of lenvatinib and (6S,9aS)—N-benzyl-8-({6-[3-(4-ethylpiperazin-1-yl)azetidin-1-yl]pyridin-2-yl}methyl)-6-(2-fluoro-4-hydroxybenzyl)-4,7-dioxo-2-(prop-2-en-1-yl)hexahydro-2H-pyrazino[2,1-c][1,2,4]triazine-1(6H)-carboxamide.
    Type: Application
    Filed: February 6, 2018
    Publication date: December 26, 2019
    Applicant: Eisai R&D Management Co., Ltd.
    Inventors: Yoichi Ozawa, Yusaku Hori, Kazuhiko Yamada, Hiroshi Kamiyama, Masahiro Matsuki
  • Publication number: 20190284361
    Abstract: A liquid resin composition may include a base resin (A) in an amount of 100 parts by weight, a chemical foaming agent (B) in an amount of 2 parts by weight or more and 100 parts by weight or less, and water (C) in an amount of 1 part by weight or more and 30 parts by weight or less. The base resin may be a polymer that includes a hydrolyzable group bonded to a silicon atom, at least one reactive silicon group that is capable of being crosslinked by forming a siloxane bond, and a main chain that is constituted by an oxyalkylene-based monomer unit. The chemical foaming agent (B) may include a bicarbonate (B-1) and an acidic compound (B-2) having an acid dissociation constant pKa of 3.0 or less.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 19, 2019
    Applicant: KANEKA CORPORATION
    Inventor: Hiroshi Kamiyama
  • Patent number: 10294342
    Abstract: A film includes: a coating layer made of a fluorine-containing acrylic resin; and a base film, on which the coating layer is laminated. The fluorine-containing acrylic resin is obtained by copolymerizing 50 to 99 parts by weight of a monomer represented by a general formula (1) with 50 to 1 parts by weight of a methacrylate-based monomer, and a melt viscosity of the fluorine-containing acrylic resin is less than 300 Pa·s under conditions of a die temperature of 220° C., a shear rate of 122 sec?1, and a capillary die diameter of 1 mm based on JIS K7199. In the general formula (1), R1 is a direct bond or a straight-chain or branched-chain alkylene group containing 1 to 4 carbon atoms, and R2 is methyl.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: May 21, 2019
    Assignee: KANEKA CORPORATION
    Inventor: Hiroshi Kamiyama
  • Publication number: 20170058088
    Abstract: A film includes: a coating layer made of a fluorine-containing acrylic resin; and a base film, on which the coating layer is laminated. The fluorine-containing acrylic resin is obtained by copolymerizing 50 to 99 parts by weight of a monomer represented by a general formula (1) with 50 to 1 parts by weight of a methacrylate-based monomer, and a melt viscosity of the fluorine-containing acrylic resin is less than 300 Pa·s under conditions of a die temperature of 220° C., a shear rate of 122 sec?1, and a capillary die diameter of 1 mm based on JIS K7199. In the general formula (1), R1 is a direct bond or a straight-chain or branched-chain alkylene group containing 1 to 4 carbon atoms, and R2 is methyl.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Applicant: Kaneka Corporation
    Inventor: Hiroshi Kamiyama
  • Patent number: 9576722
    Abstract: A coil component 1 includes a thin-film coil layer including spiral conductors and bump electrodes 12a to 12d formed on a surface of the thin-film coil layer. The thin-film coil layer includes internal terminal electrodes 24a to 24d connected respectively to corresponding one ends of the spiral conductors, and a fourth insulating layer 15d covering the internal terminal electrode 24a to 24d and having openings ha to hd. Both a top surface TS and a side surface SS of each of the internal terminal electrodes 24a to 24d are exposed through the corresponding opening. The bump electrodes 12a to 12d are each brought into contact with both the top surface TS and side surface SS of each of the internal terminal electrodes 24a to 24d in the corresponding opening.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: February 21, 2017
    Assignee: TDK CORPORATION
    Inventors: Fumio Watanabe, Naozumi Ishikawa, Hiroshi Kamiyama
  • Patent number: 9532461
    Abstract: A first alignment mark is given to a substrate, and a second alignment mark is given to a mask. The mask forms an electronic circuit pattern on the substrate. A control unit performs alignment of the mask and the substrate based on the first and second alignment marks. The second alignment mark is formed to surround the first alignment mark. The second alignment mark has a step pattern therein.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: December 27, 2016
    Assignee: TDK CORPORATION
    Inventors: Naozumi Ishikawa, Fumio Watanabe, Hiroshi Kamiyama
  • Patent number: 9229135
    Abstract: Provided is a composition for use in producing a film having a prism type retroreflection structure, the composition being capable of favorably forming a prism type retroreflection structure by thermal transfer, while being superior in weather resistance and transparency and the film having breakage resistance. The composition contains: (A) an acrylic polymer produced by polymerizing (a-2) a monomer component in the presence of (A-1) a crosslinked acrylic polymer; and (B) a thermoplastic acrylic polymer, the composition having a fluidity (MFR: measured under heating at 230° C. and compression at 37.3 N) of 1 to 14, and having a gel content of 25 to 50% by weight with respect to 100% by weight in total of the acrylic polymer (A) and the thermoplastic acrylic polymer (B).
