Abstract: A brake disc includes an annular disc body and fins. The fins are radially disposed on a back surface of the disc body. At least one of the fins have a bolt hole at a central portion of the fin in a radial direction of the disc body. The disc body includes an inner circumferential portion. The inner circumferential portion is positioned inward from the bolt hole in the radial direction. The inner circumferential portion decreases in thickness as the inner circumferential portion extends inward in the radial direction. The fins each include a top surface and a convex portion. The convex portion protrudes inward from an imaginary plane in the radial direction. The imaginary plane passes an end portion of the top surface and an inner circumferential edge of the back surface.

Abstract: A powder magnetic core capable of achieving a low loss in a high frequency range is provided. A powder magnetic core according to the present disclosure is a powder magnetic core in which a magnetic powder is bonded via a binder layer. A volume filling percentage of the magnetic powder included in the powder magnetic core is 85 volume % or higher, and a value obtained by dividing a BET specific surface area (m2/g) of the powder magnetic core by a specific surface area (m2/g) calculated using outer dimensions of the powder magnetic core is 5000 or less.

Abstract: The invention is directed to prevent corrosion of a semiconductor device. In the semiconductor device manufacturing method of the invention, a semiconductor substrate is etched from its back surface in a position corresponding to a first wiring formed on the semiconductor substrate with a first insulation film therebetween, to form a first opening exposing the first insulation film. Next, the insulation film exposed in the first opening is etched to form a second opening exposing the first wiring, and then the semiconductor substrate is etched to increase a diameter of the first opening and form a first opening having the larger diameter. Then, a second insulation film is formed on the back surface of the semiconductor substrate including on the first wiring through the first and second openings, and then the second insulation film covering the first wiring is etched.

Abstract: Regardless of whether specific products are individual products or element products, the specific products are managed by the same product code while element products are associated and handled as a group of products. A product selection server presents the element products by associating them with one another for each group of products. A user terminal allocates a unique purchase group number for each group of products to element products in purchase-requested product data. The product selection server receives the purchase-requested product data and indicates a price as a group of products based on the purchase group number. An order entry server searches an incorrect from the purchase-requested product data based on the purchase group number. A factory terminal and a distribution terminal issue business forms based on the purchase group number.

Abstract: The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film covering an end portion of the pad electrode and having a first opening on the pad electrode, a plating layer formed on the pad electrode in the first opening, a second passivation film covering an exposed portion of the pad electrode between an end portion of the first passivation film and the plating layer, covering an end portion of the plating layer, and having a second opening on the plating layer, and a conductive terminal formed on the plating layer in the second opening.

Abstract: The invention prevents a pad electrode for external connection of a semiconductor device from being damaged. An electronic circuit, a first pad electrode connected to the electronic circuit, and a second pad electrode connected to the first pad electrode are formed on a semiconductor substrate. A first protection film is formed, covering the first pad electrode and having an opening on the second pad electrode only. A wiring layer is further formed, being connected to the back surface of the first pad electrode through a via hole penetrating the semiconductor substrate and extending from the via hole onto the back surface of the semiconductor substrate.

Abstract: The invention prevents a pad electrode for external connection of a semiconductor device from being damaged. An electronic circuit, a first pad electrode connected to the electronic circuit, and a second pad electrode connected to the first pad electrode are formed on a semiconductor substrate. A first protection film is formed, covering the first pad electrode and having an opening on the second pad electrode only. A wiring layer is further formed, being connected to the back surface of the first pad electrode through a via hole penetrating the semiconductor substrate and extending from the via hole onto the back surface of the semiconductor substrate.

Abstract: A method of predicting the amount of heat flowing into an object includes the steps of formulating a thermal circuit representing a heat flow into the object and an equation representing the thermal circuit; obtaining parameters for the equation; applying the parameters in the equation; and solving the equation to predict the amount of heat flowing into the object.

Abstract: The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film covering an end portion of the pad electrode and having a first opening on the pad electrode, a plating layer formed on the pad electrode in the first opening, a second passivation film covering an exposed portion of the pad electrode between an end portion of the first passivation film and the plating layer, covering an end portion of the plating layer, and having a second opening on the plating layer, and a conductive terminal formed on the plating layer in the second opening.

Abstract: The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate with insulation films interposed therebetween, a plating layer formed on the pad electrode, a conductive terminal formed on the plating layer and electrically connected with the pad electrode, and a first passivation film covering the insulation films and a side end portion of the pad electrode, in which an exposed portion of the pad electrode that causes corrosion is covered by forming a second passivation film so as to cover the first passivation film, the plating layer, and a portion of a sidewall of the conductive terminal.

