Patents by Inventor Hiroshi Nakaboh

Hiroshi Nakaboh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for inspecting defects of thin material film
    Patent number: 4599241
    Abstract: A thin material film for the manufacture of a semiconductor device is inspected in the presence of pinholes therein. This is achieved by forming a reactive material film which can gasify through a chemical reaction with a reactive solution on the surface of a semiconductor substrate and thin material film to be tested which can chemically resist the reactive solution is formed on the surface of the reactive material film, whereby the structure obtained by the above steps is immersed into the reactive solution.
    Type: Grant
    Filed: December 18, 1984
    Date of Patent: July 8, 1986
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Hiroshi Nakaboh, Ken Ogura
  • Process for forming heat-resistant resin films of polyimide and organosilicic reactants
    Patent number: 4528216
    Abstract: A process for forming heat resistant resin films comprising the steps of admixing a polyimide resin precursor solution, for example, a solution containing a reactant obtained from pyrromellitic dianhydride, 3,3',4,4'-benzophenyltetracarboxylic acid dianhydride, 4,4'-diaminodiphenyl ether, and 4,4'-diaminodiphenyl ether-3-carbonic amide with an organosilicic compound solution, coating a silicon substrate with the resulting admixture, and subjecting said coated silicon substrate to heat treatment.
    Type: Grant
    Filed: February 17, 1984
    Date of Patent: July 9, 1985
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Ken Ogura, Hiroshi Nakaboh