Abstract: A printed circuit substrate includes a circuit unit, a first main frame ground interconnection, a first sub frame ground interconnection spaced away from the first main frame ground interconnection in a first direction, and a first conductive via connecting the first main frame ground interconnection and the first sub frame ground interconnection to each other. In plan view from the first direction, a second outer periphery of the first sub frame ground interconnection is surrounded by a first outer periphery of the first main frame ground interconnection. Thus, a printed circuit substrate that can prevent the circuit unit from malfunctioning can be provided.

Abstract: A printed circuit substrate includes a circuit unit, a first main frame ground interconnection, a first sub frame ground interconnection spaced away from the first main frame ground interconnection in a first direction, and a first conductive via connecting the first main frame ground interconnection and the first sub frame ground interconnection to each other. In plan view from the first direction, a second outer periphery of the first sub frame ground interconnection is surrounded by a first outer periphery of the first main frame ground interconnection . Thus, a printed circuit substrate that can prevent the circuit unit from malfunctioning can be provided.

Abstract: A heat dissipation plate includes: a substantially rectangular heat transfer surface that comes in contact with an electronic component; a plurality of side walls that are provided respectively in four directions of the heat transfer surface; and a heat-dissipation base surface that is connected to the heat transfer surface via the side walls. The heat generated by the electronic component is received by the heat transfer surface, is transmitted from the heat transfer surface to the heat-dissipation base surface via the side walls, and is dissipated from the heat-dissipation base surface. A plurality of vents are provided on at least one of the side walls.

Abstract: An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region.

Abstract: An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region.

Abstract: A method of producing a metal mold is disclosed. A heat resistant sheet is forcedly brought into close contact with a product configuration surface of a matrix such as a wooden pattern, a resin model, or the like by making use of negative pressure. The matrix is brought into contact with a melt of a low melting-point alloy while that state of close contact is being maintained and the melt is allowed to cool as it is, thereby casting one part of the mold which makes up a pair. The matrix is then removed, and by using the one part of the mold thus cast as a new matrix, this new matrix is brought into contact with the melt of a low melting-point alloy via the heat resistant rubber sheet and is allowed to cool as it is, thereby casting a counterpart of the mold that makes up the pair.

Abstract: A fuel cell comprises at least two cell members, each of which has a flat-plate solid electrolyte having a fuel electrode layer on one surface thereof and an air electrode layer on the other surface thereof, separators, each of which is arranged between the cell members and comprises frame materials and metallic sheets having concave and convex portions and being coupled to the frame materials, a fuel supply path for supplying fuel and an air supply path for supplying air, a fuel discharge path for disharging fuel and an air exhaust path for exhausting air and collector members mounted on the outer sides of the separators of the highest and lowest stages.

Abstract: An apparatus for removing bubbles in paint comprises a sealed container having an upper section and a lower section divided by a plate having one or more slit-like through holes and a pressure reducing device connected to the lower section. A paint coating system includes the bubble removing apparatus, a tank for storing a new paint, a first pipe line to feed paint from the tank to the upper section of the sealed container, a curtain flow coater or a roll coater communicated with the lower section of the sealed container so as to receive paint without bubbles, and a vessel to collect paint which does not contribute to form a coating layer.

Abstract: A mass flow controller including a valve assembly wherein a flow rate-controlling portion of the valve assembly is mirror finished and wherein the maximum flow rate through the flow rate-controlling portion during the time that the flow rate is not being controlled is set so as to be sufficiently large in comparison with the flow rate during control whereby a moisture purging function may be performed without external fluid bypass circuits.

Abstract: A fuel cell comprises a stack of cell members, each cell member including a flat-plate separator, an air electrode, a solid electrolyte and a fuel electrode, spacers arranged along peripheries of the separators among the separators of the stack of cell members, air supply paths for supplying air to the air electrodes, air being sent to the air electrodes through grooves of the flat-plate separators and air supply paths, air exhaust paths for exhausting excessive air, fuel supply paths for sending fuel to the fuel electrodes and fuel discharge paths for discharging excessive fuel. The fuel cell has an oxidation-resistant coating layer on the surface of the separator on the side of the air electrode. The solid electrolyte is made by the use of one selected from the group of Laser Physical Vapor Deposition Method, Plasma Thermal Spraying Method, Electron Beam Vapor Deposition Method and Sputtering Method.

Abstract: Water-reducing additives for ceramic material, and especially for cement paste, mortar or concrete, which comprise a phenolic compound having a sulfo radical or a sulfomethyl radical, wherein the hydrogen atoms of acidic radicals in part of said phenolic compound molecules are substituted by atoms of sodium, potassium or calcium.