Abstract: Provided are Scissors for an endoscope that include a scissor mechanism part that includes a pair of scissor members connected to each other by a first spindle, and cuts a target site by opening and closing of the one scissor member and the other scissor member with the first spindle as a fulcrum; and an electrode part in which a monopolar electrode (electrode part) is formed on a distal end part of the one scissor member of the one scissor member and the other scissor member. An operator can quickly and extensively cut the target site by using the scissor mechanism part by the pair of scissor members, or can stop bleeding at the target site or cut the target site by using the electrode part.

Abstract: A composite (100) comprises: an integrally molded article of two or more function parts (111) made of a cured material of a liquid resin composition and two or more connection parts (112); and a retention part (120) made of a resin composition different from the liquid resin composition and having two or more through-holes (121) or concave parts. The function parts (111) are respectively arranged inside the through-holes (121) or the concave parts of the retention part (120). The connection parts (112) are joined to a surface of the retention part (120).

Abstract: A light flux controlling member includes a lens body and a cut part. The lens body and the cut part are an integrally molded article composed of a cured product of a liquid resin composition. The cut part extends outward from the entire circumference of the outer peripheral part of the lens body in plan view of the light flux controlling member. The cut part includes the outward-facing end surface bearing a blade mark or a melting mark. In the front-rear direction of the light flux controlling member, the distance between the bottom surfaces of the cut part and the lens body is 20 ?m or more.

Abstract: A composite (100) comprises: an integrally molded article of two or more function parts (111) made of a cured material of a liquid resin composition and two or more connection parts (112); and a retention part (120) made of a resin composition different from the liquid resin composition and having two or more through-holes (121) or concave parts. The function parts (111) are respectively arranged inside the through-holes (121) or the concave parts of the retention part (120). The connection parts (112) are joined to a surface of the retention part (120).

Abstract: A light flux controlling member includes a lens body and a cut part. The lens body and the cut part are an integrally molded article composed of a cured product of a liquid resin composition. The cut part extends outward from the entire circumference of the outer peripheral part of the lens body in plan view of the light flux controlling member. The cut part includes the outward-facing end surface bearing a blade mark or a melting mark. In the front-rear direction of the light flux controlling member, the distance between the bottom surfaces of the cut part and the lens body is 20 ?m or more.

Abstract: According to one embodiment, a mask conveying system includes a stocker, a conveyance path, a storage container, a conveying apparatus, and a control device. The storage container for wafer conveyance has the same structure as the storage container for mask conveyance. The control device determines whether or not the storage container is for mask conveyance when the storage container is introduced into the stocker in an exposure area or the stocker in a mask inspection area, and controls the conveying apparatus such that the storage container is conveyed to the stocker that does not have the storage container introduced when the storage container is for mask conveyance.

Abstract: A pattern inspection method includes: irradiating a first region of a surface of a sample having a pattern to be inspected with a charged particle beam; acquiring a first two-dimensional image showing a state of the surface of the sample; searching for a pattern similar to a previously prepared reference image within the first two-dimensional image; when the pattern similar to the reference image is not detected in the first two-dimensional image, irradiating a second region of the surface of the sample that has not been irradiated with a charged particle beam; acquiring a second two-dimensional image showing a state of the surface of the sample; and searching a pattern similar to the reference image within the second two-dimensional image.

Abstract: A pattern observation apparatus includes: a defect position information input unit which downloads defect position information for a pattern, the defect position information having been detected by an external inspection apparatus with regard to a specimen in which the pattern is formed; a moving unit which moves the specimen so as to bring a place detected as defective by the inspection apparatus into a field of view on the basis of the defect position information; a charged particle source which generates a charged particle beam and applies the charged particle beam to the specimen; a signal processing unit which detects at least one of secondary charged particles, reflected charged particles and back scattering charged particles emitted from the specimen due to the application of the charged particle beam and which outputs data on an inspection image of a specimen surface in the defective place; an inspection unit which re-detects an abnormality of the place detected as defective, on the basis of the inspe

Abstract: A charged particle beam apparatus includes: a charged particle source which generates a charged particle beam to apply to a specimen having a microstructure formed on a surface thereof; an objective lens which excites at least one of an electric field and a magnetic field to converge the charged particle beam onto the specimen; a deflector which scans the specimen with the charged particle beam; a detector which detects at least one of a secondary charged particle, a reflection charged particle and a back scattering charged particle generated from the specimen and which outputs a detection signal; a focusing area arranging unit which arranges a plurality of focusing areas including edge points of the microstructure therein in a surface area of the specimen; a deflection controller which controls the deflector so that the focusing areas are sequentially scanned to correspond to excitation conditions while changing stepwise the excitation conditions of the objective lens; a focus calculator which calculates an

