Abstract: Provided is a resin composition which is capable of improving the bending property and the cutting processability of a B-stage film and which is capable of reducing the dielectric loss tangent of a cured product and improving the thermal dimensional stability of the cured product. The resin composition according to the present invention includes an epoxy compound, a curing agent and an inorganic filler, the epoxy compound containing a liquid epoxy compound having a viscosity of 500 mPa·s or less at 25° C., in an amount of 1% by weight or more and 10% by weight or less based on 100% by weight of the whole of the epoxy compound.

Abstract: Provided is a laminated body capable of reducing the surface roughness of the surface of a roughening-treated cured body layer, and increasing the adhesive strength between the cured body layer and a metal layer. A laminated body includes a cured body layer formed by: laminating a resin film on a substrate, forming a preliminary-cured body layer by preliminary-curing the resin film at 100° C. to 200° C., and performing a roughening treatment on the surface of the cured object layer at 55° C. to 80° C. The resin film is formed from a resin composition including an epoxy resin, a phenol curing agent, a curing accelerator, and a surface-treated substance which is a surface treated, using 0.5 to 3.5 parts by weight of a silane coupling agent, on 100 parts by weight of inorganic filler with a mean particle diameter of 0.05 to 1.5 ?m. The silane coupling agent has an epoxy group, an imidazole group, or an amino group.

Abstract: A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B).

Abstract: Provided is a resin composition, a prepreg, a cured body, a sheet-like formed body, a laminate, and a multilayered laminate using the resin composition, the resin composition including an epoxy resin and an inorganic filler. For example, when a second layer is formed onto the surface of a cured body, the cured body has improved adhesive property or adhesive property between the cured body and the second layer. A resin composition comprising an epoxy resin, a curing agent for the epoxy resin, a silica treated with an imidazole silane and having a mean particle diameter not more than 5 micrometers, the resin composition including the silica at a proportion of 0.1 to 80 parts by weight to a mixture consisting of the epoxy resin and the curing agent for the epoxy resin 100 parts by weight.