Abstract: A bow hair material for a bow hair of a bow of a bowed string instrument. The bow hair material includes threads constructed from poly phenylene sulfide resin. The bow material may be formed into a hair bundle that includes a plurality of threads that are substantially parallel with each other. A mounting portion may be formed by welding an end portion of the hair bundle that mounts the hair bundle on a frog or stick of the bow.

Abstract: A bow hair material for a bow hair of a bow of a bowed string instrument. The bow hair material includes threads constructed from poly phenylene sulfide resin. The bow material may be formed into a hair bundle that includes a plurality of threads that are substantially parallel with each other. A mounting portion may be formed by welding an end portion of the hair bundle that mounts the hair bundle on a frog or stick of the bow.

Abstract: A manufacturing method for a board for a stringed instrument that is used as a top plate or a back plate of an acoustic stringed instrument such as a violin, where the board has a purfling, includes forming, for instance, a groove with a depth that is 20% or more and less than 60% of a thickness of the board for a stringed instrument, filling the groove with a resin in which, for instance, colored particles having a diameter of 3 ?m or more and less than 70 ?m are dispersed and which has a degree of elongation of 20% or more, removing the resin that has flowed out of the groove, and curing the resin.

Abstract: An acoustic string instrument includes a top plate, a back plate, and a body disposed between the top plate and the back plate. The body has a plurality of first positioning portions. At least one of the top plate or the back plate, or both has a plurality of second positioning portions. The first positioning portions are fixed to the second positioning portions corresponding to the first positioning portions.

Abstract: An acoustic string instrument includes a top plate, a back plate, and a body disposed between the top plate and the back plate. The body has a plurality of first positioning portions. At least one of the top plate or the back plate, or both has a plurality of second positioning portions. The first positioning portions are fixed to the second positioning portions corresponding to the first positioning portions.

Abstract: A manufacturing method for a board for a stringed instrument that is used as a top plate or a back plate of an acoustic stringed instrument such as a violin, where the board has a purfling, includes forming, for instance, a groove with a depth that is 20% or more and less than 60% of a thickness of the board for a stringed instrument, filling the groove with a resin in which, for instance, colored particles having a diameter of 3 ?m or more and less than 70 ?m are dispersed and which has a degree of elongation of 20% or more, removing the resin that has flowed out of the groove, and curing the resin.

Abstract: A board for a stringed instrument which forms a front plate or a back plate of a stringed instrument, includes: a laminated plate that is obtained by laminating a plurality of veneers having a uniform thickness by an adhesive, at least one of the veneers having a different planar shape than the other veneers, in which the laminated plate is curved to be convex toward one surface side and has a thin portion and a thick portion.

Abstract: A board for a stringed instrument which forms a front plate or a back plate of a stringed instrument, includes: a veneer that includes a concave portion for partially reducing the thickness of the veneer, in which the veneer is curved to be convex toward one surface side. In this board for a stringed instrument, fiber of the veneer may extend along the curved shape of the veneer.

Abstract: A board for a stringed instrument which forms a front plate or a back plate of a stringed instrument, includes: a veneer that includes a concave portion for partially reducing the thickness of the veneer, in which the veneer is curved to be convex toward one surface side. In this board for a stringed instrument, fiber of the veneer may extend along the curved shape of the veneer.

Abstract: A board for a stringed instrument which forms a front plate or a back plate of a stringed instrument, includes: a laminated plate that is obtained by laminating a plurality of veneers having a uniform thickness by an adhesive, at least one of the veneers having a different planar shape than the other veneers, in which the laminated plate is curved to be convex toward one surface side and has a thin portion and a thick portion.

Abstract: A stick of a string instrument bow includes a base material having an arched-rod shaped carbon fiber resin layer made of carbon fiber resin and a glass fiber resin layer which covers the outer surface of the carbon fiber resin layer and is made of glass fiber resin, and the glass fiber resin layer has a non-adhesion portion formed of an air layer present within the glass fiber resin layer and an adhesion portion which does not include the air layer.

Abstract: A stick of a string instrument bow includes a base material having an arched-rod shaped carbon fiber resin layer made of carbon fiber resin and a glass fiber resin layer which covers the outer surface of the carbon fiber resin layer and is made of glass fiber resin, and the glass fiber resin layer has a non-adhesion portion formed of an air layer present within the glass fiber resin layer and an adhesion portion which does not include the air layer.

Abstract: After a wiring material layer (14) which is made of WSi2 or the like is formed on an insulation film covering a semiconductor substrate (10), a first antireflection coating film (16) which is made of TiON or TiN and a second antireflection coating film (18) which is made of an organic material are sequentially formed on the wiring material layer (14). Resist patterns (20a to 20c) are formed on the second antireflection coating film (18) by photolithography. The dry etching of the second antireflection coating film (18) is performed using the resist patterns (20a to 20c) as masks, after which the dry etching of the first antireflection coating film (16) is conducted using the resist patterns (20a to 20c) and patterns (18a to 18c) of the second antireflection coating film (18) as masks.

Abstract: An electric violin has a combination of two sorts of vibration detectors for transverse vibration components and vertical vibration components, a low-pass filter connected to the vibration detector for the transverse vibration components and a high-pass filter connected to the vibration detector for the vertical vibration components, piezoelectric transducers connected in parallel to a signal processing system, or vibration detectors connected to filter circuits different in frequency characteristics for producing right-channel and left-channel signals so that the electric violin generate electric tones close to acoustic violin tones.

Abstract: An electric violin has a combination of two sorts of vibration detectors for transverse vibration components and vertical vibration components, a low-pass filter connected to the vibration detector for the transverse vibration components and a high-pass filter connected to the vibration detector for the vertical vibration components, piezoelectric transducers connected in parallel to a signal processing system, or vibration detectors connected to filter circuits different in frequency characteristics for producing right-channel and left-channel signals so that the electric violin generate electric tones close to acoustic violin tones.

Abstract: After a wiring material layer (14) which is made of WSi2 or the like is formed on an insulation film covering a semiconductor substrate (10), a first antireflection coating film (16) which is made of TiON or TiN and a second antireflection coating film (18) which is made of an organic material are sequentially formed on the wiring material layer (14). Resist patterns (20a to 20c) are formed on the second antireflection coating film (18) by photolithography. The dry etching of the second antireflection coating film (18) is performed using the resist patterns (20a to 20c) as masks, after which the dry etching of the first antireflection coating film (16) is conducted using the resist patterns (20a to 20c) and patterns (18a to 18c) of the second antireflection coating film (18) as masks.

Abstract: After a wiring material layer (14) which is made of WSi2 or the like is formed on an insulation film covering a semiconductor substrate (10), a first antireflection coating film (18) which is made of TiON or TiN and a second antireflection coating film (18) which is made of an organic material are sequentially formed on the wiring material layer (14). Resist patterns (20a to 20c) are formed on the second antireflection coating film (18) by photolithography. The dry etching of the second antireflection coating film (18) is performed using the resist patterns (20a to 20c) as masks, after which the dry etching of the first antireflection coating film (16) is conducted using the resist patterns (20a to 20c) and patterns (18a to 18c) of the second antireflection coating film (18) as masks.