Abstract: A pattern inspection method includes: generating a charged particle beam to irradiate the charged particle beam to a sample having a surface on which a pattern to be inspected is formed; detecting at least one of a secondary charged particle, a reflection charged particle and a back scattering charged particle emitted from the sample due to the irradiation of the charged particle beam, and acquiring a first two-dimensional image showing a state of the surface of the sample; using a previously prepared reference image to detect a pattern similar to the reference image within the first two-dimensional image, and storing information on a position of the detected pattern as information on the position of the pattern to be inspected; moving a measurement position from the position of the detected pattern by a predetermined distance in a predetermined direction to focus the charged particle beam; moving the measurement position by the predetermined distance in a direction opposite to the predetermined direction to

Abstract: A charged particle beam apparatus includes: a charged particle source which generates a charged particle beam and which applies the charged particle beam to a specimen having a microstructure formed on a surface thereof; an objective lens which excites at least one of an electric field and a magnetic field to converge the charged particle beam onto the specimen; a deflector which scans the specimen with the charged particle beam; a detector which detects at least one of a secondary charged particle, a reflection charged particle and a back scattering charged particle generated from the specimen by the application of the charged particle beam and which outputs a detection signal; a focusing area arranging unit which arranges a plurality of focusing areas including edge points of the microstructure therein in a surface area of the specimen; deflection controller which controls the deflector so that the focusing areas are sequentially scanned to correspond to excitation conditions while changing stepwise the exc

Abstract: A pattern observation apparatus includes: a defect position information input unit which downloads defect position information for a pattern, the defect position information having been detected by an external inspection apparatus with regard to a specimen in which the pattern is formed; a moving unit which moves the specimen so as to bring a place detected as defective by the inspection apparatus into a field of view on the basis of the defect position information; a charged particle source which generates a charged particle beam and applies the charged particle beam to the specimen; a signal processing unit which detects at least one of secondary charged particles, reflected charged particles and back scattering charged particles emitted from the specimen due to the application of the charged particle beam and which outputs data on an inspection image of a specimen surface in the defective place; an inspection unit which re-detects an abnormality of the place detected as defective, on the basis of the inspe

Abstract: A pattern measuring method includes preparing a substrate comprising a pattern, extracting a place to be measured on the substrate based on a simulation using pattern data relating to the pattern as input data, generating measurement information for measuring a physical quantity of the place to be measured by a measuring apparatus, and measuring the place to be measured based on the measurement information by the measuring apparatus.

Abstract: Analog image data a SEM are converted into digital data, and are processed by a spatial filtering processing, histogram processing, threshold value setting, three-valued image data processing, noise reduction and the like. Area of a pattern in the three-valued image data is calculated by a labelling and calculation processing, and a pattern is sequentially detected by comparing the area of the pattern with a reference area value. The comparison and detection of the same or similar patterns repeated in the SEM image are performed by using the area of the pattern, and are not performed by a shape of the pattern, thereby resulting a precise detection at high speed by using a microprocessor. Since it is possible to perform a pattern recognition from the area value even though the pattern does not have a characteristic, it is possible to precisely detect and recognize a pattern image in high speed.

Abstract: Analog image data a SEM are converted into digital data, and are processed by a spatial filtering processing, histogram processing, threshold value setting, three-valued image data processing, noise reduction and the like. Area of a pattern in the three-valued image data is calculated by a labelling and calculation processing, and a pattern is sequentially detected by comparing the area of the pattern with a reference area value. The comparison and detection of the same or similar patterns repeated in the SEM image are performed by using the area of the pattern, and are not performed by a shape of the pattern, thereby resulting a precise detection at high speed by using a microprocessor. Since it is possible to perform a pattern recognition from the area value even though the pattern does not have a characteristic, it is possible to precisely detect and recognize a pattern image in high speed.

Abstract: An electron microscope comprises: a electron optical column 5 for allowing an electron beam aligned and focused by a lens 2, 3, 4 to pass therethrough; a specimen chamber 8 for receiving therein a sample 7 which is irradiated with the electron beam passing through the electron optical column; and a separating thin film 6, mounted so as to close an opening of the electron optical column on the side of the specimen chamber, for separating the electron optical column from the specimen chamber in a vacuum level.