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: January 5, 2016
    Assignee: KANEKA CORPORATION
    Inventor: Hiroshi Kamiyama
  • Patent number: 9214270
    Abstract: An electronic component includes a first conductor layer including a first conductor pattern P1, a first insulating layer covering the first conductor layer, a first opening h1 passing through the first insulting layer to expose top and side surfaces of the first conductor pattern P1 therethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern P2 connected to the first conductor pattern P1 through the first opening h1. A first opening region which is a planar region inside the first opening h1 includes a first region in which the first conductor pattern P1 is formed and a second region in which the first conductor pattern P1 is not formed. The second conductor pattern P2 is embedded in both the first and second regions of the first opening h1.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: December 15, 2015
    Assignee: TDK CORPORATION
    Inventors: Fumio Watanabe, Naozumi Ishikawa, Hiroshi Kamiyama
  • Patent number: 8878641
    Abstract: An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: November 4, 2014
    Assignee: TDK Corporation
    Inventors: Tomonaga Nishikawa, Makoto Yoshida, Tomokazu Ito, Hiroshi Kamiyama, Takeshi Okumura, Tsuneo Kuwahara
  • Patent number: 8872998
    Abstract: In an image display apparatus, a protruding portion is fixed to a chassis on a back side Z2 of a planar member and protrudes towards the planar member. The protruding portion has one or more first protruding members and one or more second protruding members and defines a small allowance region and a large allowance region for the planar member. In the small allowance region, an amount of displacement of the planar member towards the chassis side is regulated at most to a first predetermined value by the one or more first protruding members. In the large allowance region, an amount of displacement of the planar member towards the chassis side is regulated at most to a second predetermined value larger than the first predetermined value by the one or more second protruding member.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: October 28, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroshi Kamiyama, Tomohiko Okada, Tetsushi Ito, Takashi Nishida, Kenji Tanaka, Hirotoshi Iemura, Masakatsu Kusuda
  • Publication number: 20140292466
    Abstract: A coil component 1 includes a thin-film coil layer including spiral conductors and bump electrodes 12a to 12d formed on a surface of the thin-film coil layer. The thin-film coil layer includes internal terminal electrodes 24a to 24d connected respectively to corresponding one ends of the spiral conductors, and a fourth insulating layer 15d covering the internal terminal electrode 24a to 24d and having openings ha to hd. Both a top surface TS and a side surface SS of each of the internal terminal electrodes 24a to 24d are exposed through the corresponding opening. The bump electrodes 12a to 12d are each brought into contact with both the top surface TS and side surface SS of each of the internal terminal electrodes 24a to 24d in the corresponding opening.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 2, 2014
    Applicant: TDK CORPORATION
    Inventors: Fumio WATANABE, Naozumi ISHIKAWA, Hiroshi KAMIYAMA
  • Publication number: 20140293258
    Abstract: A first alignment mark is given to a substrate, and a second alignment mark is given to a mask. The mask forms an electronic circuit pattern on the substrate. A control unit performs alignment of the mask and the substrate based on the first and second alignment marks. The second alignment mark is formed to surround the first alignment mark. The second alignment mark has a step pattern therein.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 2, 2014
    Applicant: TDK CORPORATION
    Inventors: Naozumi ISHIKAWA, Fumio WATANABE, Hiroshi KAMIYAMA
  • Publication number: 20140266547
    Abstract: An electronic component includes a first conductor layer including a first conductor pattern P1, a first insulating layer covering the first conductor layer, a first opening h1 passing through the first insulting layer to expose top and side surfaces of the first conductor pattern P1 therethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern P2 connected to the first conductor pattern P1 through the first opening h1. A first opening region which is a planar region inside the first opening h1 includes a first region in which the first conductor pattern P1 is formed and a second region in which the first conductor pattern P1 is not formed. The second conductor pattern P2 is embedded in both the first and second regions of the first opening h1.
