Patents by Inventor Hiroshi Nitta

Hiroshi Nitta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11919300
    Abstract: An inkjet printing apparatus adopting short pulse heating is designed to output a uniform image without unevenness. To this end, in a serial inkjet printing apparatus, a print head is subjected to a short pulse heating treatment before each print scan is carried out. In a case where a print medium is a first print medium, the print head is heated to a first target temperature before carrying out each of the print scans. In a case where the print medium is a second print medium, the print head is heated to a second target temperature lower than the first target temperature before carrying out each of the print scans.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: March 5, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroshi Kawafuji, Kazuhiko Sato, Kazuo Suzuki, Takeshi Murase, Hiroshi Taira, Tomoki Yamamuro, Sae Mogi, Masaki Nitta
  • Patent number: 11383905
    Abstract: A binding band includes a band portion, a through opening, a locking portion, a connecting portion, and an index portion. The band portion includes a plurality of locking teeth on one surface of the band portion. The band portion is to be inserted through the through opening. The through opening is disposed on one end of the band portion in a longitudinal direction of the band portion. The locking portion includes a tooth pawl configured to lock the locking teeth when the band portion is inserted through the through opening. The connecting portion protrudes from the locking portion in a direction intersecting the longitudinal direction of the band portion. The index portion is disposed on the connecting portion.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: July 12, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yoshiteru Hagiwara, Hiroshi Nitta, Tomoo Asami, Tetsuya Yano, Toshiharu Kawase, Kohhei Nagasawa
  • Publication number: 20200331676
    Abstract: A binding band includes a band portion, a through opening, a locking portion, a connecting portion, and an index portion. The band portion includes a plurality of locking teeth on one surface of the band portion. The band portion is to be inserted through the through opening. The through opening is disposed on one end of the band portion in a longitudinal direction of the band portion. The locking portion includes a tooth pawl configured to lock the locking teeth when the band portion is inserted through the through opening. The connecting portion protrudes from the locking portion in a direction intersecting the longitudinal direction of the band portion. The index portion is disposed on the connecting portion.
    Type: Application
    Filed: April 8, 2020
    Publication date: October 22, 2020
    Applicant: Ricoh Company, Ltd.
    Inventors: Yoshiteru HAGIWARA, Hiroshi NITTA, Tomoo ASAMI, Tetsuya YANO, Toshiharu KAWASE, Kohhei NAGASAWA
  • Patent number: 8062548
    Abstract: An object of one embodiment of the present invention is to provide a polishing slurry which can reduce dishing and erosion of a to-be-polished semiconductor wafer. The polishing slurry contains an oxidizing agent and two or more kinds of abrasive grains for polishing, i.e., fumed silica and colloidal silica. A ratio (selectivity ratio) between a polishing rate of a metal film such as a tungsten film and a polishing rate of an insulating film (oxide film) such as a SiO2 film can be adjusted by changing a mixing ratio between fumed silica and colloidal silica, and dishing and erosion of the semiconductor wafer can be thus reduced.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: November 22, 2011
    Assignee: Nitta Haas Incorporated
    Inventors: Yoshiharu Ohta, Rika Tanaka, Hiroshi Nitta, Yoshitaka Morioka
  • Publication number: 20100207058
    Abstract: At least one embodiment of the invention provides a polishing composition that can achieve high polishing rate and as well can improve flatness. The polishing composition of at least one embodiment of the invention is a polishing composition suitable for a metal film, particularly a copper (Cu) film, and contains a basic compound containing an ammonium group, alkyl naphthalene sulfonate and hydrogen peroxide, the remainder being water. The pH of the polishing composition is within a range of 8 to 12. By containing those, a polishing composition that can achieve high polishing rate and improve flatness can be realized.
    Type: Application
    Filed: August 25, 2008
    Publication date: August 19, 2010
    Inventors: Yoshiyuki Matsumura, Hiroshi Nitta
  • Publication number: 20100207057
    Abstract: An object of one embodiment of the present invention is to provide a polishing composition which suppresses generation of recessing and dishing and includes a higher polishing rate. The polishing composition of an embodiment of the invention is a polishing composition suitable for a metal film, particularly a copper (CU) film, and contains ammonia, hydrogen peroxide, an amino acid and an anionic surfactant, the remainder being water. By containing those, the polishing composition can suppress generation of recessing and dishing when particularly used in the second step polishing.
    Type: Application
    Filed: August 25, 2008
    Publication date: August 19, 2010
    Inventors: Hiroshi Nitta, Yoshiyuki Matsumura
  • Patent number: 7767426
    Abstract: A method of producing riboflavin by culturing riboflavin-producing microbes in a culture medium using a plant oil or an animal oil as a carbon source, forming and accumulating riboflavin therein and collecting riboflavin therefrom, wherein a carrier of a clay mineral having oil-adsorbing property, a chemically treated product thereof or a calcium compound is made present in the culture medium. The riboflavin is produced maintaining a high yield and at an increased production rate at a low cost without requiring cumbersome operations for concentrating and recovering the riboflavin. It is further allowed to recover the riboflavin by effectively utilizing the waste plant oil or the waste animal oil that is to be disposed of.
    Type: Grant
    Filed: February 18, 2003
    Date of Patent: August 3, 2010
    Assignee: Mizusawa Industrial Chemicals, Ltd.
