Patents by Inventor Hiroshi Maenaka
Hiroshi Maenaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12077677Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.Type: GrantFiled: December 10, 2021Date of Patent: September 3, 2024Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Hiroshi Maenaka, Ryosuke Takahashi, Takanori Inoue, Yoshito Fujita, Osamu Inui
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Patent number: 11492528Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.Type: GrantFiled: June 21, 2018Date of Patent: November 8, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Osamu Inui, Hiroshi Maenaka
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Patent number: 11459443Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.Type: GrantFiled: June 21, 2018Date of Patent: October 4, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Kazuyuki Yahara, Osamu Inui, Hiroshi Maenaka
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Publication number: 20220098419Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.Type: ApplicationFiled: December 10, 2021Publication date: March 31, 2022Inventors: Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Hiroshi Maenaka, Ryosuke Takahashi, Takanori Inoue, Yoshito Fujita, Osamu Inui
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Patent number: 11220604Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.Type: GrantFiled: November 5, 2014Date of Patent: January 11, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Hiroshi Maenaka, Ryosuke Takahashi, Takanori Inoue, Yoshito Fujita, Osamu Inui
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Publication number: 20210139761Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.Type: ApplicationFiled: June 21, 2018Publication date: May 13, 2021Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Osamu Inui, Hiroshi Maenaka
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Publication number: 20200216659Abstract: Provided is a resin material capable of effectively enhancing adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio of more than 2, and a binder resin, an absolute value of a difference between an average particle diameter of the first inorganic particles and an average major diameter of the second inorganic particles is 10 ?m or less, the average particle diameter of the first inorganic particles is 1 ?m or more and less than 20 ?m, the average major diameter of the second inorganic particles is 2 ?m or more, and the content of the second inorganic particles is more than 40% by volume relative to 100% by volume of sum of the first inorganic particles and the second inorganic particles.Type: ApplicationFiled: June 21, 2018Publication date: July 9, 2020Inventors: Yuko KAWAHARA, Keigo OOWASHI, Kouji ASHIBA, Rui ZHANG, Osamu INUI, Hiroshi MAENAKA
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Publication number: 20200181358Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.Type: ApplicationFiled: June 21, 2018Publication date: June 11, 2020Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Kazuyuki Yahara, Osamu Inui, Hiroshi Maenaka
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Patent number: 10477671Abstract: There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 ?m or less, the total thickness of the first metal material and the second metal material is 200 ?m or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.Type: GrantFiled: September 29, 2016Date of Patent: November 12, 2019Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Hiroshi Maenaka, Osamu Inui
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Publication number: 20180302976Abstract: There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 ?m or less, the total thickness of the first metal material and the second metal material is 200 ?m or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.Type: ApplicationFiled: September 29, 2016Publication date: October 18, 2018Inventors: Hiroshi Maenaka, Osamu Inui
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Patent number: 9337019Abstract: Provided is a method for producing an electronic component, which is capable of forming a cured adhesive layer easily with high accuracy. The method for producing a curable film electronic component according to the present invention includes an application step in which an adhesive is applied onto a first electronic component body using an ink jet device to form an adhesive layer, a first light irradiation step in which an adhesive layer is irradiated with light from a first light irradiation part, an attachment step in which a second electronic component body is disposed on the adhesive layer irradiated with light and attached, and a step in which the adhesive layer is cured by heating, thereby giving an electronic component, the ink jet device includes an ink tank to store the adhesive, a discharge part, and a circulation flow path part, and in the application step, the adhesive is applied while being circulated in the ink jet device.Type: GrantFiled: November 18, 2014Date of Patent: May 10, 2016Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Hiroshi Maenaka, Ryosuke Takahashi, Takanori Inoue, Yoshito Fujita
