Patents by Inventor Hiroshi Kishimoto

Hiroshi Kishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240094164
    Abstract: Noise derived from electromagnetic coupling due to size reduction of an element mounting substrate is reduced. In an embodiment of the present disclosure, an element mounting substrate includes an insulation layer, an input wiring line and an output wiring line disposed on the insulation layer, and a ground layer disposed on the insulation layer, located around the input wiring line and the output wiring line, and including an exposed region where the insulation layer is exposed. The exposed region of the ground layer overlaps a region where the input wiring line and the output wiring line are close to each other. A SAW element is mounted on the element mounting substrate. With this configuration, the noise derived from the electromagnetic coupling generated between the input wiring line and the output wiring line can be reduced, and measurement accuracy can be improved.
    Type: Application
    Filed: December 1, 2021
    Publication date: March 21, 2024
    Inventors: Kyosuke KISHIMOTO, Hiroshi KATTA
  • Patent number: 11866564
    Abstract: The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 ?m and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 ?m in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface, Requirement (a1): when the chemical composition is represented by SiOxCyHz, x falls within the range 1.93-1.98, y falls within the range 0.04-0.15 and z falls within the range 0.10-0.50.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: January 9, 2024
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya Ekinaka, Tatsuichirou Kon, Hiroshi Kishimoto, Yume Takeda, Takehiro Suga, Satoshi Ogata, Masato Nakagomi
  • Publication number: 20230321894
    Abstract: Provided are a method of producing a curved member, the method containing preparing a polycarbonate resin laminate with a hard coat layer for heat bending that includes a permeation layer (B layer) and a hard coat layer (C layer) sequentially layered on at least one surface of a polycarbonate resin base material layer (A layer) having a thickness of from 0.1 mm to 20 mm, and satisfying the requirements (a) to (d), pre-heating the polycarbonate resin laminate at from a temperature higher than Tg by 5° C. to a temperature higher than Tg by 70° C., in which Tg (° C.) is a glass transition temperature of a polycarbonate resin of the prepared polycarbonate resin laminate, and curving the polycarbonate resin laminate obtained by the pre-heating by applying pressure to the polycarbonate resin laminate, and a polycarbonate resin laminate with a hard coat layer for heat bending.
    Type: Application
    Filed: September 25, 2020
    Publication date: October 12, 2023
    Applicant: TEIJIN LIMITED
    Inventors: Tatsuya EKINAKA, Takashi YODA, Hiroshi KISHIMOTO, Tomoaki AKAOKA
  • Patent number: 11732963
    Abstract: To reduce work at an installation site when a plant facility is manufactured, modules are conveyed in order from a fabrication yard to the installation site, and expansion and contraction amounts of pipe spools are calculated based on a temperature difference between a temperature at the fabrication yard when the modules are manufactured and a temperature at the installation site when the modules are installed at the installation site. Further, an installation position of a foundation is adjusted toward a direction to cancel out the expansion and contraction amounts of the plurality of pipe spools, and the pipe spool is moved toward the direction to cancel out the expansion and contraction amounts of the plurality of pipe spools. The modules are installed with the positions of the end portions of the pipe spools being adjusted.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: August 22, 2023
    Assignee: JGC CORPORATION
    Inventors: Hiroshi Kishimoto, Takuya Tsutsui, Makoto Mikami, Hiroyuki Koito
  • Publication number: 20220316797
    Abstract: To reduce work at an installation site when a plant facility is manufactured, modules are conveyed in order from a fabrication yard to the installation site, and expansion and contraction amounts of pipe spools are calculated based on a temperature difference between a temperature at the fabrication yard when the modules are manufactured and a temperature at the installation site when the modules are installed at the installation site. Further, an installation position of a foundation is adjusted toward a direction to cancel out the expansion and contraction amounts of the plurality of pipe spools, and the pipe spool is moved toward the direction to cancel out the expansion and contraction amounts of the plurality of pipe spools. The modules are installed with the positions of the end portions of the pipe spools being adjusted.
    Type: Application
    Filed: August 14, 2019
    Publication date: October 6, 2022
    Applicant: JGC CORPORATION
    Inventors: Hiroshi KISHIMOTO, Takuya TSUTSUI, Makoto MIKAMI, Hiroyuki KOITO
  • Patent number: 11028284
    Abstract: The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 ?m, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 ?m; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: June 8, 2021
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya Ekinaka, Tatsuichirou Kon, Takehiro Suga, Hiroshi Kishimoto, Yume Morita, Satoshi Ogata, Masato Nakagomi
  • Publication number: 20200377682
    Abstract: The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 ?m and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 ?m in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface, Requirement (a1): when the chemical composition is represented by SiOxCyHz, x falls within the range 1.93-1.98, y falls within the range 0.04-0.15 and z falls within the range 0.10-0.50.
