Patents by Inventor Hiroshi Nakano

Hiroshi Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190355714
    Abstract: In a protective circuit of a conventional electronic device, surge resistance is low and it is difficult to connect an external connection terminal of an integrated circuit directly to an external connection terminal of the electronic device or the like.
    Type: Application
    Filed: December 20, 2017
    Publication date: November 21, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Masahiro MATSUMOTO, Hiroshi NAKANO, Yoshimitsu YANAGAWA, Akira KOTABE
  • Patent number: 10444031
    Abstract: Provided is a sensor device wherein malfunction due to a negative surge is suppressed. This sensor device is provided with: a sensor element wherein electrical characteristics change corresponding to physical quantities; a signal processing circuit that processes output signals of the sensor element; a first transistor element that supplies currents to the sensor element and the signal processing circuit; a control circuit that controls a base current of the first transistor element; a power supply terminal; and a ground terminal. The sensor device is characterized in that the control circuit is provided with a limiting section that limits a current flowing from the ground terminal toward a base terminal of the first transistor element.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: October 15, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yoshimitsu Yanagawa, Masahiro Matsumoto, Satoshi Asano, Hiroshi Nakano, Akira Kotabe
  • Publication number: 20190310212
    Abstract: It is an object of the present invention to provide a thermal humidity measuring device that has a configuration including a first heating element and a second heating element and that is capable of obtaining a plurality of measurement values (measured values) including humidity measured by the first heating element, by effectively utilizing each of the heating elements. A thermal humidity measuring device 1 includes a first bridge circuit 2 that includes a first heating element 4 that senses humidity, and a second bridge circuit 3 that includes a second heating element 10 that heats air around the first heating element 4. In the thermal humidity measuring device 1, a first output signal Va5 is extracted from the first bridge circuit 2, and the humidity is sensed. A second output signal Va15 is extracted from the second bridge circuit 3, and the second output signal Va15 includes information relating to at least any one of pressure, an air flow rate, and air temperature.
    Type: Application
    Filed: July 4, 2017
    Publication date: October 10, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Ryo ANDO, Hiroshi ONUKI, Hiroshi NAKANO, Takeo HOSOKAWA, Masayuki HIO, Shigenobu KOMATSU
  • Publication number: 20190291989
    Abstract: A sheet conveyor includes a drive roller, a retard roller forming a nip with the drive roller, a first torque limiter disposed coaxially with the retard roller and communicating with the retard roller, a first gear disposed coaxially with the retard roller, a drive train including a plurality of gears for receiving a driving force from the first gear, a second torque limiter, and an arm member including a contact portion located downstream of the drive roller in the conveyance direction. The arm member is movable between a first arm position to allow transmission of the driving force to the second torque limiter and a second arm position to interrupt transmission of the driving force to the second torque limiter.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 26, 2019
    Inventors: Hiroshi Nakano, Takashi Arakawa
  • Patent number: 10352747
    Abstract: The purpose of the present invention is to provide a thermal flow-rate sensor that is capable of self-diagnosis. Provided is a thermal flow-rate sensor provided with a semiconductor element that detects a flow rate and that is equipped with electrode pads for electrical conduction with the outside, wherein at least two of the electrode pads are provided, and other electrode pads proximate to the electrode pads are arranged and have an electric potential beyond the scope of output to be used at the time of flow rate detection.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: July 16, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryosuke Doi, Yasuo Onose, Masahiro Matsumoto, Hiroshi Nakano
  • Publication number: 20190204251
    Abstract: A sensor device includes a detection resistor having a resistance value changing according to a physical quantity and a reference resistor compared with the detection resistor, the reference resistor is configured by electrically connecting a first resistance circuit and a second resistance circuit. The first resistance circuit includes a first and a second resistive element having positive and negative resistance temperature coefficients, respectively, which are electrically connected. The second resistance circuit includes a third and a fourth resistive elements having a positive and a negative resistance temperature coefficient, respectively, which are electrically connected. The first resistance circuit is configured to generate a first deviation to either the positive or negative side with respect to a temperature change, and the second resistance circuit is configured to generate a second deviation to the side opposite to the positive or negative side where the first deviation is generated.