    Inventors: Kiyoshi Abe, Hiroshi Nitta, Enoch Y. Park, Hua Ming, Eun He Jung
  • Publication number: 20100155655
    Abstract: An object of one embodiment of the present invention is to provide a polishing composition that can achieve high polishing rate and as well can improve flatness. A polishing composition of an embodiment of the invention is a polishing composition suitable for a metal film, in particular, a copper film, and contains a basic compound containing an ammonium group, alkylbenzene sulfonate having an alkyl group with carbon number of from 9 to 18, and hydrogen peroxide, the remainder being water. Ammonium hydroxide can be used as the basic compound, and dodecylbenzene sulfonate or the like can be used as the alykbenzene sulfonate.
    Type: Application
    Filed: July 24, 2008
    Publication date: June 24, 2010
    Inventors: Yoshiyuki Matsumura, Hiroshi Nitta
  • Publication number: 20090278080
    Abstract: An object of one embodiment of the present invention is to provide a polishing slurry which can reduce dishing and erosion of a to-be-polished semiconductor wafer. The polishing slurry contains an oxidizing agent and two or more kinds of abrasive grains for polishing, i.e., fumed silica and colloidal silica. A ratio (selectivity ratio) between a polishing rate of a metal film such as a tungsten film and a polishing rate of an insulating film (oxide film) such as a SiO2 film can be adjusted by changing a mixing ratio between fumed silica and colloidal silica, and dishing and erosion of the semiconductor wafer can be thus reduced.
    Type: Application
    Filed: January 5, 2006
    Publication date: November 12, 2009
    Inventors: Yoshiharu Ohta, Rika Tanaka, Hiroshi Nitta, Yoshitaka Morioka
  • Publication number: 20050244919
    Abstract: A method of producing riboflavin by culturing riboflavin-producing microbes in a culture ground using a plant oil or an animal oil as a carbon source, forming and accumulating riboflavin therein and collecting riboflavin therefrom, wherein a carrier of a clay mineral having oil-adsorbing property, a chemically treated product thereof or a calcium compound is made present in the culture ground. The riboflavin is produced maintaining a high yield and at an increased production rate at a low cost without requiring cumbersome operations for concentrating and recovering the riboflavin. It is further allowed to recover the riboflavin by effectively utilizing the waste plant oil or the waste animal oil that is to be disposed of.
    Type: Application
    Filed: February 18, 2003
    Publication date: November 3, 2005
    Inventors: Kiyoshi Abe, Hiroshi Nitta, Enoch Park, Hua Ming, Eun Jung
  • Publication number: 20050084941
    Abstract: A method of producing bio-fuels by causing an enzyme to act on the oils and fats in a waste clay to decompose them into a fatty acid which is then reacted with a lower alcohol to form an ester that can be used as a bio-fuel. An environment friendly bio-fuel is obtained from the starting waste clay through a decreased number of steps without requiring cumbersome operations.
    Type: Application
    Filed: February 28, 2003
    Publication date: April 21, 2005
    Inventors: Kiyoshi Abe, Hiroshi Nitta, Y. Enoch, Ana Vanessa lara Pizarro
  • Patent number: 6581817
    Abstract: A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: June 24, 2003
    Assignee: Nidec Tosok Corporation
    Inventors: Yoshiyuki Kawashima, Hiroshi Nitta, Masanori Izumi
  • Publication number: 20030006013
    Abstract: A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.
    Type: Application
    Filed: January 23, 2002
    Publication date: January 9, 2003
    Inventors: Yoshiyuki Kawashima, Hiroshi Nitta, Masanori Izumi
  • Publication number: 20030005320
    Abstract: An electronic security information management method and recording medium using an IC card to prevent data leaks by a dishonest third party who is carrying, a secret data recorded on an information processing apparatus, such as a computer, integrated circuit card, floppy disk, or other recording medium to the outside of an organization. The electronic security information management method and recording medium can deter the use of the data copied to a recording medium by the dishonest third party and will also record and allow for later inspection the processes used for copying the data to the recording medium.
    Type: Application
    Filed: March 29, 2002
    Publication date: January 2, 2003
    Applicant: Fujitsu Limited
    Inventors: Shinji Matsune, Shouzou Fukuya, Hiroshi Nitta
  • Publication number: 20020046112
    Abstract: An employee information apparatus, including a first electronic data structure that stores employee information including at least one of employee name, employee company, employee number and employee password, a second electronic data structure that stores advertising information from a first source, a third electronic data structure that stores employee detailed wage information including at least one of employee number, employee company, employee name, payment amounts, deduction amounts and date of payment from a second source and an image generator that receives an inquiry from an employee and generates a detailed wage image that includes advertising information, employee information and employee detailed wage information.
    Type: Application
    Filed: August 2, 2001
    Publication date: April 18, 2002
    Applicant: Fujitsu Limited
    Inventors: Hiroshi Nitta, Mayumi Nagatani, Fumie Oka
  • Patent number: 5530901
    Abstract: A data transmission processing system provided between a host unit and peripheral devices including at least a memory device and a processing device. The host unit outputs, to the transmission processing system, DMA transmission process request commands.
    Type: Grant
    Filed: November 24, 1992
    Date of Patent: June 25, 1996
    Assignee: Ricoh Company, Ltd.
    Inventor: Hiroshi Nitta
  • Patent number: D526936
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: August 22, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takashi Maruyama, Hiroshi Nitta
  • Patent number: D670206
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: November 6, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Hiroshi Nitta, Xiumin Shi
  • Patent number: D877661
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: March 10, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takashi Shigihara, Hiroshi Nitta, Takashi Takizawa
  • Patent number: D885991
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: June 2, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takashi Shigihara, Hiroshi Nitta, Takashi Takizawa