    Type: Application
    Filed: March 28, 2018
    Publication date: December 3, 2020
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya EKINAKA, Tatsuichirou KON, Hiroshi KISHIMOTO, Yume TAKEDA, Takehiro SUGA, Satoshi OGATA, Masato NAKAGOMI
  • Publication number: 20200139793
    Abstract: Provided is a resin substrate for the pillarless windshield which is large yet light-weight and provides excellent visibility, and has further realized a high strength to withstand a load calculated based on air resistance under the driving speed of 150 km/h. The resin substrate for the pillarless windshield has the longest side (SA) fixed to car body (3), wherein the resin substrate is an uneven-thickness structure having viewing section (1) with a mean thickness (d1) of 3-7 mm and thick-walled section (2) with a thickness of 1.
    Type: Application
    Filed: June 5, 2018
    Publication date: May 7, 2020
    Applicant: TEIJIN LIMITED
    Inventors: Miwa NAKAMURA, Kozo NAITO, Yuka SAITO, Takashi YODA, Hiroshi KISHIMOTO
  • Patent number: 10385238
    Abstract: An adhesive laminate comprising (A) a light-transmitting substrate layer formed from a melt extruded thermoplastic resin, (B) a hard coat layer formed by using a hard coating agent comprising not less than 13 wt % of colloidal silica and/or an alkoxysilane hydrolysis condensate based on the total weight of the layer B excluding a solvent, (C) an adhesive primer layer, and (D) an elastic adhesive layer. Layers (A)-(D) are formed in this order. Layer C is formed from a primer composition comprising a silane coupling agent and has a thickness of 1 to 20 ?m and an indentation elasticity modulus of 500 to 4,000 MPa. Layer D has a thickness (Y) of 0.9 to 14 mm.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: August 20, 2019
    Assignee: TEIJIN LIMITED
    Inventors: Hiroshi Kishimoto, Yume Morita, Yukiko Uzawa, Daisuke Takahashi
  • Publication number: 20180265731
    Abstract: The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 ?m, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 ?m; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.
    Type: Application
    Filed: September 23, 2016
    Publication date: September 20, 2018
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya EKINAKA, Tatsuichirou KON, Takehiro SUGA, Hiroshi KISHIMOTO, Yume MORITA, Satoshi OGATA, Masato NAKAGOMI
  • Patent number: 9758630
    Abstract: The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 ?m to 20 ?m, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 ?m to 9.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: September 12, 2017
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuichirou Kon, Tatsuya Ekinaka, Hiroshi Kishimoto, Yume Morita, Takehiro Suga, Satoshi Ogata, Masato Nakagomi
  • Patent number: 9666872
    Abstract: The conductive porous layer for batteries according to the present invention comprises a laminate comprising a first conductive layer and a second conductive layer. The first conductive layer includes at least a conductive carbon material and a polymer. The second conductive layer includes at least a conductive carbon material and a polymer. The conductive porous layer satisfies at least one of the following two conditions: “the polymer in the first conductive layer is present with a high density at the surface of the layer in contact with the second conductive layer than at the surface not in contact with the second conductive layer” and “the polymer in the second conductive layer is present with a higher density at the surface of the layer in contact with the first conductive layer than at the surface not in contact with the first conductive layer.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: May 30, 2017
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Naoya Takeuchi, Hiroshi Kishimoto, Kasumi Oi
  • Publication number: 20170107345
    Abstract: The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 ?m to 20 ?m, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 ?m to 9.
    Type: Application
    Filed: March 27, 2015
    Publication date: April 20, 2017
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuichirou KON, Tatsuya EKINAKA, Hiroshi KISHIMOTO, Yume MORITA, Takehiro SUGA, Satoshi OGATA, Masato NAKAGOMI
  • Publication number: 20160293964
    Abstract: The conductive porous layer for batteries according to the present invention comprises a laminate comprising a first conductive layer and a second conductive layer. The first conductive layer includes at least a conductive carbon material and a polymer. The second conductive layer includes at least a conductive carbon material and a polymer. The conductive porous layer satisfies at least one of the following two conditions: “the polymer in the first conductive layer is present with a high density at the surface of the layer in contact with the second conductive layer than at the surface not in contact with the second conductive layer” and “the polymer in the second conductive layer is present with a higher density at the surface of the layer in contact with the first conductive layer than at the surface not in contact with the first conductive layer.