    Type: Application
    Filed: March 6, 2014
    Publication date: September 18, 2014
    Applicant: TDK CORPORATION
    Inventors: Fumio WATANABE, Naozumi ISHIKAWA, Hiroshi KAMIYAMA
  • Patent number: 8831384
    Abstract: The present invention provides a service information platform with searching function, which comprises at least a photographic device, at least a user terminal, and a server device. The photographic device takes a picture of an object or a product label of the object and produces an image file. The user terminal connects to the server device and transmits the image file to the server device. After the server device receives the image file, a processor is used for producing an analysis result, which is used for searching at least a piece of service information related to the image file from the Internet or the classified service information database in the server device. Then the service information is returned back to the user terminal. Thereby, the user can acquire the service information from the Internet or the service information uploaded to the classified service information database by information suppliers.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: September 9, 2014
    Assignee: Richplay Information Co., Ltd
    Inventors: Hai-Tao Wo, Pei-Hsun Tsai, Hiroshi Kamiyama
  • Publication number: 20130309649
    Abstract: A method for rating electronic books (e-books) is revealed. Acquire and save an e-book in a memory device. Set up a criterion that includes at least one standard value and a plurality of regions defined by the standard value. Compile at least one electronic label corresponding to the region by an input device and save the electronic label in the memory device. The electronic label is linked to at least one electronic page of the e-book so that the electronic label is displayed with the electronic page when the e-book is retrieved by a reading device. The present invention can be applied to rating, copyright notice, and classification of e-books. The electronic labels in visual or audio form show messages related to e-book rating, copyright notice and classification.
    Type: Application
    Filed: November 23, 2012
    Publication date: November 21, 2013
    Applicant: YINGQIDA INFORMATION CO., LTD.
    Inventors: PEI-HSUN TSAI, HAI-TAO WO, HIROSHI KAMIYAMA
  • Patent number: 8564393
    Abstract: A coil component 100 is provided with a substrate 11, a thin-film coil layer 12 provided on the substrate 11, first and second bump electrodes 13a, 13b provided on a surface of the thin-film coil layer 12, a first lead conductor 20 provided on the surface of the thin-film coil layer 12 together with the first and second bump electrodes 13a, 13b and formed integrally with the first bump electrode 13a, and an insulator layer 14 provided between the first bump electrode 13a and the second bump electrode 13b. The thin-film coil layer 12 contains a first spiral conductor 16 which is a plane coil pattern. The first bump electrode 13a is connected to an internal peripheral end of the first spiral conductor 16 via the first lead conductor 20. The second bump electrode 13b is connected to an external peripheral end of the first spiral conductor 16.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: October 22, 2013
    Assignee: TDK Corporation
    Inventors: Tomonaga Nishikawa, Makoto Yoshida, Tomokazu Ito, Hiroshi Kamiyama, Takeshi Okumura, Sho Nakagomi
  • Publication number: 20120133472
    Abstract: An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.
    Type: Application
    Filed: November 11, 2011
    Publication date: May 31, 2012
    Inventors: Tomonaga NISHIKAWA, Makoto YOSHIDA, Tomokazu ITO, Hiroshi KAMIYAMA, Takeshi OKUMURA, Tsuneo KUWAHARA