Patents by Inventor Hiroshi Minamisawa

Hiroshi Minamisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot-melt adhesive and its use in polyimide film and printed circuit board
    Patent number: 5212279
    Abstract: A hot-melt adhesive comprising a special polyamideimide or polyamide is excellent in heat resistance and adhesive strength and usable for providing substrates for printed circuit boards.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: May 18, 1993
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yoshihiro Nomura, Takashi Morinaga, Toshiaki Fukushima, Hiroshi Minamisawa, Kazuhito Hanabusa
  • Solvent-soluble polyimide and production thereof
    Patent number: 4954612
    Abstract: A solvent-soluble polyimide obtained from an exo-form dicarboxylic acid anhydride with an aromatic diamine, e.g. 2,2,-bis[4-(4-aminophenoxy)phenyl]propane is improved in film-forming properties and transparency, and particularly suitable for producing an orientation controlling film in a liquid crystal display device.
    Type: Grant
    Filed: February 14, 1989
    Date of Patent: September 4, 1990
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yoshihiro Nomura, Kazuhito Hanabusa, Hiroshi Minamisawa, Takashi Morinaga, Toichi Sakata, Yoshiyuki Mukoyama, Hiroshi Nishizawa, Hiromu Miyajima