Abstract: To provide a defect inspection apparatus and method adapted to easily assign threshold levels to scattered-light detectors and to appropriately acquire data detected by each scattered-light detector. The apparatus includes a stage device on which to rest a sample; a laser light irradiation device that irradiates the sample on the stage device with inspection light; scattered-light detectors, each of which detects a beam of light, scattered from the sample, and outputs an image signal; a threshold level setter formed so that an associated threshold level for judging whether defects are present is set only for an image signal selected from individual image signals of the scattered-light detectors or from image signals obtained by arithmetic processing based on the image signals, and a threshold level setting circuit that acquires the individual image signals, only if the image signal exceeds the threshold level set in the threshold level setter.

Abstract: The camera side mount is brought, by relative rotation with the accessory side mount, from a first state where each accessory side bayonet claw is inserted between the camera side bayonet claws into a second state where the camera side and accessory side bayonet claws engage with each other. The leaf spring biasing the camera side contact pins in the protruding direction is disposed between the camera side mount and the camera body. When the camera being in the normal position is viewed from the direction facing the camera side mount, the leaf spring extends from both sides of the mount center line, which extends from the center of the camera side mount in the direction of gravity, toward the camera side contact pins. The camera side contact pins are arranged at positions other than a position on the mount center line.

Abstract: A first lens unit performing communication with an image pickup apparatus with a first voltage and a second lens unit performing communication with the image pickup apparatus with a second voltage are selectively attached to the image pickup apparatus. The image pickup apparatus includes a controller configured to operate with a third voltage different from at least one of the first and second voltages to output a signal for the communication with the first and second lens units, and a determiner configured to determine the type of the lens unit attached to the image pickup apparatus. The controller is configured to produce, as a voltage of the signal for the communication, from the third voltage, one of the first and second voltages corresponding to a determination result of the determiner.

Abstract: The camera accessory is attachable to a camera by relatively rotating from a first state to a second state. Camera side contact pins include a first camera side contact pin making contact with an accessory side contact holding portion in the first state and second camera side contact pins not making contact with the accessory side contact holding portion in the first state. Accessory side contact surfaces include a first accessory side contact surface making contact with the first camera side contact pin in the second state and second accessory side contact surfaces not making contact with the first camera side contact pin in the second state. A pitch between the first and second accessory side contact surfaces adjacent thereto is larger than a pitch between the second accessory side contact surfaces adjacent to each other.

Abstract: A wiring substrate may include: a base having a predetermined thickness; a plurality of electrode portions formed to protrude on one surface in a thickness direction of the base; a wiring provided in the base and electrically connected to the electrode portions; and a resin layer formed on the base to fill between the plurality of electrode portions. An upper surface of the resin layer may be formed in a concave shape lower than a maximum height of the electrode portion, and an upper surface of the electrode portion and the upper surface of the resin layer form a continuous curved surface.

Abstract: A substrate includes a base member having a predetermined thickness, and an electrode array provided in one surface in a thickness direction of the base member and having a plurality of electrodes arranged two-dimensionally in a plan view, and the electrode array includes a central portion and an incremental region provided around the central portion in the planar view and is formed so that a height of the electrodes in the incremental region gradually increase as approaching toward the central portion.

Abstract: A substrate may include: a base material having a predetermined thickness; an electrode section formed on one side surface in a thickness direction of the base material, and having a plurality of electrodes; and a concave section formed on at least a part of the surface on which the electrode section is formed, on the base material.

Abstract: An electrode body is provided as an electrode body capable of appropriately reducing a load when silicon wafer direct bonding is performed. The electrode body includes a base member that has a predetermined thickness; and an electrode portion that is formed on one surface of the base member in a thickness direction thereof. The electrode portion includes a basic bump formed in a substantially columnar shape to protrude on the base member and a fragile bump formed independently from the basic bump to form a metallic bond with the basic bump.

Abstract: A loading unit avoiding the need to enhance the performance of a lifting elevator mechanism, thus preventing an increase in the cost of the lifting elevator mechanism. The loading unit is configured to vertically move a substrate holder, holding a plurality of substrates, into and out of a cylindrical processing container upon heat treatment of the substrates. The loading unit includes: a lifting elevator mechanism for holding and vertically moving the substrate holder and a cap; and a pressing mechanism, having a piezoelectric actuator, for upwardly pressing against the cap lying at a bottom opening of the processing container.

Abstract: A developing device includes a developer supply part and a developer collecting part, wherein the developer supply part has a developer inlet port for introducing a developer supplied from a reservoir into the developer supply part and a developer extraction port provided on the side of the developer inlet port to remove a portion of the developer so as to define a quantity of the developer to be introduced in the developer supply part, and wherein the developer extraction port and the developer collecting part are connected to the reservoir.

