Abstract: The TAB leader tape of the present invention comprises 45 parts by mass or more of a polyphenylene ether-based resin based on 100 parts by mass of the resin component thereof.

Abstract: A hard disk drive inner part formed of a resin which exhibits well-balanced low outgassing properties, ultrasonic cleaning resistance, low ionic contamination properties, low particulate contamination properties, repeated removability, heat resistance, specific gravity, and water-absorbing properties. The hard disk drive inner part includes a resin composition which includes a polyphenylene ether resin (A).

Abstract: It is an object to provide a resin composition in which fluidity is conferred while maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100% by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200° C., the organic compound being from 0.

Abstract: The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.

Abstract: An object of the invention is to provide a resin composition with which color tone, moldability, heat resistance, flame retardancy and mechanical properties are simultaneously attained each in a sufficient level and which is particularly excellent in color tone and less generation of foreign matter. Specifically, the present invention provides a resin composition obtained by melt-kneading: (A) 99 to 1 wt. % of a functionalized polyphenylene ether resin obtained by reacting a mixture of: (a) 100 parts by weight of a polyphenylene ether, and (b) 0.01 to 10.0 parts by weight of a modifier selected from non-aromatic conjugated diene compounds, dienophile compounds having one dienophile group and precursors for these diene or dienophile compounds at a reaction temperature of from room temperature to the melting point of (a); and (B) 1 to 99 wt. % of a liquid-crystal polyester.

Abstract: The present invention relates to a novel resin composition which is excellent in the balance of impact resistance, chemical resistance and fluidity as well as heat resistance and flame retardancy, and to a method for obtaining the composition. Particularly, it relates to a resin composition comprising: (A) 70 to 99 parts by weight of a polyphenylene ether resin, and (B) 1 to 30 parts by weight of a liquid-crystal polyester, wherein the polyphenylene ether resin in the composition contains 10 to 30 wt. % of polymer having a molecular weight of 20,000 or less and has a molecular weight distribution (Mw/Mn) of 1.8 to 3.5.

Abstract: An object of the invention is to provide a resin composition with which color tone, moldability, heat resistance, flame retardancy and mechanical properties are simultaneously attained each in a sufficient level and which is particularly excellent in color tone and less generation of foreign matter.

Abstract: The present invention relates to a novel resin composition which is excellent in the balance of impact resistance, chemical resistance and fluidity as well as heat resistance and flame retardancy, and to a method for obtaining the composition. Particularly, it relates to a resin composition comprising: (A) 70 to 99 parts by weight of a polyphenylene ether resin, and (B) 1 to 30 parts by weight of a liquid-crystal polyester, wherein the polyphenylene ether resin in the composition contains 10 to 30 wt. % of polymer having a molecular weight of 20,000 or less and has a molecular weight distribution (Mw/Mn) of 1.8 to 3.5.