Patents by Inventor Hiroshi Naka
Hiroshi Naka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7275453Abstract: A simple and convenient analyzing apparatus is provided which easily, conveniently, and efficiently collects a material in the state of fine particles adhered to a target object, extracts the object to be analyzed, and analyzes the extracted object. An apparatus for detecting fine particles in a gas which sucks the gas under measurement from the target object by using a suction pump, extracts the fine particles contained in the gas under measurement, and performs measurement by using a spectrometer is embodied such that an inertial impactor for collecting the fine particles having diameters not less than a specified particle diameter is disposed upstream of the spectrometer, the fine particles are collected in the fine particle collector of the inertial impactor, the collector containing the collected fine particles is heated such that the collected fine particles are vaporized into a gas, and the vaporized fluid to be examined is supplied to the spectrometer to be measured thereby.Type: GrantFiled: February 6, 2004Date of Patent: October 2, 2007Assignee: Hitachi, Ltd.Inventors: Masanori Ishikawa, Naoya Sasaki, Katsumi Nagumo, Shigenori Morishima, Hiroshi Naka
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Patent number: 7052189Abstract: The present invention provides an optical electronic device which includes a package casing made of plastic, a plurality of metal-made leads which extend between the inside and the outside of the package casing and form electrode terminals at external portions thereof, a lead base which is arranged in an inner bottom of the package and is integrally formed with at least one or the plurality of leads, a support substrate which is fixed onto the lead base and includes a conductive layer of a given pattern on an upper surface thereof, an optical element which is fixed onto the support substrate, an optical fiber which extends between the inside and the outside of the package casing and has an inner end thereof to face the optical element to perform transmission and reception of light between the optical fiber and the optical element, one or a plurality of electronic parts fixed to the leads in the inside of the package casing, and conductive wires which electrically connect electrodes of the optical element, eleType: GrantFiled: November 15, 2002Date of Patent: May 30, 2006Assignee: Renesas Technology CorporationInventors: Hiroshi Naka, Masaaki Tsuchiya, Shigeo Yamashita
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Publication number: 20050058575Abstract: A simple and convenient analyzing apparatus is provided which easily, conveniently, and efficiently collects a material in the state of fine particles adhered to a target object, extracts the object to be analyzed, and analyzes the extracted object. An apparatus for detecting fine particles in a gas which sucks the gas under measurement from the target object by using a suction pump, extracts the fine particles contained in the gas under measurement, and performs measurement by using a spectrometer is embodied such that an inertial impactor for collecting the fine particles having diameters not less than a specified particle diameter is disposed upstream of the spectrometer, the fine particles are collected in the fine particle collector of the inertial impactor, the collector containing the collected fine particles is heated such that the collected fine particles are vaporized into a gas, and the vaporized fluid to be examined is supplied to the spectrometer to be measured thereby.Type: ApplicationFiled: February 6, 2004Publication date: March 17, 2005Applicant: Hitachi, Ltd.Inventors: Masanori Ishikawa, Naoya Sasaki, Katsumi Nagumo, Shigenori Morishima, Hiroshi Naka
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Patent number: 6721511Abstract: An optical communication equipment includes a semiconductor laser element, an image-forming element, an optical fiber and a substrate for mounting the semiconductor laser element, the image-forming element and the optical fiber. An optical output of the semiconductor laser element is adapted to be provided to the optical fiber via the image-forming element. The image-forming element is mounted in a V-groove formed in the substrate and having a substantially “V”-shaped cross-section. A shortest distance between a light spot of the semiconductor laser element and an optical axis of the image-forming element is 1 mm at most and the image-forming element substantially satisfies the sine condition.Type: GrantFiled: August 30, 1999Date of Patent: April 13, 2004Assignee: Hitachi, Ltd.Inventors: Kimio Tatsuno, Koji Yoshida, Kazuyuki Fukuda, Hiroshi Naka, Satoru Kikuchi
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Patent number: 6668140Abstract: In a module for optical communication comprising an optical fiber including an axial-end surface, and an optical element including an optical surface facing to the axial-end surface in such a manner that a light is transmitted between the optical surface and the axial-end surface, a synthetic resin is arranged between the optical surface and the axial-end surface so that the light is transmitted through the synthetic resin between the optical surface and the axial-end surface.Type: GrantFiled: December 6, 2001Date of Patent: December 23, 2003Assignee: Hitachi, Ltd.Inventors: Kimio Tatsuno, Kouji Yoshida, Takeshi Kato, Toshinori Hirataka, Norihiro Yazaki, Shoichi Takahashi, Hiroshi Naka
