Patents by Inventor Hiroshi Masuya

Hiroshi Masuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11268280
    Abstract: In an anchorage (1) of continuous fiber-reinforced polymer (CFRP) strands that anchors continuous fiber-reinforced polymer strands (2) to concrete structures, there is provided an untwisted diameter-expanded portion (3) expanded to a diameter D2 by being radially expanded with respect to a diameter D1 of a general portion (4) of the CFRP strands (2) by untwisting any section of the CFRP strands (2) formed by stranding a plurality of element wires (20, 21) that are bundles of multiple continuous fibers, and filling and curing a time curable material (5) in a clearance among the element wires the untwisted section that is untwisted.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: March 8, 2022
    Assignees: TOKYO ROPE MANUFACTURING CO., LTD., ORIENTAL SHIRAISHI CORPORATION
    Inventors: Hiroshi Masuya, Yoshihiro Tanaka, Toru Tanaka, Eiji Koda, Hiroshi Watase, Meguru Tsunomoto
  • Publication number: 20210087815
    Abstract: In an anchorage 1 of continuous fiber-reinforced polymer (CFRP) strands that anchors continuous fiber-reinforced polymer strands 2 to concrete structures, there is provided an untwisted diameter-expanded portion 3 expanded to a diameter D2 by being radially expanded with respect to a diameter D1 of a general portion 4 of the CFRP strands 2 by untwisting any section of the CFRP strands 2 formed by stranding a plurality of element wires (20, 21) that are bundles of multiple continuous fibers, and filling and curing a time curable material 5 in a clearance among the element wires the untwisted section that is untwisted.
    Type: Application
    Filed: July 11, 2018
    Publication date: March 25, 2021
    Applicants: TOKYO ROPE MANUFACTURING CO., LTD., ORIENTAL SHIRAISHI CORPORATION
    Inventors: Hiroshi MASUYA, Yoshihiro TANAKA, Toru TANAKA, Eiji KODA, Hiroshi WATASE, Meguru TSUNOMOTO
  • Patent number: 7896983
    Abstract: In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: March 1, 2011
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hiroshi Koyama, Koichi Tamatsu, Masato Sugawara, Jun Umeno, Hiroshi Machida, Hiroshi Masuya, Fumiaki Kimura, Yasuaki Tsuji, Akihiro Katsuya, Takahiro Nakamura
  • Publication number: 20060200990
    Abstract: In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.
    Type: Application
    Filed: May 9, 2006
    Publication date: September 14, 2006
    Inventors: Hiroshi Koyama, Koichi Tamatsu, Masato Sugawara, Jun Umeno, Hiroshi Machida, Hiroshi Masuya, Fumiaki Kimura, Yasuaki Tsuji, Akihiro Katsuya, Takahiro Nakamura
  • Publication number: 20040119146
    Abstract: A semiconductor device including: an inner lead having a sloping section sloping upward and outward; a die pad; a semiconductor chip having an electrode and bonded to the die pad; a wire electrically connecting the inner lead to the electrode; a sealing section sealing the inner lead, the semiconductor chip, and the wire; and an outer lead extending outward from the sealing section.
    Type: Application
    Filed: September 17, 2003
    Publication date: June 24, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Hiroshi Masuya
  • Publication number: 20020170177
    Abstract: In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.
    Type: Application
    Filed: March 7, 2002
    Publication date: November 21, 2002
    Inventors: Hiroshi Koyama, Koichi Tamatsu, Masato Sugawara, Jun Umeno, Hiroshi Machida, Hiroshi Masuya, Fumiaki Kimura, Yasuaki Tsuji, Akihiro Katsuya, Takahiro Nakamura