Abstract: The invention is directed to prevent corrosion of a semiconductor device. In the semiconductor device manufacturing method of the invention, a semiconductor substrate is etched from its back surface in a position corresponding to a first wiring formed on the semiconductor substrate with a first insulation film therebetween, to form a first opening exposing the first insulation film. Next, the insulation film exposed in the first opening is etched to form a second opening exposing the first wiring, and then the semiconductor substrate is etched to increase a diameter of the first opening and form a first opening having the larger diameter. Then, a second insulation film is formed on the back surface of the semiconductor substrate including on the first wiring through the first and second openings, and then the second insulation film covering the first wiring is etched.

Abstract: There are disclosed a conveying apparatus and a conveying system in which a force is efficiently transmitted to an article so as to smoothly convey the article in an arbitrary direction. In each of feed portions 15 provided at a conveying apparatus 10, 11 of the invention, a twist gear 34 is mounted on a twist base 16, and is disposed below feed rollers 17, and therefore the degree of freedom of the configurations of the twist gear 34 and feed rollers 17 are higher as compared with a conventional construction in which a feed roller is provided within a twist gear. Therefore, a compact design of the twist gear 34 can be achieved, and also the feed portions 15 and 15 can be disposed closer to each other as compared with the conventional construction. And besides, a large-size design of the feed rollers 17 can be achieved, so that an area of contact of the feed rollers 17 with the article can be increased.

Abstract: Regardless of whether specific products are individual products or element products, the specific products are managed by the same product code while element products are associated and handled as a group of products. A product selection server presents the element products by associating them with one another for each group of products. A user terminal allocates a unique purchase group number for each group of products to element products in purchase-requested product data. The product selection server receives the purchase-requested product data and indicates a price as a group of products based on the purchase group number. An order entry server searches an incorrect from the purchase-requested product data based on the purchase group number. A factory terminal and a distribution terminal issue business forms based on the purchase group number.

Abstract: There are disclosed a conveying apparatus and a conveying system in which a force is efficiently transmitted to an article so as to smoothly convey the article in an arbitrary direction. In each of feed portions 15 provided at a conveying apparatus 10, 11 of the invention, a twist gear 34 is mounted on a twist base 16, and is disposed below feed rollers 17, and therefore the degree of freedom of the configurations of the twist gear 34 and feed rollers 17 are higher as compared with a conventional construction in which a feed roller is provided within a twist gear. Therefore, a compact design of the twist gear 34 can be achieved, and also the feed portions 15 and 15 can be disposed closer to each other as compared with the conventional construction. And besides, a large-size design of the feed rollers 17 can be achieved, so that an area of contact of the feed rollers 17 with the article can be increased.

Abstract: A decorative arrangement for a vehicle, such as a motor car or a ship, includes a transparent resin main body and a decorative member at least partially spaced from and covered by the main body. Adhesive bonds the main body and the decorative member. After the bond is completed, the adhesive remains flexible. The deformable adhesive prevents unwanted deformation of and damage to the main body and the decorative member even if the main body and the decorative member are made of materials having different coefficients of thermal expansion.

Abstract: Disclosed is a resin molding decorative member having a back surface formed with intersecting masking jig mounting grooves which define numerous segments separated from each other by the grooves. Also disclosed is a method for providing a desired pattern on the back surface of the member.

Abstract: A collapsible ornament according to the present invention includes a base fixed to an outer panel of a hood, and an ornament body having a hollow part formed by supporting a decorative laminated sheet and a hollow cylindrical shaft connected to the hollow part to hold the ornament body up. A coil spring is inserted into the hollow cylindrical shaft. The lower end of the spring is supported by a supporting body which is located at the bottom end of the hollow cylindrical shaft. In addition, a shaft member extends into the inside of the spring and its lower end is engaged with a hole formed in the base. An upper end of the shaft is coupled to the upper end of the spring.

Abstract: In a marking display structure for a motor vehicle window, a means is provided which is arranged to illuminate, from inside, a marking display element so that the marking, which represent the type, model or the like of the motor vehicle, can be recognized not only during day time but also at night.

Abstract: An ornament to be attached to a vehicle body such as automobile body to indicate a mark such as the manufacturer's mark for example. The ornament is of the self-illuminating type essentially made up of a base to be attached to an outer part of the vehicle body, a lamp such as an electroluminescent panel supported by the base and a cover which is a one-piece member formed of a transparent material attached to the base so as to entirely cover the lamp with a space therebetween. By processing of its inner side, the cover has a first area which is in a pattern corresponding to the shape of the mark to be indicated and allows the light emitted by the lamp to pass therethrough but in the daylight prevents recognition of the lamp from the outside, and a second portion which is contiguous to the first area and does not allow the light to pass therethrough.

Abstract: An aluminum die-cast base of the type having a sleeve-like extension is provided with anchor posts on which clips are fitted. The clips are adapted to resiliently deform for insertion into the attaching holes in a panel and then expand to grip the panel for thereby securing the base to the panel.