Patents by Inventor Hiroshi Mikino

Hiroshi Mikino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
    Patent number: 5031821
    Abstract: The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.
    Type: Grant
    Filed: August 16, 1989
    Date of Patent: July 16, 1991
    Assignees: Hitachi, Ltd., Hitachi Microcomputer Engineering Ltd., Hitachi Tokyo Electronics Co., Ltd.
    Inventors: Tsuyoshi Kaneda, Susumu Okikawa, Hiroshi Mikino, Hiroshi Watanabe, Toshihiro Satou, Atsushi Onodera, Michio Tanimoto
  • Semiconductor device and method of manufacturing the same
    Patent number: 4845543
    Abstract: A semiconductor device in which a pellet and external leads are connected by bonding wires made of aluminum containing a predetermined amount of at least one additive element, the bonding wires containing 0.05 to 3.0 weight % of at least one element selected from the group consisting of iron and palladium, or containing 0.05-3.0 weight % of at least one first element selected from the group consisting of nickel, iron and palladium and 0.05-3.0 weight % of at least one second element selected from the group consisting of magnesium, manganese and silicon, whereby the corrosion resistance of the wire is increased and the breaking strength of the wire is enhanced. The bonding wires can be connected to the semiconductor pellet by a ball bond, and it is disclosed that using a ball having a Vickers hardness of 30-50 enables good bonding of the bonding wire to, e.g., an aluminum pad on the semiconductor pellet to be achieved.
    Type: Grant
    Filed: June 29, 1987
    Date of Patent: July 4, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Okikawa, Hiroshi Mikino, Hiromichi Suzuki, Wahei Kitamura, Daiji Sakamoto
  • Method of providing semiconductor pellet with heat sink
    Patent number: 4123293
    Abstract: A method of providing a silicon semiconductor pellet with a heat sink and a semiconductor device with such a heat sink. The heat sink to which the pellet is bonded with a eutectic alloy of gold and silicon interposed therebetween consists mainly of copper and contains a small amount of a metal other than copper and has been subjected to an annealing treatment.
    Type: Grant
    Filed: March 3, 1976
    Date of Patent: October 31, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Okikawa, Osamu Yukawa, Hiroshi Mikino, Yoshio Nonaka
  • Resin-sealed type semiconductor devices and manufacturing method of the same
    Patent number: 4100566
    Abstract: When a resin-sealed type semiconductor device having a heat dissipating plate is mounted on a mounting plate by means of screws or the like, means are provided to prevent occurrence of cracks in the resin sealing portion and semiconductor circuit elements embodied therein. To this end, the resin body, heat dissipating plate or mounting plate is thickened at portions thereof where screw receiving apertures are formed. Alternatively, washer or the like member may be employed.
    Type: Grant
    Filed: March 23, 1977
    Date of Patent: July 11, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Okikawa, Hiroshi Mikino