Abstract: In a case where the density correction condition of an image output section is satisfied while a job is being executed, density correction means performs density correction while the job is being executed or after the execution of the job. On this occasion, if there is a job on standby for printing in an image memory, this job is executed in the image formation condition (i.e. a correction amount stored in a current correction amount storing section) determined before the density correction. In the meanwhile, a job which is stored after the density correction is executed in a latest image formation condition (i.e. a correction amount stored in a latest correction amount storing section) which is figured out by the aforesaid density correction.

Abstract: A communication terminal device and a method for controlling the same which can operate a mail restriction function effectively without increasing a mail address registered for the mail restriction function are provided. The transmission and the reception of the mail is restricted by storing by a domain conversion table a corresponding relationship between an original domain by the automatic address conversion unit and the domain after the conversion, acquiring by the original domain acquiring unit the original domain based on the domain of the mail address converted by the automatic address conversion unit by referring to the domain conversion table, and controlling by the mail transmission and reception control means the transmission and the reception of the mail by comparing the mail address replaced with the domain of the mail address of the transmitting/receiving mail by the original domain acquired by the original domain acquiring unit with the registered mail address.

Abstract: A manufacturing method of a semiconductor device includes a support member for fixing a semiconductor chip, the support member being formed between leads without applying stress to the leads. The semiconductor device includes a plurality of leads composing a lead frame, a resin island (a support member) that is formed between the leads, a semiconductor chip that is fixed on the resin island and is electrically connected to the leads by bonding wires, and sealing resin for partially sealing the semiconductor chip, the bonding wire, and the lead by resin, wherein a liquid cured resin is formed (filled) between the leads to form the resin island (the support member).

Abstract: An image processor of the invention has an object to provide an effective moire suppression by using a spatial filter and an efficient edge emphasis by using a spatial filter. When a spatial filter process is performed for moire removal, a spatial filter processing section of the image processor has a characteristic wherein the MTF presents values of not more than 1.0 for the entirety of the spatial frequencies to be contained in an image, and the minimum value for a moire-causative spatial frequency. This permits the image processor to prevent the quality degradation of the spatially filtered image. When a spatial filter process is performed for edge emphasis, a spatial filter processing section has a characteristic wherein the MTF is flat in an erroneous-judgment frequency band liable to cause an edge extraction error, and exceeds 1.0 at spatial frequencies below a lower limit of the erroneous-judgment frequency band.

Abstract: An image forming apparatus includes: toner supply amount detecting means for detecting a toner supply amount to a developer tank; detecting means for detecting a signal value of each pixel of an image; and toner consumption amount estimating means for estimating a toner consumption amount, based on the signal value. The signal value detected by the detecting means is corrected in accordance with the toner supply amount detected by the toner supply amount detecting means. The toner consumption amount is estimated based on the signal value corrected. This allows the toner consumption amount to be always calculated accurately, regardless of a variation amongst various models, or a variation in a toner consumption characteristic due to aging, using environment, or the like.

Abstract: An image management method of recording image data, together with date information indicative of a recording date at a predetermined recording medium to manage the image data in day-by-day groups based on the date information of the image data, has the step of detecting an image source of image data to be recorded. When image data from a first image source and image data from a second image source are recorded on the same day, the image data from the first image source is managed in a first group based on the date information, while the image data from the second image source is managed in a new second group.

Abstract: An alkali storage battery using powder generation elements composed of a positive electrode comprising nickel (Ni) oxide as main materials, a negative electrode, a separator and an alkali aqueous solution, wherein materials of said positive electrodes are spherical or elliptic powders whose tapping density is not less than 2.2 g/cc mainly composed of nickel hydroxide (Ni(OH)2), powders comprise core powders with innumerable microscopic concaves and convexes on surfaces mainly composed of spherical or elliptic ?-type Ni(OH)2, and fine powders composed of metal cobalt (Co) and/or Co oxide, and fine powders are crushed and pressed in substantially all concave portions of microscopic concaves and convexes of said core powders, thereby integrated with core powders, and surface layers of powders are coated with fine powders and are flattened, and core powders and/or fine powders have innumerable micro pores which penetrate from surfaces to inner portions.

