Patents by Inventor Hiroshi KIKAI

Hiroshi KIKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alignment device, semiconductor wafer processing device, and alignment method
    Patent number: 11232962
    Abstract: An alignment device which aligns notch portions of wafers includes mounting tables that hold the wafers, movement units that move the mounting tables, notch portion detection units that detect a circumferential positions of the notch portion, and a controller that controls positions of the mounting tables by the movement units. The mounting tables includes a mounting table main body portion and a pad member attached to an opening in the mounting table main body portion to hold the wafers. The pad member includes the main body portion that is attached to the opening and has a through hole in a center portion thereof, the first annular portion on an end side of the pad member to abut against wafers, and the first collar portion that is integrally provided with the first annular portion and the main body portion and extends toward outside of the main body portion.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: January 25, 2022
    Assignee: HIRATA CORPORATION
    Inventors: Hiroki Watanabe, Tetsuya Sakai, Hiroshi Kikai
  • ALIGNMENT DEVICE, SEMICONDUCTOR WAFER PROCESSING DEVICE, AND ALIGNMENT METHOD
    Publication number: 20200006103
    Abstract: An alignment device which aligns notch portions of wafers includes mounting tables that hold the wafers, movement units that move the mounting tables, notch portion detection units that detect a circumferential positions of the notch portion, and a controller that controls positions of the mounting tables by the movement units. The mounting tables includes a mounting table main body portion and a pad member attached to an opening in the mounting table main body portion to hold the wafers. The pad member includes the main body portion that is attached to the opening and has a through hole in a center portion thereof, the first annular portion on an end side of the pad member to abut against wafers, and the first collar portion that is integrally provided with the first annular portion and the main body portion and extends toward outside of the main body portion.
    Type: Application
    Filed: December 31, 2018
    Publication date: January 2, 2020
    Applicant: HIRATA CORPORATION
    Inventors: Hiroki WATANABE, Tetsuya SAKAI, Hiroshi KIKAI