Abstract: A polishing pad that can suppress the occurrence of scratches, a method for producing the polishing pad, and a method for polishing the surface of an optical material or a semiconductor material using the polishing pad is disclosed. The polishing pad has a polishing layer including microspheres, wherein open pores are present on a surface of the polishing layer. Additionally, in a number fraction-based distribution curve of open pore diameter on a surface of the polishing layer, a peak top is present in a region with an open pore diameter of 15 ?m or less, and a number fraction of the open pores at the peak top is 15% or more.

Abstract: An object of the present invention is to provide a polishing pad that uses a polyol different from conventionally used polyols such as PTMG as a high molecular weight polyol of an isocyanate-terminated urethane prepolymer that forms a polishing layer, a method for producing the polishing pad, and a method for polishing the surface of an optical material or a semiconductor material using the polishing pad. A polishing pad having a polishing layer comprising a polyurethane resin, wherein the polyurethane resin is a cured product of a curable resin composition comprising an isocyanate-terminated urethane prepolymer and a curing agent, and the isocyanate-terminated urethane prepolymer is a reaction product of a polyol component and a polyisocyanate component, and the polyol component comprises a polyol having a carbonate group in a molecule.

Abstract: A electromagnetic wave test device includes: a reverberation chamber; a first antenna installed inside the chamber and radiating electromagnetic waves of a frequency lower than the chamber's first resonance frequency; a second antenna installed inside the chamber and radiating electromagnetic waves of a frequency equal to or higher than first resonance frequency; a power supply device connected between a grounding member and first antenna and feeding power to the first antenna; a dummy load connected between the grounding member and first antenna; a first power loss inhibiting unit having an impedance corresponding to an allowed value for power loss according to first antenna in a case wherein electromagnetic waves are radiated from the second antenna; and a switching unit including a first switching unit that switches a connection destination of first antenna to one of the dummy load and the first power loss inhibiting unit.

Abstract: This polishing pad has a polishing layer that comprises a polyurethane resin foam derived from an isocyanate-terminated prepolymer and a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80° C. to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80° C. is 2.6-3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC40) of an amorphous phase in the polishing layer as measured by pulse NMR at 40° C. to the content proportion by weight (CC40) of a crystalline phase in the polishing layer as measured by pulse NMR at 40° C. is 0.5-0.9.

Abstract: Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous phase content in the polishing layer measured at 80° C. by a pulsed NMR method to a weight proportion (NC40) of the amorphous phase content in the polishing layer measured at 40° C. by the pulsed NMR method is between 1.5 and 2.5.

Abstract: A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E?B40/E?T40) of a storage elastic modulus E?B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E?T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.

Abstract: A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 ?m, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 ?m, the sum of pores that are 25 ?m or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 ?m or greater is 20% or less with respect to the total area of the pores in the cross-section.

Abstract: This polishing pad has a polishing layer that comprises a polyurethane resin foam derived from an isocyanate-terminated prepolymer and a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80° C. to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80° C. is 2.6-3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC40) of an amorphous phase in the polishing layer as measured by pulse NMR at 40° C. to the content proportion by weight (CC40) of a crystalline phase in the polishing layer as measured by pulse NMR at 40° C. is 0.5-0.9.

Abstract: A computer-readable medium capable of estimating a distribution of an electromagnetic field intensity of radiant interference waves on a virtual surface surrounding a test piece with high accuracy while inhibiting an increase of a time required for a radiant interference wave test for radiant interference waves having a frequency included in a wider frequency band is provided. A computer-readable medium storing instructions which, when executed by a computer, cause the computer to execute a first calculation step of calculating an upper limit value of a measurement interval of radiant interference waves using an antenna based on positions of a plurality of electromagnetic wave sources according to a test piece radiating the radiant interference waves and a relative positional relation between the antenna measuring the radiant interference waves and the test piece.

Abstract: A polishing pad is equipped with a polishing layer having a polyurethane sheet, wherein a tan ? peak value change rate determined by formula: tan ? peak value change rate=|tan ? peakwet?tan ? peakdry|/tan ? peakdry×100, is not more than 15%, where tan ? peakwet represents the peak value of the loss tangent tan ?, of the polyurethane sheet in a wet state after being immersed in water for three days, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz, and tan ? peakdry represents the peak value of the loss tangent tan ?, of the polyurethane sheet in a dry state without being immersed in water, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz.

Abstract: The present invention provides a polishing pad that can suppress variations in light transmittance or a polishing pad that can reduce adhesion and sticking of polishing swarf to the surface on the polishing surface side of the light-transmitting resin member (window member).