Abstract: An organic thin film deposition device that is compact and high in processing capability is provided. Inside a vacuum chamber, first and second substrate arrangement devices that can be in a horizontal posture and a standing posture are provided; and when in the standing posture, substrates held by the respective substrate arrangement devices and first and second organic vapor discharging devices face each other. When one of the substrate arrangement devices is in the horizontal posture, masks and the substrates are lifted up by alignment pins and transfer pins and are replaced with a substrate not yet film formed, for position adjustment. With one organic thin film deposition device, two substrates can be processed at the same time.

Abstract: The invention provides a nucleic-acid-transfecting composition which exhibits low cytotoxicity, which facilitates an effective nucleic acid transfection into a cell, and which improves expression of the nucleic acid in the cell. The composition for transfecting a nucleic acid into a cell, contains a di(C12-16 alkyl)dimethylammonium halide and a phospholipid.

Abstract: An earthquake damage spread reducing method and an earthquake damage spread reducing system, for use in a semiconductor manufacturing apparatus, which can predict occurrence of an earthquake and prevent fall down of a boat, thus minimizing damage by the earthquake. An earthquake damage spread reducing system includes a receiving unit for receiving urgent earthquake information, based on preliminary tremors, distributed via a communication network, or alternatively, includes a preliminary tremors detection unit for directly detecting the preliminary tremors. A control unit performs a first step of stopping operation of a semiconductor manufacturing apparatus, based on the urgent earthquake information received or on the preliminary tremors detected, as well as performs a second step of holding a boat in order to prevent fall of the boat, in which objects to be processed are loaded in a multistage fashion.

Abstract: A semiconductor package includes a print circuit part, a lower chip, an upper chip, a thermal conductivity part, and an encapsulation resin. The lower chip and the upper chip are mounted on the print circuit part through wire bonding connection. The thermal conductivity part efficiently dissipates heat from the chips to the outside of the package. The encapsulation resin entirely seals the package while exposing the thermal conductivity part. A adhesive sheet is hardened to form a bonding layer between the thermal conductivity part and the upper chip, a bonding layer between the semiconductor chips, and a bonding layer between the semiconductor chip and the wired component. The configuration contributes to miniaturization, high integration, and heat resistance reduction of a semiconductor package using high-heat-generating ICs.

Abstract: An image sensing apparatus has an image sensing element which accumulates received light as a charge, a mechanical shutter which travels to shield the image sensing element, and a scan unit which makes a scan for starting charge accumulation. The image sensing apparatus executes the scan for starting charge accumulation prior to traveling of the mechanical shutter and controls the scan for starting charge accumulation and traveling of the shutter to serve as a front curtain and a rear curtain of a shutter. Note that a scan pattern setting unit (113b) sets the scan pattern of the charge accumulation start scan based on information associated with a mounted photographing lens.

Abstract: Flexible specifying is enabled in the event of using data created with a general application to specify printing by layering a color toner image and optional special color toner image. A printer driver specifies pages to perform printing using a clear toner out of the page group received from the application, generates a job including data for layering as to the same face on the same sheet and printing a clear toner page which is a specified page, and a color toner page which is a page not specified for clear toner in the page group, and sends this to the printer.

Abstract: An information processing apparatus includes an extraction unit configured to extract a character from an input character string and a generation unit configured to generate a printTicket with the character extracted by the extraction unit as an Option of a plurality of Features, wherein print data is generated from the printTicket generated by the generation unit and a rendering command from an application.

Abstract: An information processing method includes acquiring an installed driver set, displaying an input screen for inputting a character string thereto, creating a new driver set by editing the acquired driver set based on the character string input to the input screen, and replacing the installed driver set with the new driver set created by the creating step.

Abstract: A surface inspection apparatus includes a blocking unit included in a subsequent processing unit that groups data items into having an arbitrary number of data items. The subsequent processing unit acquires a data item from each of the blocks. The blocking unit changes, in accordance with an instruction transmitted from a state monitoring unit, the number of data items to be blocked. A threshold processing unit acquires data items from the blocking unit that have values larger than a threshold, and transmits the data items to a memory. The state monitoring unit monitors an available capacity of the memory. When the state monitoring unit detects a reduction in the available capacity of the memory, it causes the blocking unit to increase the number of data items to be blocked into each of the blocks so that data does not overflow from the memory.

Abstract: Provided is a method wherein a multi-anode detector is used for the purpose of detecting scattered light from a wafer, data obtained from the detector (multi-anode) for detecting defects is used, the shape of a beam radiated to the wafer, a rotational shift between the radius direction and the beam long side, and the like are calculated, and the optical axis of the irradiation beam is adjusted. Furthermore, the method is provided with a technique which feeds back the correction quantities for rotation and amplitude to inspection signal data, on the basis of the correction data, and corrects inspection data. Since fine correction with the adjustment of an optics system and signal processing is made possible, positional accuracy of defect inspection and accuracy of defect level (defect size) are improved.