Patents by Inventor Hiroshi Mogi
Hiroshi Mogi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958301Abstract: A printing apparatus includes a printing unit configured to print an image on a print medium, an acquiring unit configured to acquire temperature information of the printing unit, and a control unit configured to control the printing unit so as to start relative scanning in a case where a temperature that is indicated by the temperature information has reached a print permission temperature. The print permission temperature in a first print mode whose speed at a time of a constant speed in relative scanning is a first speed is a first temperature. The print permission temperature in a second print mode whose speed at the time of the constant speed is a second speed that is faster than the first speed is a second temperature that is lower than the first temperature.Type: GrantFiled: June 23, 2021Date of Patent: April 16, 2024Assignee: Canon Kabushiki KaishaInventors: Takeshi Murase, Kazuhiko Sato, Taku Yokozawa, Noboru Kunimine, Hiroshi Taira, Hiroshi Kawafuji, Sae Mogi, Akiko Aichi
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Patent number: 11919300Abstract: An inkjet printing apparatus adopting short pulse heating is designed to output a uniform image without unevenness. To this end, in a serial inkjet printing apparatus, a print head is subjected to a short pulse heating treatment before each print scan is carried out. In a case where a print medium is a first print medium, the print head is heated to a first target temperature before carrying out each of the print scans. In a case where the print medium is a second print medium, the print head is heated to a second target temperature lower than the first target temperature before carrying out each of the print scans.Type: GrantFiled: March 15, 2021Date of Patent: March 5, 2024Assignee: Canon Kabushiki KaishaInventors: Hiroshi Kawafuji, Kazuhiko Sato, Kazuo Suzuki, Takeshi Murase, Hiroshi Taira, Tomoki Yamamuro, Sae Mogi, Masaki Nitta
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Patent number: 11919321Abstract: A printing apparatus includes a printing unit configured to print an image on a print medium, an acquiring unit configured to acquire temperature information of the printing unit, and a control unit configured to control the printing unit so as to start relative scanning in a case where a temperature that is indicated by the temperature information has reached a print permission temperature. The print permission temperature in a first print mode whose speed at a time of a constant speed in relative scanning is a first speed is a first temperature. The print permission temperature in a second print mode whose speed at the time of the constant speed is a second speed that is faster than the first speed is a second temperature that is lower than the first temperature.Type: GrantFiled: June 23, 2021Date of Patent: March 5, 2024Assignee: Canon Kabushiki KaishaInventors: Takeshi Murase, Kazuhiko Sato, Taku Yokozawa, Noboru Kunimine, Hiroshi Taira, Hiroshi Kawafuji, Sae Mogi, Akiko Aichi
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Publication number: 20220371246Abstract: An injection molding machine managing system includes a managing device, and an injection molding machine communicably connected with the device and performing at least one of the following: send data to the device; and receive data from the device. Upon a version mismatch between these device and machine, the system performs at least one of the following: send a notification about the mismatch to a user; and perform a process for removing the mismatch. An injection molding machine includes a control device, and a driver communicably connected with the device and performing at least one of the following: send data to the device; and receive data from the device. Upon a version mismatch between these device and driver, the machine performs at least one of the following: send a notification about the mismatch to a user; and perform a process for removing the mismatch.Type: ApplicationFiled: August 5, 2022Publication date: November 24, 2022Inventors: Mikio ARITA, Hiroshi MOGI,
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Publication number: 20220355522Abstract: An injection molding machine management system SYS according to an embodiment includes an injection molding machine and a management device provided outside the injection molding machine and that monitors an abnormality in the injection molding machine, in which in a case where an abnormality occurs in the injection molding machine, the management device automatically reboots the injection molding machine in a safe mode having a more limited function than a normal boot mode. In addition, an injection molding machine according to another embodiment includes a CPU and an FPGA that monitors an abnormality in a predetermined software executed by the CPU, in which in a case where an abnormality occurs in a system software executed by the CPU, the FPGA automatically reboots the system software of the CPU in a safe mode having a more limited function than the normal boot mode.Type: ApplicationFiled: July 26, 2022Publication date: November 10, 2022Inventors: Mikio Arita, Hiroshi Mogi
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Publication number: 20220274305Abstract: An injection molding machine includes a mold clamping unit that clamps a mold unit, an injection unit that fills the mold unit clamped by the mold clamping unit with a molding material, and an ejector unit that takes out a molding product from the mold unit after the molding material with which the mold unit is filled by the injection unit is cooled and solidified, in which a communication cycle in which data is exchanged in at least one path of between two internal devices and between the injection molding machine and an external device is shorter than a control cycle in which predetermined control is performed using received data.Type: ApplicationFiled: May 17, 2022Publication date: September 1, 2022Inventors: Kazuki Tanida, Hiroshi Mogi, Mikio Arita