Abstract: The present invention provides a method for fabricating a semiconductor device which initially performs chemical mechanical polishing with respect to a metal film made of copper formed on a semiconductor substrate to form wires composed of the metal film on the semiconductor substrate and subsequently removes a wire-to-wire bridge occurring during the formation of the wires and remaining on the semiconductor substrate to cause unneeded conduction between the wires adjacent to each other. The removal of the wire-to-wire bridge is performed by oxidizing the wire-to-wire bridge into a copper oxide by using an aqueous hydrogen peroxide and then dissolving the copper oxide by using an oxalic acid. This allows the removal of the wire-to-wire bridge without damaging the main bodies of the wires.

Abstract: One embodiment is an image forming apparatus that digitally performs image processing and correction processing of image information, and calculates toner consumption by performing a pixel count of the input multi-level image includes a counting portion that counts, pixel by pixel, the input signal levels of an input multi-level image; a weighting coefficient table that stores weighting coefficients corresponding to the input signal levels; a weighting calculation portion that obtains from the weighting coefficient table weighting coefficients corresponding to the input signal levels and performs weighting of each pixel when counting the input signal levels with the counting portion; and a rewriting portion that rewrites the weighting coefficients stored in a weighting coefficient table.

Abstract: An image processor of the invention has an object to provide an effective moire suppression by using a spatial filter and an efficient edge emphasis by using a spatial filter. When a spatial filter process is performed for moire removal, a spatial filter processing section of the image processor has a characteristic wherein the MTF presents values of not more than 1.0 for the entirety of the spatial frequencies to be contained in an image, and the minimum value for a moire-causative spatial frequency. This permits the image processor to prevent the quality degradation of the spatially filtered image. When a spatial filter process is performed for edge emphasis, a spatial filter processing section has a characteristic wherein the MTF is flat in an erroneous-judgment frequency band liable to cause an edge extraction error, and exceeds 1.0 at spatial frequencies below a lower limit of the erroneous-judgment frequency band.

Abstract: To provide a manufacturing method of a semiconductor device, in which a support member for fixing a semiconductor chip is formed between leads without giving stress to the leads. The semiconductor device may comprise a plurality of leads composing a lead frame, a resin island (a support member) that is formed between the leads, and a semiconductor chip that is fixed on the resin island and is electrically connected to the leads by bonding wires, and sealing resin for partially sealing the semiconductor chip, the bonding wire, and the lead by resin, wherein a liquid cured resin is formed (filled) between the leads to form the resin island (the support member).

Abstract: The present invention provides a method for fabricating a semiconductor device which initially performs chemical mechanical polishing with respect to a metal film made of copper formed on a semiconductor substrate to form wires composed of the metal film on the semiconductor substrate and subsequently removes a wire-to-wire bridge occurring during the formation of the wires and remaining on the semiconductor substrate to cause unneeded conduction between the wires adjacent to each other. The removal of the wire-to-wire bridge is performed by oxidizing the wire-to-wire bridge into a copper oxide by using an aqueous hydrogen peroxide and then dissolving the copper oxide by using an oxalic acid. This allows the removal of the wire-to-wire bridge without damaging the main bodies of the wires.

Abstract: A non-reciprocal circuit device has a length, a width, and a thickness denoted respectively by L1, L2, and L3, and the overall dimensions of 2.5 mm<L1<7.0 mm, 2.5 mm<L2<7.0 mm, and 1.0 mm<L3<3.5 mm. When a projected area of the substrate of the device is orthogonally projected on a plane parallel to a base surface of the substrate is denoted by S1, the substrate holds a proportional relation to S1/(L1×L2)=0.1 to 0.78. When a thickness of the magnet of the device is denoted by L4, the magnet holds a proportional relation of L4/L3=0.2 to 0.5. When a projected area of the magnet orthogonally formed on a plane parallel to a surface of the magnet is denoted by S2, they have a proportional relation of S1/S2=0.15 to 0.83.

