Abstract: A thermal transfer apparatus includes a controller to control a transfer tool and a pressing body conveyor. The controller controls the pressing body conveyor to press a predetermined region of a transfer object, and controls the transfer tool and the pressing body conveyor to press at least a portion of thermal transfer foil placed on the predetermined region pressed by the transfer tool and a light absorption film having a light absorption property and placed on the thermal transfer foil and to apply light to the light absorption film.

Abstract: A thermal transfer apparatus includes a controller to control a transfer tool and a pressing body conveyor. The controller controls the pressing body conveyor to press a predetermined region of a transfer object, and controls the transfer tool and the pressing body conveyor to press at least a portion of thermal transfer foil placed on the predetermined region pressed by the transfer tool and a light absorption film having a light absorption property and placed on the thermal transfer foil and to apply light to the light absorption film.

Abstract: Provided is a coating film that can more reliably exhibit an excellent water repellency and an excellent oil repellency. This water- and oil-repellent coating film is a coating film formed on a surface of a material in order to impart water repellency and oil repellency, wherein (1) the coating film contains a metal oxide-containing composite particle; (2) the composite particle contains a) a metal oxide particle and b) a covering layer that contains a polyfluoroalkyl methacrylate resin and is formed on the surface of the metal oxide particle; and (3) a value obtained by dividing the fluorine content (weight %) of the composite particle by a surface area (m2/g) of the metal oxide particle is 0.025 to 0.180.

Abstract: A road structure, an asphalt layer of which is peeled off by electromagnetic induction heating, includes a non-thermoplastic base layer, an asphalt layer located above the base layer, a conductive sheet between the base layer and the asphalt layer, a first bonding layer that bonds the conductive sheet and the base layer; and a second bonding layer that bonds the conductive sheet and the asphalt layer. The conductive sheet is configured to generate heat based on electromagnetic induction. At least the first bonding layer is a thermoplastic bonding layer configured to be softened by the heat.

Abstract: A road structure, an asphalt layer of which is peeled off by electromagnetic induction heating, includes a non-thermoplastic base layer, an asphalt layer located above the base layer, a conductive sheet between the base layer and the asphalt layer, a first bonding layer that bonds the conductive sheet and the base layer; and a second bonding layer that bonds the conductive sheet and the asphalt layer. The conductive sheet is configured to generate heat based on electromagnetic induction. At least the first bonding layer is a thermoplastic bonding layer configured to be softened by the heat.

Abstract: A sensor device includes a power line and a semiconductor device. The semiconductor device includes an inductor. The inductor is formed using an interconnect layer (to be described later using FIG. 3). The power line and the semiconductor device overlap each other when viewed from a direction perpendicular to the semiconductor device. The semiconductor device includes two inductors. The power line extends between the two inductors when viewed from a direction perpendicular to the semiconductor device.

Abstract: A sensor device includes a power line and a semiconductor device. The semiconductor device includes an inductor. The inductor is formed using an interconnect layer (to be described later using FIG. 3). The power line and the semiconductor device overlap each other when viewed from a direction perpendicular to the semiconductor device. The semiconductor device includes two inductors. The power line extends between the two inductors when viewed from a direction perpendicular to the semiconductor device.

Abstract: A sensor device includes a power line and a semiconductor device. The semiconductor device includes an inductor. The inductor is formed using an interconnect layer (to be described later using FIG. 3). The power line and the semiconductor device overlap each other when viewed from a direction perpendicular to the semiconductor device. The semiconductor device includes two inductors. The power line extends between the two inductors when viewed from a direction perpendicular to the semiconductor device.

Abstract: A sensor device includes a printed circuit board, a power line, a first semiconductor device, and a second semiconductor device. The first semiconductor device includes a first inductor, and the second semiconductor device includes a second inductor. Each inductor is formed using an interconnect layer. The power line extends between the two inductors without overlapping the first and second inductor, when viewed from a direction perpendicular to a main surface of the printed circuit board.

Abstract: Provided is a coating film that can more reliably exhibit an excellent water repellency and an excellent oil repellency. This water- and oil-repellent coating film is a coating film formed on a surface of a material in order to impart water repellency and oil repellency, wherein (1) the coating film contains a metal oxide-containing composite particle; (2) the composite particle contains a) a metal oxide particle and b) a covering layer that contains a polyfluoroalkyl methacrylate resin and is formed on the surface of the metal oxide particle; and (3) a value obtained by dividing the fluorine content (weight %) of the composite particle by a surface area (m2/g) of the metal oxide particle is 0.025 to 0.180.

Abstract: A sensor device includes a power line and a semiconductor device. The semiconductor device includes an inductor. The inductor is formed using an interconnect layer (to be described later using FIG. 3). The power line and the semiconductor device overlap each other when viewed from a direction perpendicular to the semiconductor device. The semiconductor device includes two inductors. The power line extends between the two inductors when viewed from a direction perpendicular to the semiconductor device.