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Publication number: 20220212386Abstract: According to an embodiment of the present disclosure, there is provided an injection molding machine including a mold clamping unit that clamps a mold unit, an injection unit that fills the mold unit clamped by the mold clamping unit with a molding material, an ejector unit that takes out a molding product from the mold unit after the molding material filled by the injection unit is cooled and solidified, a plurality of data acquisition units that acquire different types of data from each other, and a data transmission unit that transmits data acquired by the plurality of data acquisition units to a management device in a state where the data are capable of being compared in time-series for each type of data.Type: ApplicationFiled: March 24, 2022Publication date: July 7, 2022Inventors: Mikio Arita, Hiroshi Mogi
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Patent number: 10781104Abstract: Provided is a composite substrate which is provided with: a single crystal silicon carbide thin film 11 having a thickness of 1?m or less; a handle substrate 12 which supports the single crystal silicon carbide thin film 11 and is formed from a heat-resistant material (excluding single crystal silicon carbide) having a heat resistance of not less than 1,100° C.; and an intervening layer 13 which has a thickness of 1?m or less and is arranged between the single crystal silicon carbide thin film 11 and the handle substrate 12, and which is formed from at least one material selected from among silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, zirconium oxide, silicon and silicon carbide, or from at least one metal material selected from among Ti, Au, Ag, Cu, Ni, Co, Fe, Cr, Zr, Mo, Ta and W. This composite substrate according to the present invention enables the formation of a nanocarbon film having few defects at low cost.Type: GrantFiled: December 16, 2015Date of Patent: September 22, 2020Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shoji Akiyama, Yoshihiro Kubota, Makoto Kawai, Shigeru Konishi, Hiroshi Mogi
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Publication number: 20180265360Abstract: Provided is a composite substrate which is provided with: a single crystal silicon carbide thin film 11 having a thickness of 1?m or less; a handle substrate 12 which supports the single crystal silicon carbide thin film 11 and is formed from a heat-resistant material (excluding single crystal silicon carbide) having a heat resistance of not less than 1,100° C.; and an intervening layer 13 which has a thickness of 1?m or less and is arranged between the single crystal silicon carbide thin film 11 and the handle substrate 12, and which is formed from at least one material selected from among silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, zirconium oxide, silicon and silicon carbide, or from at least one metal material selected from among Ti, Au, Ag, Cu, Ni, Co, Fe, Cr, Zr, Mo, Ta and W. This composite substrate according to the present invention enables the formation of a nanocarbon film having few defects at low cost.Type: ApplicationFiled: December 16, 2015Publication date: September 20, 2018Applicants: Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Co., Ltd.Inventors: Shoji Akiyama, Yoshihiro Kubota, Makoto Kawai, Shigeru Konishi, Hiroshi Mogi
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Patent number: 9512953Abstract: Provided is a thermal insulation laminate having both of an excellent thermal insulation property and high visible light transmittance, and further having a provided antifouling property and an excellent scratch resistance. A thermal insulation laminate includes a photocatalytic layer (4); a transparent thermal insulation layer (10) having two transparent base plates (1, 1) and composite materials including a fiber assembly (2) and inorganic particles (3) therebetween; and an adhesive layer (5); the photocatalytic layer (4) is an outermost layer of one side thereof, and the adhesive layer (5) is an outermost layer of other side. A hard coat layer may be sandwiched in either at least one of between the photocatalytic layer (4) and the transparent thermal insulation layer (10), and between the transparent thermal insulation layer (10) and the adhesive layer (5).Type: GrantFiled: January 3, 2014Date of Patent: December 6, 2016Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Hiroshi Mogi, Yoshihiro Kubota
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Publication number: 20140120794Abstract: Provided is a thermal insulation laminate having both of an excellent thermal insulation property and high visible light transmittance, and further having a provided antifouling property and an excellent scratch resistance. A thermal insulation laminate includes a photocatalytic layer (4); a transparent thermal insulation layer (10) having two transparent base plates (1, 1) and composite materials including a fiber assembly (2) and inorganic particles (3) therebetween; and an adhesive layer (5); the photocatalytic layer (4) is an outermost layer of one side thereof, and the adhesive layer (5) is an outermost layer of other side. A hard coat layer may be sandwiched in either at least one of between the photocatalytic layer (4) and the transparent thermal insulation layer (10), and between the transparent thermal insulation layer (10) and the adhesive layer (5).Type: ApplicationFiled: January 3, 2014Publication date: May 1, 2014Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Hiroshi MOGI, Yoshihiro KUBOTA
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Patent number: 8044121Abstract: A cement mold-making silicone rubber composition is provided comprising (A) 100 parts by weight of a polyorganosiloxane having at least two silicon-bonded monovalent aliphatic unsaturated hydrocarbon groups in a molecule, (B) a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms in a molecule, in such an amount as to provide 0.1-5 silicon-bonded hydrogen atoms per monovalent aliphatic unsaturated hydrocarbon group in component (A), (C) a platinum base compound in such an amount as to provide 1-100 ppm of platinum atoms based on the weight of component (A), (D) 5-60 parts by weight of finely divided silica having a specific surface area of at least 50 m2/g, and (E) 0.1-100 parts by weight of coal ash and/or pozzolan powder.Type: GrantFiled: June 25, 2008Date of Patent: October 25, 2011Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroshi Mogi, Susumu Sekiguchi, Thomas Tupa