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Publication number: 20030113076Abstract: The present invention provides an optical electronic device which includes a package casing made of plastic, a plurality of metal-made leads which extend between the inside and the outside of the package casing and form electrode terminals at external portions thereof, a lead base which is arranged in an inner bottom of the package and is integrally formed with at least one or the plurality of leads, a support substrate which is fixed onto the lead base and includes a conductive layer of a given pattern on an upper surface thereof, an optical element which is fixed onto the support substrate, an optical fiber which extends between the inside and the outside of the package casing and has an inner end thereof to face the optical element to perform transmission and reception of light between the optical fiber and the optical element, one or a plurality of electronic parts fixed to the leads in the inside of the package casing, and conductive wires which electrically connect electrodes of the optical element, eleType: ApplicationFiled: November 15, 2002Publication date: June 19, 2003Applicant: Hitachi, Ltd.Inventors: Hiroshi Naka, Masaaki Tsuchiya, Shigeo Yamashita
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Patent number: 6490497Abstract: A working process end point real time determination method by which a working process end point can be determined accurately without an error even if a working process measurement signal has such a great variation that; the variation cannot be removed fully from and still remains in resulting smoothed data is disclosed. In the method, a working process end point is estimated by extrapolation from the variation of the average gradient of the averaged data in a predetermined period of the working process measurement signal to perform determination of the end point.Type: GrantFiled: January 21, 2000Date of Patent: December 3, 2002Assignee: NEC CorporationInventors: Hideo Mitsuhashi, Katsuhisa Okawa, Hiroshi Naka
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Patent number: 6476379Abstract: It is a subject to realize an optoelectronic device for reliably monitoring a laser optical beam intensity by a photodetector. In the optoelectric device, a semiconductor laser chip, an optical fiber for taking a front laser beam of the semiconductor laser chip from the top end surface and a photodetector for receiving a rear laser beam of the semiconductor laser chip are fixed on a main surface of a platform, and each of the optical parts and portions including. an optical channels between each of the optical parts are covered with a silicone gel, wherein a portion of the main surface of the platform between the top end of the optical fiber and the semiconductor laser chip and between the photodetector and the semiconductor laser chip has concaves so that voids are not formed upon curing of the silicone gel. The edge of the concave on the side of the semiconductor laser chip is situated closer to the semiconductor laser chip than to the emitting facet of the semiconductor laser chip.Type: GrantFiled: January 19, 2001Date of Patent: November 5, 2002Assignee: Hitachi, Ltd.Inventors: Kazunori Ando, Shoichi Takahashi, Hiroshi Naka
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Patent number: 6461059Abstract: A photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.Type: GrantFiled: March 8, 2001Date of Patent: October 8, 2002Assignee: Hitachi, Ltd.Inventors: Kazunori Ando, Shoichi Takahashi, Hiroshi Naka
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Patent number: 6443632Abstract: A photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.Type: GrantFiled: March 19, 2001Date of Patent: September 3, 2002Assignee: Hitachi, Ltd.Inventors: Kazunori Ando, Shoichi Takahashi, Hiroshi Naka
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Publication number: 20020044323Abstract: In a module for optical communication comprising an optical fiber including an axial-end surface, and an optical element including an optical surface facing to the axial-end surface in such a manner that a light is transmitted between the optical surface and the axial-end surface,Type: ApplicationFiled: December 6, 2001Publication date: April 18, 2002Applicant: Hitachi, Ltd.Inventors: Kimio Tatsuno, Kouji Yoshida, Takeshi Kato, Toshinori Hirataka, Norihiro Yazaki, Shoichi Takahashi, Hiroshi Naka
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Patent number: 6371664Abstract: There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.Type: GrantFiled: May 25, 2001Date of Patent: April 16, 2002Assignee: Hitachi, Ltd.Inventors: Shoichi Takahashi, Hiroshi Naka, Toshimasa Miura, Shuji Eguchi