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Publication number: 20160049297Abstract: Provided is a method for producing an electronic component, which is capable of forming a cured adhesive layer easily with high accuracy. The method for producing a curable film electronic component according to the present invention includes an application step in which an adhesive is applied onto a first electronic component body using an ink jet device to form an adhesive layer, a first light irradiation step in which an adhesive layer is irradiated with light from a first light irradiation part, an attachment step in which a second electronic component body is disposed on the adhesive layer irradiated with light and attached, and a step in which the adhesive layer is cured by heating, thereby giving an electronic component, the ink jet device includes an ink tank to store the adhesive, a discharge part, and a circulation flow path part, and in the application step, the adhesive is applied while being circulated in the ink jet device.Type: ApplicationFiled: November 18, 2014Publication date: February 18, 2016Inventors: Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Hiroshi Maenaka, Ryosuke Takahashi, Takanori Inoue, Yoshito Fujita
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Publication number: 20160046813Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.Type: ApplicationFiled: November 5, 2014Publication date: February 18, 2016Inventors: Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Hiroshi Maenaka, Ryosuke Takahashi, Takanori Inoue, Yoshito Fujita, Osamu Inui
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Patent number: 7981511Abstract: It is the object of the present invention to provide a hollow resin particle and an organic-inorganic hybrid particle, which have excellent dispersibility in a binder component and prevent the diffuse reflection of light and can attain an antireflection layer having high alkali resistance when used as a particle constituting an antireflection layer having a low refractive index, and a method of producing the hollow resin particle.Type: GrantFiled: March 16, 2005Date of Patent: July 19, 2011Assignee: Sekisui Chemical Co., Ltd.Inventors: Hiroshi Maenaka, Michiya Nakagawa, Hiroyuki Nishimoto
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Publication number: 20110159296Abstract: The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability.Type: ApplicationFiled: March 4, 2009Publication date: June 30, 2011Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Hiroshi Maenaka, Takuji Aoyama, Yasunari Kusaka, Isao Higuchi, Takashi Watanabe, Ryousuke Takahashi, Syunsuke Kondou
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Publication number: 20110135911Abstract: The present invention provides an insulating sheet which is excellent in handleability when it is uncured, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, acid resistance, and processability, and a multilayer structure produced by the use of the insulating sheet. The insulating sheet comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy resin (B1) having a weight average molecular weight of less than 10,000 and an oxetane resin (B2) having a weight average molecular weight of less than 10,000; (C) a curing agent; and (D) at least one of magnesium carbonate anhydrous (D1) represented by MgCO3 and containing no crystal water and a coated body (D2) obtainable by coating the surface of the magnesium carbonate anhydrous (D1) with an organic resin, a silicone resin, or silica.Type: ApplicationFiled: August 4, 2009Publication date: June 9, 2011Inventors: Hiroshi Maenaka, Isao Higuchi, Yasunari Kusaka, Takuji Aoyama, Takashi Watanabe, Daisuke Nakajima, Ryousuke Takahashi
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Publication number: 20100297453Abstract: The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity.Type: ApplicationFiled: September 2, 2008Publication date: November 25, 2010Inventors: Hiroshi Maenaka, Yasunari Kusaka, Takuji Aoyama, Isao Higuchi, Daisuke Nakajima, Takashi Watanabe
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Publication number: 20070251422Abstract: It is the object of the present invention to provide a hollow resin particle and an organic-inorganic hybrid particle, which have excellent dispersibility in a binder component and prevent the diffuse reflection of light and can attain an antireflection layer having high alkali resistance when used as a particle constituting an antireflection layer having a low refractive index, and a method of producing the hollow resin particle. The present invention is a hollow resin particle, which has a single hollow structure, an average particle diameter being 10 to 100 nm and a refractive index being 1.40 or less.Type: ApplicationFiled: March 16, 2005Publication date: November 1, 2007Inventors: Hiroshi Maenaka, Michiya Nakagawa, Hiroyuki Nishimoto
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Publication number: 20060116468Abstract: The present invention aims to provide a method for producing a resin fine particle by which a resin fine particle with high sphericity and even particle diameter can easily be obtained, a resin fine particle obtained by the method for producing a resin fine particle, a polyolefin type resin fine particle, a polyester type resin fine particle, and an acrylic resin fine particle. The present invention is a method for producing a resin fine particle, which comprises a step 1 of heating and/or pressurizing a mixture of a resin and a fluid in which the resin is not dissolved in a normal temperature and normal pressure for making at least one component of the fluid supercritical state or subcritical state and a step 2 of decreasing the temperature of the fluid for releasing the pressure.Type: ApplicationFiled: December 4, 2003Publication date: June 1, 2006Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Katsunori Toyoshima, Hiroshi Maenaka, Toshio Tada, Yohei Nishimura