Abstract: The present invention provides batteries with low cost, excellent in high rate discharge characteristics (high power characteristics) and high reliability. For example, the present invention provides Ni/MH batteries with low cost, excellent in high rate discharge characteristics (high power characteristics) and high reliability. The batteries of the present invention are obtained by applying the conductive electrode substrate obtained by the following method to a positive electrode and/or a negative electrode and by combining these electrodes with a separator which is much thinner than conventional separators. The conductive electrode substrate which is made three dimensional is obtained by forming innumerable bridge structural portions on both sides of a nickel foil, having no burr on the apparent surface of said three dimensional substrate. The same type of substrate made of Al and Cu foil are applicable for a Li secondary battery system positive and negative electrodes, respectively.

Abstract: An image processor of the invention has an object to provide an effective moire suppression by using a spatial filter and an efficient edge emphasis by using a spatial filter. When a spatial filter process is performed for moire removal, a spatial filter processing section of the image processor has a characteristic wherein the MTF presents values of not more than 1.0 for the entirety of the spatial frequencies to be contained in an image, and the minimum value for a moire-causative spatial frequency. This permits the image processor to prevent the quality degradation of the spatially filtered image. When a spatial filter process is performed for edge emphasis, a spatial filter processing section has a characteristic wherein the MTF is flat in an erroneous-judgment frequency band liable to cause an edge extraction error, and exceeds 1.0 at spatial frequencies below a lower limit of the erroneous-judgment frequency band.

Abstract: A compact non-reciprocal circuit device capable of handling a high power without impairment of the characteristics. The non-reciprocal circuit device contains a magnetic substrate that exhibits anisotropic behavior by application of a direct-current magnetic field. On the surface of the substrate, strip-lines are disposed at an angle, being insulated with each other. One end of each strip-line is grounded, and the other end of each is connected through a capacitor to a ground. Of the ends connecting the capacitors, one end connects to a termination resistor; the remaining ends connect each to an input terminal and an output terminal. The non-reciprocal circuit device exhibits non-reciprocal characteristics between the input and output terminals. The case of the device contains an insulating thermal conductor that serves as a heat-radiator for the termination resistor and the strip-lines.

Abstract: An AR map has entries of the same number as the AR's and is accessed by an ARN. In each of the map entries, there are entered: an ID of a pertinent entry in an STD array; and a flag representing valid or invalid of the map entry. Into an ALET holding part, there are stored ALET's corresponding to STD's in the STD array, respectively. Upon AR access, if an entry in the AR map which corresponds to a designated AR is valid, an ID included in the valid entry is outputted to a storage controlling part. In case that the corresponding entry in the AR map is invalid, if the ALET holding part stores an ALET identical with an ALET of the designated AR, an ID of STD corresponding to the stored ALET is stored into the AR map.

Abstract: A compact non-reciprocal circuit device capable of handling a high power without impairment of the characteristics. The non-reciprocal circuit device contains a magnetic substrate that exhibits anisotropic behavior by application of a direct-current magnetic field. On the surface of the substrate, strip-lines are disposed at an angle, being insulated with each other. One end of each strip-line is grounded, and the other end of each is connected through a capacitor to a ground. Of the ends connecting the capacitors, one end connects to a termination resistor; the remaining ends connect each to an input terminal and an output terminal. The non-reciprocal circuit device exhibits non-reciprocal characteristics between the input and output terminals. The case of the device contains an insulating thermal conductor that serves as a heat-radiator for the termination resistor and the strip-lines.

Abstract: A metal sheet (1) which constitutes a non-sintered type electrode support is processed to have minute irregularities on its surface. The irregularities are formed by a mechanical method such that protrusions (9) and indentations (8) are configured with a center-to-center pitch (P) in the range of from 50 to 300 &mgr;m and such that the apparent thickness after processing is at least three times as large as the unprocessed material thickness.

Abstract: A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.