Abstract: The present invention relates to a polishing pad including a polishing layer and a cushion layer, wherein a ratio E?B40/E?C40 of a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E?B40, to a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a compression mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E?C40, is 3.0 or more and 15.0 or less, and a loss factor tan ? in the dynamic viscoelasticity measurement performed under the bending mode condition is 0.10 or more and 0.30 or less in a range of 40° C. or more and 70° C. or less.

Abstract: A polishing pad contains: a polishing layer having a polishing surface for polishing a workpiece; and a cushion layer disposed on the side of the polishing layer opposite from the polishing surface. With regard to the ratio (tan?) of the storage elastic modulus E? to the loss elastic modulus E? of the whole polishing pad, as obtained through dynamic viscoelasticity measurement using frequency dispersion (25° C.) in a bending mode, the ratio of the maximum value of tan? measured at 100-1000 rad/s (tan?max100-100) to the maximum value of tan? measured at 1 to 10 rad/s (tan?max1-10) is 0.75 to 1.30.

Abstract: An electromagnetic stirrer including: a shaft body extending in a first direction; and a plurality of stirring blades disposed on the shaft body, in which the plurality of stirring blades include a first stirring blade and a second stirring blade, the first stirring blade and the second stirring blade are aligned from a reference position of the shaft body in the first direction in order of the first stirring blade and the second stirring blade, a shape of the first stirring blade and a shape of the second stirring blade are similar to each other, and a size of the first stirring blade is different from a size of the second stirring blade.

Abstract: A electromagnetic wave test device includes: a reverberation chamber; a first antenna installed inside the chamber and radiating electromagnetic waves of a frequency lower than the chamber's first resonance frequency; a second antenna installed inside the chamber and radiating electromagnetic waves of a frequency equal to or higher than first resonance frequency; a power supply device connected between a grounding member and first antenna and feeding power to the first antenna; a dummy load connected between the grounding member and first antenna; a first power loss inhibiting unit having an impedance corresponding to an allowed value for power loss according to first antenna in a case wherein electromagnetic waves are radiated from the second antenna; and a switching unit including a first switching unit that switches a connection destination of first antenna to one of the dummy load and the first power loss inhibiting unit.

Abstract: Provided is a polishing unit that can reduce penetration of a polishing slurry into a base material layer and that can prevent impairment in polishing performance. A polishing unit (10a) in accordance with a first aspect of the present invention includes: a polishing pad (100a) that includes a polishing layer (101) and a base material layer (103); and a surface plate (150), the base material layer (103) having a diameter smaller than a diameter of the polishing layer (101) and greater than a diameter of the surface plate (150).

Abstract: A reverberation chamber capable of performing an EMS test having high accuracy in a wider frequency band is provided. There is provided a reverberation chamber including an electromagnetic stirrer, in which the electromagnetic stirrer includes: a first stirring blade; and a holding body disposed on a first wall face of the reverberation chamber, extending in a first direction intersecting with the first wall face, and configured to hold the first stirring blade, and the first stirring blade is electrically insulated from the first wall face.

Abstract: An electromagnetic wave measurement point calculation program causing a computer to execute: a correction coefficient calculating function of calculating a correction coefficient for which an interval of heights of an antenna satisfies a sampling theorem based on a relative positional relation between a test body including a radiation source radiating a radiation interference wave and the antenna performing measurement of at least one of an electric field and a magnetic field of the radiation interference wave and a reflection coefficient of the radiation interference wave on a floor face on which the test body is placed; and a measurement height calculating function of sequentially calculating the heights of the antenna in a case in which the measurement is performed using the correction coefficient.

Abstract: A polishing pad includes: a polishing layer having a polyurethane sheet containing substantially spherical cells, wherein E?(90%)/E?(30%) falls within a range of 0.4 to 0.7, where E?(90%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23° C. and a relative humidity of 90%, as measured in a tension mode at 40° C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz, and E?(30%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23° C. and a relative humidity of 30%, as measured in a tension mode at 40° C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz. Also provided is a method for manufacturing the polishing pad.

Abstract: A polishing layer having an endpoint detection window is manufactured in the following manner. First, a curing agent and a polymer which form the endpoint detection window are mixed, and then the mixture is poured into a mold to form a columnar material. Next, the roughness of the outer peripheral surface of the columnar material is adjusted, and a plurality of projections and recesses are formed on the outer peripheral surface. Next, in a state where the columnar material is housed in a mold frame, the mixture obtained by mixing the polymer and the curing agent is poured into the mold frame and solidified to create a polyurethane polyurea resin molded article. Next, the polyurethane polyurea resin molded article is horizontally cut with a necessary thickness so as to form a sheet-like member, and the sheet-like member forms a polishing layer having the endpoint detection window.