    Type: Application
    Filed: July 4, 2017
    Publication date: July 4, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hiroshi NAKANO, Masahiro MATSUMOTO, Yasuo ONOSE, Hiroaki HOSHIKA
  • Publication number: 20190178694
    Abstract: A thermal airflow sensor includes a sensor element, a bonding wire, a resin, and a protective film. The sensor element has a thin-wall portion. The thin-wall portion has a heating resistor. The bonding wire is electrically connected to the sensor element. The resin covers the bonding wire. The protective film is formed on a surface of the sensor element so that the heating resistor is exposed. The protective film has at least a slit between the resin and the thin-wall portion.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 13, 2019
    Inventors: Ryosuke Doi, Hiroshi Nakano, Keiji Hanzawa
  • Patent number: 10310525
    Abstract: Provided is an electronic device which can easily measure a standby current of an internal circuit of an electronic device after burn-in. The electronic device includes: a power source terminal; a regulator that generates a predetermined voltage from a voltage of the power source terminal; an internal circuit that is operated by an output voltage of the regulator; and a standby terminal through which the regulator and the internal circuit are set to a low power consumption state.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: June 4, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masahiro Matsumoto, Hiroshi Nakano, Yoshimitsu Yanagawa, Akira Kotabe
  • Patent number: 10240957
    Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: March 26, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryosuke Doi, Hiroshi Nakano, Keiji Hanzawa
  • Publication number: 20180376368
    Abstract: In a communication device and a communication method, multiple pieces of QoS control information are stored in a routing information base, each piece of QoS control information, with a terminal wired to the communication device itself as a transmission source, defining a bandwidth control value and a priority degree that correspond to communication data specified by a combination of the transmission source and a destination. When communication data is inputted, a control unit selects QoS control information that matches a combination of the transmission source and the destination of the inputted communication data from among the stored multiple pieces of QoS control information and indicates a bandwidth to a bandwidth control unit on the basis of the selected QoS control information, indicates a priority degree to a DSCP marking unit, and performs wireless transmission.
    Type: Application
    Filed: November 11, 2016
    Publication date: December 27, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: TOMOYA SHOJI, HIROSHI NAKANO, NOBUYUKI UCHIKAWA
  • Publication number: 20180354435
    Abstract: In a sensor device 1 according to the present invention, power is supplied from a control device 10 to a power supply terminal 7 and a ground terminal 9 of the sensor device 1 via a power supply line Vcc and a ground line Gnd, respectively, and a sensor output voltage is sent from a sensor output terminal 8 to the control device 10 via a sensor output line Vout. The control device 10 has disposed therein a constant voltage source 11 that supplies a constant voltage to the sensor device 1, and a pull-up resistor 12 connected between the sensor output line Vout and the constant voltage source 11.
    Type: Application
    Filed: July 27, 2016
    Publication date: December 13, 2018
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Masahiro MATSUMOTO, Hiroshi NAKANO, Yoshimitsu YANAGAWA
  • Publication number: 20180328872
    Abstract: The purpose of the present invention is to provide a gas sensor device with which highly accurate measurement performance can be achieved even if there are changes in the environmental temperature. The present invention is provided with: a detection heater (3) formed in a thin film part; a temperature compensation heater (4) formed so as to surround the detection heater; a detection heater heating control circuit for controlling the heating temperature of the detection heater (3); and a temperature compensation heater heating control circuit for controlling the heating temperature of the temperature compensation heater to a heating temperature lower than the heating temperature of the detection heater.
    Type: Application
    Filed: October 26, 2016
    Publication date: November 15, 2018
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroshi NAKANO, Masahiro MATSUMOTO, Yasuo ONOSE
  • Publication number: 20180304829
    Abstract: Even when a positive/negative surge is applied to a power-supply line, occurrence of malfunction in a semiconductor device is lessened. In an in-vehicle semiconductor device, regulators convert an externally-supplied voltage to generate voltages. A voltage monitoring unit includes a voltage monitoring circuit and a switch, and monitors first to third voltages. An internal circuit has a processor operated by the voltage, and an oscillator operated by the voltage and generating a clock signal to be provided the processor. The voltage monitoring unit stops providing the clock signal to the processor when the voltage level of at least any one of the first to third voltages is below a set value. The voltage monitoring unit provides the clock signal to the processor when the voltage levels of all the first to third voltages exceed the set value.
