Abstract: An object of the invention is to provide an engine system driving an engine by using a hydrogen rich gas generated from a medium chemically repeating a hydrogen absorption and a hydrogen desorption as one of fuels, in which the engine system can efficiently generate a hydrogen rich gas from the medium. In an engine system which mounts a medium chemically repeating a hydrogen absorption and a hydrogen desorption thereon, is provided with a hydrogen supplying apparatus generating or storing a hydrogen rich gas from the medium, and drives an engine by using the hydrogen rich gas as one of fuels, the engine system has a detecting portion detecting an operating state of the engine, and a medium supplying amount control means controlling a supplying amount of the medium supplied to the hydrogen supplying apparatus in correspondence to a result of detection of the detecting portion.

Abstract: This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein said reducing agent for copper ion is glyoxylic acid or a salt thereof, said pH adjusting agent is potassium hydroxide and said electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: Managing system for emissions environmental pollutants comprising: a measuring device for measuring a flow rate of a fuel supplied to a customer; an unit emission quantity storage device of environmentally influential substance for storing a unit emission quantity of an environmentally influential substance emitted when an unit flow rate of fuel is manufactured or processed; and an emission quantity computing device of environmentally influential substance for calculating, based on the fuel flow rate measured by the measuring device, and the unit emission quantity of the environmentally influential substance stored by the unit emission quantity storage device, an environmental emission quantity of the environmentally influential substance emitted when the fuel supplied to the customer is manufactured or processed.

Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: A hydrogen supply device which generates hydrogen from hydrogen storing material which chemically stores hydrogen by a catalyst, wherein said device comprises valves on the fuel supply port and the exhaust port, and a valve controller which controls timing to opening and close the valves Fuel supply pressure is 2 to 20 atm. Hydrogen generation pressure is 5 to 300 atm. Exhaust pressure is atmospheric pressure to 0.01 atm.

Abstract: A hydrogen fuel manufacturing system capable of efficiently producing each hydrogen fuel in accordance with a demanded quantity is disclosed. The system includes a hydrogen manufacturing apparatus for manufacturing hydrogen, more than two hydrogen fuel manufacturing apparatuses for manufacturing hydrogen fuels by letting the hydrogen produced by the hydrogen manufacturing apparatus change into a fuel-use form, wherein the fuel form to be manufactured by the hydrogen fuel manufacturing apparatuses is set to have more than two kinds. Additionally the system has a hydrogen fuel production volume receiver device for receipt of the information as to a hydrogen fuel production volume, thereby controlling the production volume of the hydrogen fuel being manufactured by the hydrogen fuel manufacturing apparatus, based on the hydrogen fuel production volume information as received by the hydrogen fuel production volume receiver device.

Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: An object of the present invention is to provide an elecroless copper plating solution using glyoxylic acid or a salt of glyoxylic acid as the reducing agent in which the amount of Cannizzaro reaction product is small, and the mechanical property of the obtained plated film is excellent, and to provide a supplementary solution for the electroless copper plating solution, a plating method capable of stably forming a plated film using the electroless copper plating solution, and a method of manufacturing a wiring board having an excellent connecting reliability of a through hole.

Abstract: This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time.