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Patent number: 6341027Abstract: A module for optical communication includes an optical fiber having an axial-end surface and an optical element having an optical surface facing the axial-end surface in such a manner that light is transmitted between the optical surface and the axial-end surface. The optical surface defines a first plane that is not perpendicular to the longitudinal axis of the optical fiber. A synthetic resin is provided between the optical surface of the optical element and the axial-end surface of the optical fiber so that light is transmitted through the synthetic resin.Type: GrantFiled: March 10, 1998Date of Patent: January 22, 2002Assignee: Hitachi, Ltd.Inventors: Kimio Tatsuno, Kouji Yoshida, Takeshi Kato, Toshinori Hirataka, Norihiro Yazaki, Shoichi Takahashi, Hiroshi Naka
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Publication number: 20010036676Abstract: A semiconductor wafer polishing endpoint detection system and a method therefor can detect a polishing endpoint accurately. A first polishing endpoint detecting means compares the value of the first averaged gradient data and the first endpoint judgment threshold value for making judgment of end of polishing of wafer when the value of the first averaged gradient data is greater than or equal to the first endpoint judgment threshold value continuously for a predetermined number of times, when the value of the first averaged gradient data is greater than or equal to the first endpoint judgment threshold value for a number of times greater than or equal to a given number of times in total after the absolute value of the first averaged gradient data becomes greater than or equal to a given value, or when a ratio that the value of the first averaged gradient data becomes greater than or equal to the first endpoint judgment threshold value is greater than or equal to a predetermined ratio.Type: ApplicationFiled: April 23, 2001Publication date: November 1, 2001Applicant: NEC CORPORATIONInventors: Hideo Mitsuhashi, Shinji Yamagata, Hiroshi Naka, Katsuhisa Ookawa
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Publication number: 20010026665Abstract: A photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.Type: ApplicationFiled: March 8, 2001Publication date: October 4, 2001Inventors: Kazunori Ando, Shoichi Takahashi, Hiroshi Naka
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Publication number: 20010025650Abstract: A photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.Type: ApplicationFiled: March 19, 2001Publication date: October 4, 2001Inventors: Kazunori Ando, Shoichi Takahashi, Hiroshi Naka
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Publication number: 20010024549Abstract: There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.Type: ApplicationFiled: May 25, 2001Publication date: September 27, 2001Applicant: Hitachi, Ltd.Inventors: Shoichi Takahashi, Hiroshi Naka, Toshimasa Miura, Shuji Eguchi
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Publication number: 20010023920Abstract: It is a subject to realize an optoelectronic device for reliably monitoring a laser optical beam intensity by a photodetector. In the optoelectric device, a semiconductor laser chip, an optical fiber for taking a front laser beam of the semiconductor laser chip from the top end surface and a photodetector for receiving a rear laser beam of the semiconductor laser chip are fixed on a main surface of a platform, and each of the optical parts and portions including an optical channels between each of the optical parts are covered with a silicone gel, wherein a portion of the main surface of the platform between the top end of the optical fiber and the semiconductor laser chip and between the photodetector and the semiconductor laser chip has concaves so that voids are not formed upon curing of the silicone gel. The edge of the concave on the side of the semiconductor laser chip is situated closer to the semiconductor laser chip than to the emitting facet of the semiconductor laser chip.Type: ApplicationFiled: January 19, 2001Publication date: September 27, 2001Inventors: Kazunori Ando, Scoichi Takahashi, Hiroshi Naka
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Patent number: 6282350Abstract: There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.Type: GrantFiled: August 24, 1999Date of Patent: August 28, 2001Assignee: Hitachi, Ltd.Inventors: Shoichi Takahashi, Hiroshi Naka, Toshimasa Miura, Shuji Eguchi
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Patent number: 5761580Abstract: A photoreceptor drum driving mechanism includes a drum drive gear provided at a leading end of a drive shaft, which is in mesh with an internal gear mounted to a photoreceptor drum and a roller coaxially formed with the drive shaft. The mechanism further includes a circular arc surface in contact with the roller in a deflecting direction of the drive shaft. As a result, the drive shaft of the drum drive gear can be prevented from being deformed in a pressure angle direction of the drum drive gear. As this eliminates irregularities in rotations of the photoreceptor drum, a distortion of an image in an image forming process or in a transferring process can be prevented.Type: GrantFiled: September 26, 1996Date of Patent: June 2, 1998Assignee: Sharp Kabushiki KaishaInventors: Yoshikazu Harada, Yasuji Nakahama, Toshio Yamanaka, Hiroshi Naka