    Type: Application
    Filed: September 13, 2016
    Publication date: October 25, 2018
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Yoshimitsu YANAGAWA, Masahiro MATSUMOTO, Hiroshi NAKANO, Akira KOTABE
  • Publication number: 20180299309
    Abstract: In using a fast Fourier transform for correction of a pulsation error in a conventional air flow rate measuring device, the correction is delayed due to the observation time and computation time required for the fast Fourier transform, leading to difficulty in following changes in the pulsation state at high speed. The air flow rate measuring device according to the present invention comprises an air flow rate detector that generates an output signal in accordance with an air flow rate being measured, an amplitude detector that detects a pulsation amplitude from the output signal, a low-pass filter in which the cut-off frequency changes in accordance with the value of the pulsation amplitude, and a waveform arithmetic unit that computes the waveforms of the output signal from the low-pass filter and the output signal. The waveform arithmetic unit is constituted from multipliers, an adder, and a condition determination process.
    Type: Application
    Filed: October 17, 2016
    Publication date: October 18, 2018
    Inventors: Masahiro MATSUMOTO, Hiroshi NAKANO, Yoshimitsu YANAGAWA, Akira KOTABE
  • Patent number: 10101286
    Abstract: A gas sensor includes a first heating element and a second heating element that is formed around the periphery of the first heating element and has a wider forming area than the first heating element. A gas amount is measured by heating the first heating element to a predetermined temperature, in which the second heating element is heated when the gas sensor is activated, and the first heating element is heated to the predetermined temperature after a heat value of the first heating element is restricted for a predetermined period of time.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: October 16, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroshi Nakano, Masahiro Matsumoto, Satoshi Asano, Yasuo Onose
  • Patent number: 10096590
    Abstract: In conventional sensor devices, it has been difficult to achieve both EMC resistance and ESD resistance, which are required at the output terminals of an automobile sensor device. A sensor device 1 of the present embodiment comprises: a power supply terminal 2 that supplies power; a ground terminal 3; a sensor element 4, the electrical characteristics of which change in accordance with a physical quantity; a signal processing integrated circuit 5 that processes an output signal output from the sensor element 4; and an output terminal that outputs the output signal processed by the signal processing integrated circuit 5.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: October 9, 2018
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Masahiro Matsumoto, Hiroshi Nakano, Yoshimitsu Yanagawa, Akira Kotabe
  • Publication number: 20180264782
    Abstract: An object of the present invention is to provide a product excellent in corrosion resistance and abrasion resistance. In order to achieve the above object, a laminated body according to the invention includes a substrate and a coating formed on the surface of the substrate, in which the coating includes repeated unit structures each composed of a first layer whose main component is Ni and a second layer whose main component is a metal whose electrode potential is baser than that of Ni.
    Type: Application
    Filed: April 22, 2016
    Publication date: September 20, 2018
    Applicant: HITACHI, LTD.
    Inventors: Hiroshi KANEMOTO, Katsumi MABUCHI, Hiroshi NAKANO
  • Publication number: 20180266862
    Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.
    Type: Application
    Filed: May 14, 2018
    Publication date: September 20, 2018
    Inventors: Ryosuke DOI, Hiroshi NAKANO, Keiji HANZAWA
  • Patent number: 10031462
    Abstract: An image forming apparatus including a belt wound around a plurality of rollers, and a restriction portion disposed outside a specific roller of the plurality of rollers in a rotational axis direction of the specific roller, the restriction portion being configured to restrict movement of the belt in the rotational axis direction by contacting an end surface of the belt in the rotational axis direction, the belt having a first outer circumferential surface of an end portion of the belt in the rotational axis direction, the end portion including the end surface contactable with the restriction portion, and a second outer circumferential surface of a middle portion of the belt in the rotational axis direction, the first outer circumferential surface being positioned outside the second outer circumferential surface in a radial direction of the specific roller, the first outer circumferential surface being parallel to the second outer circumferential surface.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: July 24, 2018
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Kotaro Takifuji, Hiroshi Nakano
  • Patent number: 10024828
    Abstract: An adsorbent which enables solid phase extraction of water-soluble molecules with high efficiency and excellent selectivity and an analysis system using the adsorbent, the adsorbent containing a structure represented by the formula I wherein R is a carrier component, the moiety other than R is a side-chain functional group, R and the benzene ring in the side-chain functional group are bonded directly or bonded through one or more atoms, R? is selected from the group consisting of hydroxy group, alkoxy group, amino group, alkylamino group, thiol group and alkyl sulfide group, R? is independently selected from the group consisting of hydroxy group, alkoxy group, alkyl group, amino group, alkylamino group, dialkylamino group, trialkylamino group, thiol group, alkyl sulfide group and hydrogen atom, x is an integer of zero or more and three or less, and n is the number of the side-chain functional groups contained in the carrier component.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: July 17, 2018
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Jun Nunoshige, Shinya Ito, Hiroshi Nakano