Patents by Inventor Hiroshi Mukaigawa

Hiroshi Mukaigawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Publication number: 20040017501
    Abstract: An electronic device comprises a substrate mounting an electronic component, a shielding case molded with conductive resin and connected to the substrate, and a conductive coating formed on the surface of the shielding case. Since the shielding case is molded from the conductive resin, it is possible to mold the case into any shapes and provide smaller and lighter cases than the metal ones.
    Type: Application
    Filed: April 22, 2003
    Publication date: January 29, 2004
    Inventors: Jun Asaga, Hiroshi Mukaigawa, Kazuaki Hashimoto, Tomoyuki Sasaki, Akio Shimane