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Publication number: 20100285168Abstract: An antistatic silicone rubber mold-making material is provided. This mold-making material comprises a silicone rubber composition which is curable by an addition reaction, and which contains an ionically conductive antistatic agent. The article produced by curing this antistatic silicone rubber mold-making material retains the insulator performance and the article exhibits excellent antistatic properties. Also, the article can be colored as desired.Type: ApplicationFiled: July 20, 2010Publication date: November 11, 2010Inventors: Hiroshi MOGI, Michihisa Hara
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Patent number: 7781555Abstract: A microcontact printing stamp is formed by curing a silicone rubber composition on a master. An addition reaction cure silicone rubber composition is used comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated monovalent hydrocarbon groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups, (C) an addition reaction catalyst, and (D) a reinforcing resin. The cured composition has a nonfunctional low-molecular-weight siloxane D3-D20 content of up to 200 ppm.Type: GrantFiled: August 13, 2008Date of Patent: August 24, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Hiroshi Mogi
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Publication number: 20100124664Abstract: A microcontact printing stamp comprising, in laminate structure, a silicone rubber layer overlaid with a fluoroelastomer layer is capable of pattern transfer at a high dimensional accuracy owing to sufficient strength and insusceptibility to solvent swelling.Type: ApplicationFiled: November 16, 2009Publication date: May 20, 2010Inventor: Hiroshi MOGI
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Publication number: 20090326103Abstract: A cement mold-making silicone rubber composition is provided comprising (A) 100 parts by weight of a polyorganosiloxane having at least two silicon-bonded monovalent aliphatic unsaturated hydrocarbon groups in a molecule, (B) a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms in a molecule, in such an amount as to provide 0.1-5 silicon-bonded hydrogen atoms per monovalent aliphatic unsaturated hydrocarbon group in component (A), (C) a platinum base compound in such an amount as to provide 1-100 ppm of platinum atoms based on the weight of component (A), (D) 5-60 parts by weight of finely divided silica having a specific surface area of at least 50 m2/g, and (E) 0.1-100 parts by weight of coal ash and/or pozzolan powder.Type: ApplicationFiled: June 25, 2008Publication date: December 31, 2009Inventors: Hiroshi Mogi, Susumu Sekiguchi, Thomas Tupa
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Publication number: 20090062499Abstract: A microcontact printing stamp is formed by curing a s silicone rubber composition on a master. An addition reaction cure silicone rubber composition is used comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated monovalent hydrocarbon groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups, (C) an addition reaction catalyst, and (D) a reinforcing resin. The cured composition has a nonfunctional low-molecular-weight siloxane D3-D20 content of up to 200 ppm.Type: ApplicationFiled: August 13, 2008Publication date: March 5, 2009Inventor: Hiroshi MOGI
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Publication number: 20080260981Abstract: An antistatic silicone rubber mold-making material is provided. This mold-making material comprises a silicone rubber composition which is curable by an addition reaction, and which contains an tonically conductive antistatic agent. The article produced by curing this antistatic silicone rubber mold-making material retains the insulator performance and the article exhibits excellent antistatic properties. Also, the article can be colored as desired.Type: ApplicationFiled: April 17, 2008Publication date: October 23, 2008Inventors: Hiroshi Mogi, Michihisa Hara
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Publication number: 20080076864Abstract: A silicone rubber composition which cures by condensation is provided. After curing, the silicone rubber exhibits excellent insulation and antistatic properties, and this silicone rubber has overcome the problem of electrostatic adsorption of the dust in the air in the applications including a master template, tampon printing, and a large size industrial roll. The silicone rubber composition which cures by condensation contains an ion conductive antistatic agent.Type: ApplicationFiled: September 19, 2007Publication date: March 27, 2008Applicant: Shin-Etsu Chemical Co., Ltd.Inventor: Hiroshi MOGI
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Publication number: 20060293441Abstract: A silicone rubber composition for the tire production comprises (A) 100 parts by weight of a specified alkenyl group-containing straight-chain diorganopolysiloxane, (B) 1-20 parts by weight of a specified hydrogen atom-containing organohydrogenpolysiloxane, (C) 30-60 parts by weight of an inorganic filler, (D) 0.5-20 parts by weight of a specified alkenyl group-containing straight-chain diorganopolysiloxane having a weight average molecular weight smaller than that of the component (A), and (E) 5-300 ppm of a platinum group metal catalyst as a conversion by weight of platinum group metal to the total amount of the components (A), (B) and (D), provided that the component (D) is previously uniformly mixed with the component (E) and then mixed with the remaining components.Type: ApplicationFiled: June 22, 2006Publication date: December 28, 2006Inventors: Masashi Yano, Hiroshi Mogi