    Type: Application
    Filed: April 5, 2016
    Publication date: October 6, 2016
    Inventors: Naoya Takeuchi, Hiroshi Kishimoto, Kasumi Oi
  • Publication number: 20160271922
    Abstract: Provided is a polycarbonate resin laminate that is obtained by forming a silicone hard coat layer on a multilayer base, which is obtained by forming and laminating a thermoplastic resin layer having ultraviolet absorbing capability on one surface or both surfaces of a polycarbonate resin layer, by applying a silicone hard coat composition thereto and curing the composition. The silicone hard coat composition contains a core-shell type tetragonal titanium oxide solid solution dispersion that is obtained by dispersing a core-shell type tetragonal titanium oxide solid solution in one or more dispersion media selected from among water, alcohols, ethers, esters and ketones. The core-shell type tetragonal titanium oxide solid solution comprises cores that are formed of tetragonal titanium oxide fine particles, in which atoms of one or more elements selected from among Co, Sn and Mn are solid-solved, and shells that are formed of silicon oxide or aluminum oxide and are arranged outside the cores.
    Type: Application
    Filed: March 25, 2014
    Publication date: September 22, 2016
    Applicants: TEIJIN LIMITED, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yukiko UZAWA, Hiroshi KISHIMOTO, Koichi HIGUCHI, Kohei MASUDA
  • Patent number: 9406940
    Abstract: The conductive porous layer for batteries according to the present invention comprises a laminate comprising a first conductive layer and a second conductive layer. The first conductive layer includes at least a conductive carbon material and a polymer. The second conductive layer includes at least a conductive carbon material and a polymer. The conductive porous layer satisfies at least one of the following two conditions: “the polymer in the first conductive layer is present with a high density at the surface of the layer in contact with the second conductive layer than at the surface not in contact with the second conductive layer” and “the polymer in the second conductive layer is present with a higher density at the surface of the layer in contact with the first conductive layer than at the surface not in contact with the first conductive layer.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: August 2, 2016
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Naoya Takeuchi, Hiroshi Kishimoto, Kasumi Oi
  • Patent number: 9113791
    Abstract: Measured blood pressure data is stored in a memory in association with information related to a measurement time. In response to manipulation of a manipulation portion (memory recall switch), blood pressure data associated with the measurement time within a prescribed time period (for example, 10 minutes) from the measurement time of reference blood pressure data, among the blood pressure data stored in the memory, is retrieved as specific data. Then, an average value is calculated based on the specific data, and the calculated average value is displayed as an evaluation index.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: August 25, 2015
    Assignee: OMRON HEALTHCARE Co., Ltd.
    Inventors: Hiroshi Kishimoto, Yukiya Sawanoi, Takahide Tanaka, Kenji Eda
  • Patent number: 9091861
    Abstract: The present invention relates to a scanning microscope, which can acquire an undistorted image of a desired area of a sample using a simple configuration. When a sample is observed, a galvano-scanner rotates a scanning mirror based on a supplied driving signal, so as to scan the sample with illumination light. A sampling circuit samples an electric signal acquired by performing photoelectric conversion on observation light from the sample, in synchronization with a sampling clock. If the scanning mirror is driven so that the rotation angle thereof non-linearly changes with respect to time, the sampling circuit appropriately suppresses sampling based on the sampling clock, so that sampling is executed only when the scanning mirror is at a predetermined position. The present invention can be applied to a scanning microscope.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: July 28, 2015
    Assignee: NIKON CORPORATION
    Inventor: Hiroshi Kishimoto
  • Publication number: 20150147675
    Abstract: An object of the present invention is to provide a laminate having food adhesion between a support and a conductive layer. The laminate of the present invention comprises a conductive layer A formed on a support, the conductive layer A containing a conductive carbon material and a polymer, the polymer in the conductive layer A being dense at the surface in contact with the support.
    Type: Application
    Filed: April 25, 2013
    Publication date: May 28, 2015
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Kasumi Oi, Naoya Takeuchi, Hiroshi Kishimoto, Hitoshi Ohtani
  • Publication number: 20150140324
    Abstract: An adhesive laminate having excellent adhesiveness required for attachment to a structural member. The adhesive laminate comprises (A) a light-transmitting substrate layer (layer A) formed from a melt extruded thermoplastic resin, (B) a hard coat layer (layer B) formed by using a hard coating agent containing not less than 10 wt % of colloidal silica and/or an alkoxysilane hydrolysis condensate based on the total weight of the hard coat excluding a solvent, (C) an adhesive primer layer (layer C) and GK228PCT-13-5-2 and is to be attached to a structural member, wherein (i) the layers A to D are formed in this order; (ii) the layer C is formed from a primer composition comprising a silane coupling agent and has a thickness of 1 to 20 ?m and an indentation elasticity modulus measured by a nano-indentation method under a load of 800 ?N of 500 to 4,000 MPa; and (iii) the thickness (Y) of the layer D is 0.
    Type: Application
    Filed: May 29, 2013
    Publication date: May 21, 2015
    Inventors: Hiroshi Kishimoto, Yume Morita, Yukiko Uzawa, Daisuke Takahashi